Membership
Tour
Register
Log in
characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Follow
Industry
CPC
H01L21/67346
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/67346
characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Substrate container with enhanced flow field therein
Patent number
12,183,608
Issue date
Dec 31, 2024
Gudeng Precision Industrial Co., Ltd.
Ming-Chien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer carrier with reticle template for marking reticle fields on a...
Patent number
12,183,609
Issue date
Dec 31, 2024
Micron Technology, Inc.
Gabe Glass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density semiconductor storage system
Patent number
12,176,228
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Rong Syuan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automated transfer of edge ring requiring rotational alignment
Patent number
12,142,466
Issue date
Nov 12, 2024
Lam Research Corporation
Damon Tyrone Genetti
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
Patent number
12,119,296
Issue date
Oct 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer supporting mechanism and method for wafer dicing
Patent number
12,112,965
Issue date
Oct 8, 2024
Advanced Semiconductor Engineering, Inc.
Bo Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
Patent number
12,106,988
Issue date
Oct 1, 2024
Daewon Semiconductor Packaging Industrial Company
Sunna Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing apparatus
Patent number
12,094,742
Issue date
Sep 17, 2024
Disco Corporation
Yoshinobu Saito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Magazine supporting equipment and semiconductor manufacturing appar...
Patent number
11,955,359
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Jun Young Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automated guided vehicle with multistage loading structure
Patent number
11,891,254
Issue date
Feb 6, 2024
Samsung Electronics Co., Ltd.
Bosung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Atomic-layer-deposition equipment and atomiclayer-deposition method...
Patent number
11,891,694
Issue date
Feb 6, 2024
SKY TECH INC.
Jing-Cheng Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate holding and rotation mechanism and substrate processing a...
Patent number
11,837,482
Issue date
Dec 5, 2023
Ebara Corporation
Shuichi Suemasa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking apparatus and stacking method
Patent number
11,823,935
Issue date
Nov 21, 2023
Nikon Corporation
Hajime Mitsuishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
Patent number
11,823,991
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tray module, tray assembly including the same, and method for manuf...
Patent number
11,810,806
Issue date
Nov 7, 2023
Samsung Display Co., Ltd.
Jahuem Koo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming dice and structure of die
Patent number
11,810,804
Issue date
Nov 7, 2023
Vanguard International Semiconductor Corporation
Hsiu-Mei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transport apparatus and control method
Patent number
11,791,188
Issue date
Oct 17, 2023
HIRATA CORPORATION
Hirofumi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Batch substrate support with warped substrate capability
Patent number
11,784,075
Issue date
Oct 10, 2023
Applied Materials, Inc.
Shashidhara Patel
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
Patent number
11,784,076
Issue date
Oct 10, 2023
Applied Materials, Inc.
Masato Ishii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier FOUP and a method of placing a carrier
Patent number
11,756,816
Issue date
Sep 12, 2023
Applied Materials, Inc.
Steven Trey Tindel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate storage container
Patent number
11,735,449
Issue date
Aug 22, 2023
Shin-Etsu Polymer Co., Ltd.
Kazumasa Onuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mask arrangement for masking a substrate in a processing chamber, a...
Patent number
11,718,904
Issue date
Aug 8, 2023
Applied Materials, Inc.
Stefan Bangert
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dynamic interface for providing a symmetric radio frequency return...
Patent number
11,664,247
Issue date
May 30, 2023
Applied Materials, Inc.
Ravikumar Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin material handling carrier
Patent number
11,658,059
Issue date
May 23, 2023
II-VI DELAWARE, INC.
John W. Stayt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip carrier device
Patent number
11,587,808
Issue date
Feb 21, 2023
Powertech Technology Inc.
Shih-Chun Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Wafer supporting mechanism and method for wafer dicing
Patent number
11,587,809
Issue date
Feb 21, 2023
Advanced Semiconductor Engineering, Inc.
Bo Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer separating method
Patent number
11,551,934
Issue date
Jan 10, 2023
Kioxia Corporation
Sho Kawadahara
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Tensioning device, base, clamp and method for clamping mask plate
Patent number
11,535,925
Issue date
Dec 27, 2022
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Jianpeng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate storing container
Patent number
11,501,990
Issue date
Nov 15, 2022
Miraial Co., Ltd.
