containing additives

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CPC
H05K1/0373

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0373containing additives

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, film with resin, metal foil with resin, metal-cl...
- Patent number 12,344,738
- Issue date Jul 1, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kosuke Okuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, cured product, and printed wiring...
- Patent number 12,319,865
- Issue date Jun 3, 2025
- TAIYO HOLDINGS CO., LTD.
- Yoshikazu Daigo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Benzoxazine resin, composition thereof and copper clad laminate mad...
- Patent number 12,227,637
- Issue date Feb 18, 2025
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulating film, metal-clad laminate member, and rewiring layer
- Patent number 12,221,536
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Cheng Ping Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminate, electronic equipment and production method for laminate
- Patent number 12,187,012
- Issue date Jan 7, 2025
- JNC Corporation
- Takafumi Kuninobu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
High temperature, conductive thermosetting resin compositions
- Patent number 12,139,568
- Issue date Nov 12, 2024
- TCLAD INC.
- Stanley Shengqian Kong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, resin sheet, laminate, metal foil-clad...
- Patent number 12,134,696
- Issue date Nov 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Takaaki Ogashiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive resin composition, photosensitive resin film, printe...
- Patent number 12,103,999
- Issue date Oct 1, 2024
- Resonac Corporation
- Akihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate, resin sheet,...
- Patent number 12,091,542
- Issue date Sep 17, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Saori Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,049,577
- Issue date Jul 30, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED W...
- Publication number 20250236723
- Publication date Jul 24, 2025
- Resonac Corporation
- Yusuke SERA
- B32 - LAYERED PRODUCTS
Information Patent Application
METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...
- Publication number 20250230550
- Publication date Jul 17, 2025
- Kaneka Corporation
- Takashi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC AND METHOD FOR PRODUCING SAME
- Publication number 20250230289
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME
- Publication number 20250230298
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYNDIOTACTIC POLYSTYRENE LOW-DIELECTRIC SHEET MOULDING
- Publication number 20250220811
- Publication date Jul 3, 2025
- Toyobo Co., Ltd.
- Yuki MAEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...
- Publication number 20250206919
- Publication date Jun 26, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Tatsuro TAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...
- Publication number 20250188263
- Publication date Jun 12, 2025
- Resonac Corporation
- Naoyoshi SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20250188256
- Publication date Jun 12, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Syouichi ITOH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250188262
- Publication date Jun 12, 2025
- Elite Electronic Material (kunShan) Co., Ltd.
- Jun DU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...
- Publication number 20250163267
- Publication date May 22, 2025
- Masashi OJI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...
- Publication number 20250163222
- Publication date May 22, 2025
- SHENGYI TECHNOLOGY (SUZHOU) CO., LTD
- Xiangxiu CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250129245
- Publication date Apr 24, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Masafumi HONMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20250125239
- Publication date Apr 17, 2025
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPARTICLE-FILLED LAMINATE MATERIAL
- Publication number 20250126708
- Publication date Apr 17, 2025
- Dell Products L.P.
- Sandor T. FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...
- Publication number 20250109279
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUKI AITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF
- Publication number 20250101182
- Publication date Mar 27, 2025
- SOLVAY SPECIALTY POLYMERS USA, LLC
- Chad Powell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION
- Publication number 20250066609
- Publication date Feb 27, 2025
- Nan Ya Plastics Corporation
- Te-Chao Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE RESIN COMPOSITION
- Publication number 20250066651
- Publication date Feb 27, 2025
- TOYOBO MC Corporation
- Hiroyuki MIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250056718
- Publication date Feb 13, 2025
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...
- Publication number 20250043102
- Publication date Feb 6, 2025
- AGC Inc.
- Hiromichi KAMO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...
- Publication number 20250040043
- Publication date Jan 30, 2025
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...
- Publication number 20250034385
- Publication date Jan 30, 2025
- DAICEL CORPORATION
- Daisuke ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, AND WIRING...
- Publication number 20250026912
- Publication date Jan 23, 2025
- AGC Inc.
- Hiromichi KAMO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250011594
- Publication date Jan 9, 2025
- ELITE MATERIAL CO., LTD.
- Shu-Hao CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
- Publication number 20240431034
- Publication date Dec 26, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOMETRIC HYDROGEL COMPOSITIONS, FLEXIBLE THERMAL SENSORS COMPRI...
- Publication number 20240417518
- Publication date Dec 19, 2024
- Hong Kong Centre for Logistics Robotics Limited
- DONGYAN XU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

containing additives

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, film with resin, metal foil with resin, metal-cl...

Thermosetting resin composition, cured product, and printed wiring...

Wiring substrate

Dielectric substrate and method of forming the same

Cured product and production method of same, and resin sheet and re...

Benzoxazine resin, composition thereof and copper clad laminate mad...

Insulating film, metal-clad laminate member, and rewiring layer

Method for manufacturing dielectric sheet, method for manufacturing...

Laminate, electronic equipment and production method for laminate

Flexible wiring board

Wiring board

Copper-clad laminate and method of forming the same

Printed circuit board

Insulation structures and printed circuit board including the same

High temperature, conductive thermosetting resin compositions

Curable resin composition, adhesive agent, adhesive film, circuit s...

Method of manufacturing printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Resin composition, prepreg, resin sheet, laminate, metal foil-clad...

Thermosetting resin composition for semiconductor package, prepreg...

Resin multilayer substrate and method for manufacturing resin multi...

Photosensitive resin composition, photosensitive resin film, printe...

Circuit board

Thermosetting resin composite and metal clad laminate using the same

Resin composition, prepreg, metal foil-clad laminate, resin sheet,...

Dielectric substrate and method of forming the same

Multilayer circuit board manufacturing apparatus

Circuit structure

Prepreg, metal-clad laminate, and wiring board

Wiring substrate and method for manufacturing wiring substrate

Patents Applicationslast 30 patents

RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED W...

METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...

DIELECTRIC AND METHOD FOR PRODUCING SAME

COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME

SYNDIOTACTIC POLYSTYRENE LOW-DIELECTRIC SHEET MOULDING

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...

RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...

MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

MICROPARTICLE-FILLED LAMINATE MATERIAL

PRINTED WIRING BOARD

COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...

POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF

RESIN COMPOSITION

ADHESIVE RESIN COMPOSITION

PRINTED WIRING BOARD

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...

SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, AND WIRING...

SUBSTRATE FOR PRINTED WIRING BOARD

Component Carrier and Method for Manufacturing the Same Using a Des...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD

THERMOMETRIC HYDROGEL COMPOSITIONS, FLEXIBLE THERMAL SENSORS COMPRI...