The present invention relates to an ESD protective device having a low capacitance and stability and a preparing process thereof, more particularly to an ESD protective device having a low capacitance and stability and a simplified preparing process thereof, as compared to conventional ones, by using a voltage sensitive material which surmounts difficulty in forming the voltage sensitive material that has been used in production of an ESD protective device.
As shown at
As shown at
This is due to the reason that the non linear resistance layer functions as the key of a voltage sensitive material.
However, there has been a drawback that it is difficult to control the process during the calcination process.
Namely, there has been a drawback that an ESD protective characteristic is changed or do not operate in case where they face severe condition when thickness and components of a non linear resistance layer are changed by change of calcination process.
ZnO—based ceramic materials have a considerable defect in its permittivity so that it is beyond its capacity to employ it since an ESD protective device can not generally meet super low capacitance of 0.5 pF or lower when it is applied to high signal line.
To solve the problem, the construction shown at
Additionally, there is a drawback that there is a limitation in selection of a voltage sensitive material since a matching property (thermal expansion, chemical reaction) between a dielectric layer and a voltage sensitive material (320) should be considered.
Therefore, the present invention has been proposed by considering the problem in the prior art. The object of the present invention is to make it easy to embody a characteristic and simultaneously embody a characteristic of ESD parts stably by providing a voltage sensitive material which utilizes property of particles itself but not property of grain boundary when preparing a voltage sensitive material being used in production of an ESD protective device different from ZnO based semiconductive ceramic materials utilizing property of grain boundary like prior art when preparing a voltage sensitive material.
The other object of the present invention is to provide an excellent property which does not distort a signal wave pattern when using as an ESD protective device of high signal line such as USB2.0, HDMI and the like by enabling to embody low capacitance of 0.5 pF or lower with providing a low permittivity.
To solve the objects, an ESD protective device capable of embodying a low capacitance and stability characteristics according to one embodiment of the present invention is constructed by installing a voltage sensitive material between electrodes, the device being characterized in that the voltage sensitive material is a fluorescent substance.
According to the other aspect, the preparing process of an ESD protective device enabling to embody a low capacitance and stability characteristics is characterized in that it comprises;
an electrode printing process which screen-prints an electrode on a substrate;
a pasting process which produces a voltage sensitive material in paste form; and
a paste printing process which screen-prints the paste of voltage sensitive material.
As above-illustrated, an ESD protective device capable of embodying a low capacitance and stability characteristics and a preparing process thereof according to the present invention make it possible to embody a characteristic easily and embody a characteristic of ESD parts stably since a voltage sensitive material utilizes property of particles itself but not property of grain boundary when preparing a voltage sensitive material being used in production of an ESD protective device different from ZnO based semiconductive ceramic materials utilizing property of grain boundary like prior art when preparing a voltage sensitive material, and provide an excellent property which does not distort a signal wave pattern when using as an ESD protective device of high signal line such as USB2.0, HDMI and the like since its permittivity is low so that it enables to embody low capacitance of 0.5 pF or lower.
To solve the object, an ESD protective device having a low capacitance and stability characteristics according to one embodiment of the present invention is constructed by installing a voltage sensitive material between electrodes, the device being characterized in that the voltage sensitive material is a fluorescent substance.
According to one embodiment, the voltage sensitive material is barium aluminate oxide.
According to one embodiment, the voltage sensitive material is sulfide such as ZnS.
According to one embodiment, the voltage sensitive material is doped with a metal atom such as Mn, Cu and Eu.
According to one embodiment, the thickness of the voltage sensitive material is 3˜100 μm.
On the other hand, the preparing process of an ESD protective device capable of embodying a low capacitance and stability characteristics according to the present invention is characterized in that it comprises;
an electrode printing process which screen-prints an electrode on a substrate;
a pasting process which produces a voltage sensitive material in paste form; and
a paste printing process which screen-prints the paste of voltage sensitive material.
According to one embodiment, a binder is added at the pasting process and the binder is glass.
According to one embodiment, the binder is epoxy.
According to one embodiment, the mixing ratio (by weight) at the pasting process is a voltage sensitive material powder:binder:vehicle=1:0.3:1.
The present invention will now be illustrated by the following non-limiting examples for an ESD protective device having a low capacitance and stability characteristics and a preparing process thereof.
