containing additives

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CPC
H05K1/0373

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0373containing additives

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Benzoxazine resin, composition thereof and copper clad laminate mad...
- Patent number 12,227,637
- Issue date Feb 18, 2025
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulating film, metal-clad laminate member, and rewiring layer
- Patent number 12,221,536
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Cheng Ping Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminate, electronic equipment and production method for laminate
- Patent number 12,187,012
- Issue date Jan 7, 2025
- JNC Corporation
- Takafumi Kuninobu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature, conductive thermosetting resin compositions
- Patent number 12,139,568
- Issue date Nov 12, 2024
- TCLAD INC.
- Stanley Shengqian Kong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, resin sheet, laminate, metal foil-clad...
- Patent number 12,134,696
- Issue date Nov 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Takaaki Ogashiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive resin composition, photosensitive resin film, printe...
- Patent number 12,103,999
- Issue date Oct 1, 2024
- Resonac Corporation
- Akihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate, resin sheet,...
- Patent number 12,091,542
- Issue date Sep 17, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Saori Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,049,577
- Issue date Jul 30, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive element, resin composition for forming barrier layer...
- Patent number 11,960,208
- Issue date Apr 16, 2024
- Resonac Corporation
- Masakazu Kume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION
- Publication number 20250066609
- Publication date Feb 27, 2025
- Nan Ya Plastics Corporation
- Te-Chao Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE RESIN COMPOSITION
- Publication number 20250066651
- Publication date Feb 27, 2025
- TOYOBO MC Corporation
- Hiroyuki MIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250056718
- Publication date Feb 13, 2025
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...
- Publication number 20250043102
- Publication date Feb 6, 2025
- AGC Inc.
- Hiromichi KAMO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...
- Publication number 20250040043
- Publication date Jan 30, 2025
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...
- Publication number 20250034385
- Publication date Jan 30, 2025
- DAICEL CORPORATION
- Daisuke ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, AND WIRING...
- Publication number 20250026912
- Publication date Jan 23, 2025
- AGC Inc.
- Hiromichi KAMO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250011594
- Publication date Jan 9, 2025
- ELITE MATERIAL CO., LTD.
- Shu-Hao CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
- Publication number 20240431034
- Publication date Dec 26, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOMETRIC HYDROGEL COMPOSITIONS, FLEXIBLE THERMAL SENSORS COMPRI...
- Publication number 20240417518
- Publication date Dec 19, 2024
- Hong Kong Centre for Logistics Robotics Limited
- DONGYAN XU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20240409742
- Publication date Dec 12, 2024
- ELITE MATERIAL CO., LTD.
- Chun-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...
- Publication number 20240400855
- Publication date Dec 5, 2024
- TAIYO HOLDINGS CO., LTD.
- Satsuki OZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...
- Publication number 20240400728
- Publication date Dec 5, 2024
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240397622
- Publication date Nov 28, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED GLASS BUBBLES, COMPOSITES THEREFROM, AND METHODS OF MAKING T...
- Publication number 20240384069
- Publication date Nov 21, 2024
- Adam D. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
- Publication number 20240389227
- Publication date Nov 21, 2024
- JSR Corporation
- Ryouji TATARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
- Publication number 20240343027
- Publication date Oct 17, 2024
- LG ELECTRONICS INC.
- Takashi KINO
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
- Publication number 20240314927
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240306293
- Publication date Sep 12, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Andrew Edward PAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20240287347
- Publication date Aug 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292537
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

containing additives

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dielectric substrate and method of forming the same

Cured product and production method of same, and resin sheet and re...

Benzoxazine resin, composition thereof and copper clad laminate mad...

Insulating film, metal-clad laminate member, and rewiring layer

Method for manufacturing dielectric sheet, method for manufacturing...

Laminate, electronic equipment and production method for laminate

Flexible wiring board

Wiring board

Copper-clad laminate and method of forming the same

Insulation structures and printed circuit board including the same

Printed circuit board

High temperature, conductive thermosetting resin compositions

Curable resin composition, adhesive agent, adhesive film, circuit s...

Method of manufacturing printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Resin composition, prepreg, resin sheet, laminate, metal foil-clad...

Thermosetting resin composition for semiconductor package, prepreg...

Resin multilayer substrate and method for manufacturing resin multi...

Photosensitive resin composition, photosensitive resin film, printe...

Circuit board

Thermosetting resin composite and metal clad laminate using the same

Resin composition, prepreg, metal foil-clad laminate, resin sheet,...

Dielectric substrate and method of forming the same

Multilayer circuit board manufacturing apparatus

Circuit structure

Prepreg, metal-clad laminate, and wiring board

Wiring substrate and method for manufacturing wiring substrate

Wiring board

Photosensitive element, resin composition for forming barrier layer...

Substrate for high-frequency printed wiring board

Patents Applicationslast 30 patents

RESIN COMPOSITION

ADHESIVE RESIN COMPOSITION

PRINTED WIRING BOARD

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...

SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, AND WIRING...

SUBSTRATE FOR PRINTED WIRING BOARD

Component Carrier and Method for Manufacturing the Same Using a Des...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD

THERMOMETRIC HYDROGEL COMPOSITIONS, FLEXIBLE THERMAL SENSORS COMPRI...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...

POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

COATED GLASS BUBBLES, COMPOSITES THEREFROM, AND METHODS OF MAKING T...

RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...

WIRING SUBSTRATE

WIRING SUBSTRATE

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

PRINTED WIRING BOARD