characterised by the material or the construction of the capillary structure

Industry

CPC
F28D15/046

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Parent Industries

FMECHANICAL ENGINEERING LIGHTING HEATING WEAPONS BLASTING ENGINES OR PUMPS F28Heat exchange F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies

Current Industry

F28D15/046characterised by the material or the construction of the capillary structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat exchanger for tempering of a fluid
- Patent number 12,209,812
- Issue date Jan 28, 2025
- Promix Solutions AG
- Rolf Heusser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe
- Patent number 12,196,498
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 12,188,732
- Issue date Jan 7, 2025
- The Regents of the University of Colorado
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device and system
- Patent number 12,188,692
- Issue date Jan 7, 2025
- BLUEXTHERMAL, INC.
- Reza Monazami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Separate capillary vapor chamber structure for dual heat sources
- Patent number 12,173,969
- Issue date Dec 24, 2024
- TAIWAN MICROLOOPS CORP.
- Chun-Hung Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for forming liquid filled heat transfer device
- Patent number 12,163,739
- Issue date Dec 10, 2024
- Aavid Thermalloy, LLC
- John R. Cennamo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with composite wick structure
- Patent number 12,158,309
- Issue date Dec 3, 2024
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer element, method for forming the same and semiconducto...
- Patent number 12,111,114
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber
- Patent number 12,108,570
- Issue date Oct 1, 2024
- Furukawa Electric Co., Ltd.
- Yoshikatsu Inagaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and device for optimization of vapor transport in a thermal...
- Patent number 12,104,856
- Issue date Oct 1, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bionic sweat gland and bionic skin
- Patent number 12,090,648
- Issue date Sep 17, 2024
- Jiangsu University
- Si Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Boiling enhancement device
- Patent number 12,085,344
- Issue date Sep 10, 2024
- SMARTH TECHNOLOGY LTD.
- Chun Li
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber with multilayer wick
- Patent number 12,078,423
- Issue date Sep 3, 2024
- Furukawa Electric Co., Ltd.
- Yoshikatsu Inagaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber
- Patent number 12,072,152
- Issue date Aug 27, 2024
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Blank for a heat-transfer device and method to produce a heat-trans...
- Patent number 12,066,255
- Issue date Aug 20, 2024
- ABB Schweiz AG
- Bruno Agostini
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composite layers, methods for their manufacture and uses thereof
- Patent number 12,054,839
- Issue date Aug 6, 2024
- Cambridge Enterprise Limited
- Davor Copic
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe
- Patent number 12,050,063
- Issue date Jul 30, 2024
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber structure
- Patent number 12,025,382
- Issue date Jul 2, 2024
- Acer Incorporated
- Chun-Chieh Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
On-demand sweating-boosted air cooled heat-pipe condensers
- Patent number 12,018,894
- Issue date Jun 25, 2024
- University of South Carolina
- Chen Li
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Evaporator including a porous unit
- Patent number 12,018,893
- Issue date Jun 25, 2024
- ZUTA-CORE LTD.
- Nahshon Eadelson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Nucleation control system and method leading to enhanced boiling ba...
- Patent number 12,010,816
- Issue date Jun 11, 2024
- Michigan Technological University
- Amitabh Narain
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink
- Patent number 12,007,172
- Issue date Jun 11, 2024
- YI CHANG CO., LTD.
- Po-Shen Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber having a reservoir
- Patent number 12,007,173
- Issue date Jun 11, 2024
- Razer (Asia-Pacific) Pte Ltd
- ChengYu Cheng
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20250048594
- Publication date Feb 6, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE
- Publication number 20250003696
- Publication date Jan 2, 2025
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKI...
- Publication number 20250003694
- Publication date Jan 2, 2025
- NVIDIA Corporation
- Ron CHAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTA...
- Publication number 20250003695
- Publication date Jan 2, 2025
- Intel Corporation
- Juha Paavola
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADER WITH VAPOR CHAMBERS AND MANUFACTURING METHOD THEREOF
- Publication number 20240418451
- Publication date Dec 19, 2024
- Raytech Precision Technologies (Shuyang) Co., Ltd.
- Shengliang Dai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MESH WOVEN STRUCTURE WITH CAPILLARY ACTION
- Publication number 20240393057
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CAPILLARY WOVEN MESH STRUCTURE
- Publication number 20240393060
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Hsiu-Wei Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CAPILLARY MESH WOVEN STRUCTURE
- Publication number 20240393058
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MESH CAPILLARY WOVEN STRUCTURE
- Publication number 20240393059
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER
- Publication number 20240361082
- Publication date Oct 31, 2024
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER DEVICE
- Publication number 20240344773
- Publication date Oct 17, 2024
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MANUFACTURING METHOD OF HEAT PIPE STRUCTURE
- Publication number 20240344774
- Publication date Oct 17, 2024
- Delta Electronics, Inc.
- Shih-Lin Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermally Conductive Structure and Manufacturing Method Thereof, He...
- Publication number 20240318922
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Wenwen Yuan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER WITH MICROSTRUCTURE LAYER
- Publication number 20240318921
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Xiaobang LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Transfer Device for High Heat Flux Applications and Related Me...
- Publication number 20240310128
- Publication date Sep 19, 2024
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER SYSTEM
- Publication number 20240302108
- Publication date Sep 12, 2024
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED HEAT DISSIPATION MODULE STRUCTURE
- Publication number 20240298425
- Publication date Sep 5, 2024
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER
- Publication number 20240295366
- Publication date Sep 5, 2024
- Delta Electronics, Inc.
- Shih-Lin HUANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT PIPE HAVING A WICK BETWEEN CONCENTRIC INNER AND OUTER HOUSINGS...
- Publication number 20240274306
- Publication date Aug 15, 2024
- Westinghouse Electric Company LLC
- Abdul R. DULLOO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER SUPPLY CABLE AND CONNECTOR-EQUIPPED POWER SUPPLY CABLE
- Publication number 20240266088
- Publication date Aug 8, 2024
- FUJIKURA LTD.
- Randeep Singh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MANUFACTURING METHOD AND HEAT EXCHANGER
- Publication number 20240263889
- Publication date Aug 8, 2024
- PORITE CORPORATION
- Shigeyuki TANABE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADVANCED MANUFACTURING HEAT PIPE SEGMENT WITH INTEGRAL PRINTED WICK
- Publication number 20240263888
- Publication date Aug 8, 2024
- Westinghouse Electric Company LLC
- Jeffrey SHOUP
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT APPARATUS AND METHOD
- Publication number 20240255229
- Publication date Aug 1, 2024
- Kelvin Cooling, Inc.
- Zilong Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMALLY CONDUCTIVE PIPE, HEAT TREATMENT DEVICE, AND TREATMENT SYSTEM
- Publication number 20240255230
- Publication date Aug 1, 2024
- FUJIFILM Business Innovation Corp.
- Toshiyuki MIYATA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROFLUIDIC-BASED APPARATUS AND METHOD FOR VAPORIZATION OF LIQUIDS
- Publication number 20240246007
- Publication date Jul 25, 2024
- NUMERICAL DESIGN, INC.
- Carl D. Meinhart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTIPLE WICK SECTION HEATPIPE FOR EFFECTIVE HEAT TRANSFER
- Publication number 20240240874
- Publication date Jul 18, 2024
- Cisco Technology, Inc.
- Albert W. Chan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20240230241
- Publication date Jul 11, 2024
- AURAS Technology Co., Ltd.
- Yi-Le CHENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER AND METHOD OF PRODUCING THE SAME
- Publication number 20240210119
- Publication date Jun 27, 2024
- KMW Inc.
- Kang Hyun LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PASTE FOR PREPARING CAPILLARY STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20240207927
- Publication date Jun 27, 2024
- Raytech Precision Technologies (Shuyang) Co., Ltd.
- Guochuang Huang
- B22 - CASTING POWDER METALLURGY

