Claims
- 1. An epoxy resin comprising
- a) at least one nitrogen containing epoxy compound selected from the group consisting of tetraglycidylmethylene dianiline and tetraglycidyldiaminodiphenyl sulfone,
- b) at least one phosphorous compound of the formula ##STR2## wherein m is 0 or 1, n is 0, 1 or 2, 0 is 1, 2 or 3, with the proviso that m+n+o=3; p is 0, 1 or 2; X is a free electron pair or O or S bound by a double bond; R is selected from the group consisting of alkyl of 1 to 4 carbon atoms bound directly or through O or S, alkenyl of 2 to 3 carbon atoms, aryl, aralkyl, dialkylamino, alkylarylamino and 3-trialkylsilyl-propyl; R.sup.2 is selected from the group consisting of --O--, --S--, phenylene, dioxyphenylene, dioxynaphthylene, --(CH.sub.2).sub.r --, --O--(CH.sub.2).sub.r --, --O--(CH.sub.2).sub.r --O--, --O--(CH.sub.2).sub.r --(Si(CH.sub.3).sub.2 --O).sub.S --Si(CH.sub.3).sub.2 (CH.sub.2).sub.r --O-- where r is 1 to 3 and s is 1 to 8, --(O--CH.sub.2 --CH.sub.2).sub.t --O; --(O--CH(CH.sub.3)--CH.sub.2).sub.t -- and --(O(CH.sub.2).sub.4).sub.t --O-- where t is 2 to 100 and A.sup.1 and A.sup.2 are individually a single bond or a bridge of R.sup.1 wherein the weight ratio of a) to b) is 10:90 to 95:5, with the proviso that said phosphorus compound comprises no more than 10 percent by weight monoglycidyl component,
- c) at least one metallic complex compound of the formula
- ML.sub.x B.sub.y or M(SR).sub.x B.sub.z
- wherein M is a complex forming metal ion, L is a ligand, SR is an acid ion, B is a Lewis base, x is an integer of 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 to 8 in an amount of 0.1 to 20 parts by weight of the metallic complex compound per 100 parts by weight of a) and b) and
- d) optionally fillers or additives.
- 2. A circuit board supporting plate made of an epoxy resin of claim 1.
- 3. A prepreg made of an epoxy resin of claim 1.
Priority Claims (1)
Number |
Date |
Country |
Kind |
43 03 824.7 |
Feb 1993 |
DEX |
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PRIOR APPLICATION
This application is a continuation of U.S. patent application Ser. No. 08/193,702 filed Feb. 8, 1994, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
2951822 |
Reinking |
Sep 1960 |
|
5036135 |
Von Gentzkow et al. |
Jul 1991 |
|
5155198 |
Keohan |
Oct 1992 |
|
Foreign Referenced Citations (3)
Number |
Date |
Country |
0408990 |
Jul 1990 |
EPX |
0384939 |
Sep 1990 |
EPX |
9113925 |
Sep 1991 |
WOX |
Continuations (1)
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Number |
Date |
Country |
Parent |
193702 |
Feb 1994 |
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