As illustrated at
At this time, an ESD protective device according to the present invention is produced by heat treatment at 850° C. after each of the formations in the above order with a screen-printing method.
More particularly, an electrode and a voltage sensitive material are produced in a paste form and then used according to a conventional method. At the process for preparing a paste, it is heat-treated and baked at 500˜900° C. when using a glass as a binder (examples 1˜4), and it is cured at 80˜250° C. when using ethyl cellulose or epoxy as a binder (example 5).
The binder can be properly selected in such a manner that it meets easiness in preparing process or non-use of a particular harmful atom such as Pb, Cd and the like (ROHS).
The present invention will be further illustrated by the following examples.
To produce a voltage sensitive material, BaCO3 and Al2O3 are weighed to be 1:1 of molar ratio, and mixed together with ethyl alcohol as a solvent with a wet-process for 24 hours, and then calcined at 1350° C. for 2 hours to synthesize to form BaAl2O4. The obtained BaAl2O4 is wet-pulverized in the same way to be about 3.0 μm of D50 and dried to obtain a powder for a voltage sensitive material.
Thereafter, a glass of Zn-Bi series as a binder and a vehicle produced by melting ethyl cellulose into BCA are used to produce a voltage sensitive material paste.
The mixing ratio (by weight) at production of the paste is as follows:
voltage sensitive material powder:binder:vehicle=1:0.3:1.
Then, an ESD protective device is obtained by forming a conductive electrode (110), a voltage sensitive material (120), a conductive electrode (140), and a protective layer (150) on a substrate (100) in the described order using a screen-printing method and by heat-treating at 850° C.
By following the same procedure as in the example 1, except that a green fluorescent substance for a conventional PDP is used as BaAl10O19:Mn and D50 is about 3.0 μm, an ESD protective device is produced.
By following the same procedure as in the example 1, except that a green fluorescent substance for a conventional PDP is used as Zn2SiO4:Mn and D50 is about 3.0 μm, an ESD protective device is produced.
By following the same procedure as in the example 1, except that a green fluorescent substance for a conventional inorganic EL(electro-luminescence) is used as ZnS:Cu and D50 is about 3.0 μm, an ESD protective device is produced.
By following the same procedure as in the example 4, except that epoxy is used as a binder at a process for preparing a paste, and the temperature of heat treatment is 200° C. , an ESD protective device is produced.
Thereafter, IEC61000-4-2 pulse (peak voltage 8KV, peak current 30 A) according to IEC prescription is applied to an electrode (110 or 140) of parts to measure an ESD protective property of the parts.
As shown at
Also, it can be confirmed that a property of capacitance is realized to a low capacitance of 0.5 pF or lower (being measured at 1 MHz) at all cases of the examples 1˜5.
With the above described construction and operating principle, the present invention makes it possible to embody a characteristic easily and embody a characteristic of ESD parts stably since a voltage sensitive material utilizes property of particles itself but not property of grain boundary when preparing a voltage sensitive material being used in production of an ESD protective device different from ZnO based semiconductive ceramic materials utilizing property of grain boundary like the prior art when preparing a voltage sensitive material, and provide an excellent property which does not distort a signal wave pattern when using as an ESD protective device of high signal line such as USB2.0, HDMI and the like since its permittivity is low so that it enables to embody low capacitance of 0.5 pF or lower.
It should be understood that various modifications of the invention in addition to those described herein will become apparent to those skilled in the art from the foregoing description and the accompanying figures. Therefore, the invention is in no way limited to the preferred embodiments, which have been given solely by way of illustration and without implying a limitation.
The scope of the present invention is not to be limited by the specific embodiments described herein but the appended claims. Indeed, it should be understood that various modifications derived from a concept equivalent to claims are intended to fall within the scope of the appended claims.
The present invention, an ESD protective device having a low capacitance and stability characteristics and a preparing process thereof makes it possible to embody a characteristic easily and embody a characteristic of ESD parts stably, and provide an excellent property which does not distort a signal wave pattern when using as an ESD protective device of high signal line such as USB2.0, HDMI and the like since its permittivity is low so that it enables to embody low capacitance of 0.5 pF or lower. Therefore, it may be useful for the field of an ESD protective device.
Number | Date | Country | Kind |
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10-2008-0034808 | Apr 2008 | KR | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/KR2008/004998 | 8/26/2008 | WO | 00 | 10/15/2010 |