characterised by the material or the construction of the capillary structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat exchanger for tempering of a fluid

Loop heat pipe

Single and multi-layer mesh structures for enhanced thermal transport

Thermal management device and system

Vapor chamber and manufacturing method of the same

Separate capillary vapor chamber structure for dual heat sources

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Method and apparatus for forming liquid filled heat transfer device

Heat dissipation device

Heat pipe with composite wick structure

Systems and methods for using additive manufacturing for thermal ma...

High performance two-phase cooling apparatus for portable applications

Vapor chamber and manufacturing method of the same

Heat transfer element, method for forming the same and semiconducto...

Vapor chamber

Method and device for optimization of vapor transport in a thermal...

Bionic sweat gland and bionic skin

Boiling enhancement device

Vapor chamber with multilayer wick

Vapor chamber

Blank for a heat-transfer device and method to produce a heat-trans...

Composite layers, methods for their manufacture and uses thereof

Loop heat pipe

Vapor chamber structure

On-demand sweating-boosted air cooled heat-pipe condensers

Evaporator including a porous unit

Nucleation control system and method leading to enhanced boiling ba...

Heat sink

Thermal management in integrated circuit packages

Vapor chamber having a reservoir

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKI...

VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTA...

HEAT SPREADER WITH VAPOR CHAMBERS AND MANUFACTURING METHOD THEREOF

MESH WOVEN STRUCTURE WITH CAPILLARY ACTION

CAPILLARY WOVEN MESH STRUCTURE

CAPILLARY MESH WOVEN STRUCTURE

MESH CAPILLARY WOVEN STRUCTURE

VAPOR CHAMBER

VAPOR CHAMBER DEVICE

MANUFACTURING METHOD OF HEAT PIPE STRUCTURE

Thermally Conductive Structure and Manufacturing Method Thereof, He...

VAPOR CHAMBER WITH MICROSTRUCTURE LAYER

Heat Transfer Device for High Heat Flux Applications and Related Me...

VAPOR CHAMBER SYSTEM

INTEGRATED HEAT DISSIPATION MODULE STRUCTURE

VAPOR CHAMBER

HEAT PIPE HAVING A WICK BETWEEN CONCENTRIC INNER AND OUTER HOUSINGS...

POWER SUPPLY CABLE AND CONNECTOR-EQUIPPED POWER SUPPLY CABLE

MANUFACTURING METHOD AND HEAT EXCHANGER

ADVANCED MANUFACTURING HEAT PIPE SEGMENT WITH INTEGRAL PRINTED WICK

THERMAL MANAGEMENT APPARATUS AND METHOD

THERMALLY CONDUCTIVE PIPE, HEAT TREATMENT DEVICE, AND TREATMENT SYSTEM

MICROFLUIDIC-BASED APPARATUS AND METHOD FOR VAPORIZATION OF LIQUIDS

MULTIPLE WICK SECTION HEATPIPE FOR EFFECTIVE HEAT TRANSFER

HEAT DISSIPATION DEVICE

VAPOR CHAMBER AND METHOD OF PRODUCING THE SAME

PASTE FOR PREPARING CAPILLARY STRUCTURE AND PREPARATION METHOD THEREOF