The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
An embodiment of an evaporation of the invention, as shown in
The chamber 100 is a sealed space, evacuated to desired pressure by a vacuum pump (not shown). The emission source 200 is disposed on the bottom of the chamber 100. Evaporation material is disposed in the emission source 200. The evaporation material can be organic, such as small molecules and polymers, or inorganic, such as metal, ceramic, or semiconductor. A heater (not shown) is disposed in the emission source 200. Free molecules or vapor of the evaporation material are emitted from the emission source 200 into the chamber 100 by generated heat. When a substrate S is disposed in an appropriate position, such as directly above the emission source 200, the evaporation material deposit on the substrate S to form a layer of predetermined thickness, providing desired interface characteristics.
When the substrate S is transported into the chamber 100, masks M1 and, M2 cover the emission source 200 until the substrate S reaches a predetermined position, protecting substrate S from contamination by the evaporation material.
The robot 300 transporting the substrate S into the chamber 100 comprises a base 301, arms 302 and 303 and a fork 304. The base 301 is fixed. The arms 302 and 303 are slidably joined to the base 301, extendable toward the chamber 100. The fork 304 is U-shaped. The robot 300 transports, rolls, or aligns the substrate S. The mask 400 is disposed on the fork 304. The substrate S, accommodated in a frame F, is disposed in the mask 400. The frame F can be omitted.
Referring to
The mask 400 on the robot 300 protects the substrate S from contamination and improper deposition when the substrate S is transported. This enhances thickness uniformity and precision for the deposition layer, and stabilizing interface characteristics.
The transport system 250 can be applied to when a deposition surface of a substrate faces an emission source, such as during manufacture of flat panel displays (FPD), including LCD, OLED, PDP, FED and SED etc.
The transport system of the invention can also be applied to physical vapor deposition (PVD) processes , such as sputtering, thermal evaporation etc., and chemical vapor deposition (CVD) processes, such as PECVD, VUVCVD, MOCVD, ALCVD, LPCVD and thermal chemical deposition etc.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 095124460 | Jul 2006 | TW | national |