Claims
- 1. An epoxy group-containing silicone resin prepared by
- (A) reacting, in the presence of water and a basic catalyst,
- (I) at least one organopolysiloxane selected from the group consisting of
- (i) an organopolysiloxane consisting essentially of siloxane units with the general formula
- R.sup.4 SiO.sub.3/2,
- (ii) an organopolysiloxane consisting essentially of siloxane units with the general formula
- R.sup.5 R.sup.6 SiO.sub.2/2,
- (iii) an organopolysiloxane consisting essentially of siloxane units with the general formulas
- R.sup.4 SiO.sub.3/2 and R.sup.5 R.sup.6 SiO.sub.2/2
- and
- (iv) organopolysiloxane consisting essentially of siloxane units with the general formulas
- R.sup.4 SiO.sub.3/2, R.sup.5 R.sup.6 SiO.sub.2/2 and SiO.sub.4/2
- wherein R.sup.4, R.sup.5 and R.sup.6 are independently selected from monovalent hydrocarbon groups, with the proviso that said component (ii) is not used by itself as said organopolysiloxane (I) and (II) an epoxy-containing alkoxysilane with the general formula
- R.sup.7 R.sup.8.sub.d Si(OR.sup.9).sub.(3-d)
- or partial hydrolyzate thereof, wherein R.sup.7 and R.sup.8 is each selected from the group consisting of epoxy-containing organic groups and monovalent hydrocarbon groups, R.sup.9 represents an alkyl group and d is zero or 1 and said component (II) is added in a quantity such that the epoxy-containing organic groups in component (II) comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in components (I) and (II); and (B) subjecting the reaction product of step (A) to an equilibration reaction.
- 2. The silicone resin according to claim 1, wherein R.sup.9 is methyl.
- 3. The silicone resin according to claim 2, wherein said epoxy-containing organic group is selected from the group consisting of 2,3-epoxypropyl, 3,4-epoxybutyl, 4,5-epoxypentyl, 2-glycidoxyethyl, 3-glycidoxypropyl, 4-glycidoxybutyl, 2-(3,4-epoxycyclohexyl)ethyl, and 3-(3,4-epoxycyclohexyl)propyl.
- 4. The epoxy group-containing silicone resin according to claim 1, wherein at least 30 mole percent of the R.sup.4 groups are phenyl radicals.
- 5. The epoxy group-containing silicone resin according to claim 2, wherein at least 30 mole percent of the R.sup.4 groups are phenyl radicals.
- 6. The epoxy group-containing silicone resin according to claim 3, wherein at least 30 mole percent of the R.sup.4 groups are phenyl radicals.
Parent Case Info
This is a divisional of copending application Ser. No. 08/226,539, filed on Apr. 12, 1994.
US Referenced Citations (8)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0464706 |
Jan 1992 |
EPX |
0484119 |
May 1992 |
EPX |
136816 |
Jan 1981 |
JPX |
145942 |
Nov 1981 |
JPX |
53655 |
Jun 1983 |
JPX |
27095 |
Sep 1987 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 6, No. 24, Feb. 12, 1982 The Patent Office Japanese Government, p. 70 C 91; and JP-A-56 145 942 (Shinetsu). |
Divisions (1)
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Number |
Date |
Country |
Parent |
226539 |
Apr 1994 |
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