Chiaki Matsutori
E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information
Patent Grant
Substrate processing apparatus for producing mixed processing liquid
Patent number
11,437,251
Issue date
Sep 6, 2022
TOKYO ELECTRON LIMI TED
Hiroki Sakurai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
Publication number
20250029846
Publication date
Jan 23, 2025
Yield Engineering Systems, Inc.
Al Stone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SAMPLE MEASURING APPARATUS
Publication number
20250014926
Publication date
Jan 9, 2025
Konica Minolta, Inc.
Yusuke MURAKAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
Publication number
20240429080
Publication date
Dec 26, 2024
Daewon Semiconductor Packaging Industrial Company
Sunna Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER CLEANING APPARATUS AND WAFER TRANSFER DEVICE
Publication number
20240420977
Publication date
Dec 19, 2024
Beijing NAURA Microelectronics Equipment Co., Ltd.
Hongshuai MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240371743
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER HOUSING CONTAINER AND METHOD OF MANUFACTURING SEMICONDUCTOR D...
Publication number
20240332052
Publication date
Oct 3, 2024
Mitsubishi Electric Corporation
Mikihito SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER FOR SECURING FABRICATED WAFERS
Publication number
20240242990
Publication date
Jul 18, 2024
CIENA CORPORATION
Simon Savard
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
SHEET, HANDLING SHEET FOR THINNED WAFER, METHOD FOR HANDLING THIN W...
Publication number
20240203755
Publication date
Jun 20, 2024
Shin-Etsu Chemical Co., Ltd.
Hideto KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
Publication number
20240178034
Publication date
May 30, 2024
TOKYO ELECTRON LIMITED
Tadashi OBIKANE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER HOLDER AND OPERATING METHOD OF THE SAME
Publication number
20240170316
Publication date
May 23, 2024
INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
Xudong ZHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
Publication number
20230420279
Publication date
Dec 28, 2023
Applied Materials, Inc.
Masato ISHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230386991
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER FILM FRAME CARRIER
Publication number
20230360940
Publication date
Nov 9, 2023
Applied Materials, Inc.
Jason A. Rye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM
Publication number
20230343621
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Rong Syuan FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...
Publication number
20230343622
Publication date
Oct 26, 2023
HITACHI HIGH-TECH CORPORATION
Takanori KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...
Publication number
20230298911
Publication date
Sep 21, 2023
Applied Materials, Inc.
Ravikumar Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...
Publication number
20230282502
Publication date
Sep 7, 2023
Micron Technology, Inc.
Gabe Glass
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...
Publication number
20230253217
Publication date
Aug 10, 2023
LAM RESEARCH CORPORATION
John DREWERY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin Material Handling Carrier
Publication number
20230253235
Publication date
Aug 10, 2023
II-VI Delaware, Inc.
John W. Stayt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...
Publication number
20230203653
Publication date
Jun 29, 2023
SKY TECH INC.
JING-CHENG LIN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
Publication number
20230197487
Publication date
Jun 22, 2023
Advanced Semiconductor Engineering, Inc.
Bo Hua CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate Lifting Apparatus and Substrate Transferring Method
Publication number
20230163010
Publication date
May 25, 2023
ULVAC TECHNO, LTD.
Katsunori Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-JIG WAFER CARRIER DISC INSTALLATION/UNINSTALLATION DEVICE AND M...
Publication number
20230016132
Publication date
Jan 19, 2023
KINGTEK ELECTRONICS TECHNOLOGY CORP.
MAO-YEN SUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
Publication number
20230005771
Publication date
Jan 5, 2023
Daewon Semiconductor Packaging Industrial Company
Sunna Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20220375768
Publication date
Nov 24, 2022
TOKYO ELECTRON LIMITED
Hiroki SAKURAI
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
Method for Producing an Optoelectronic Semiconductor Component and...
Publication number
20220376133
Publication date
Nov 24, 2022
Osram Opto Semiconductors GmbH
Ivar Tangring
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
Publication number
20220351999
Publication date
Nov 3, 2022
Applied Materials, Inc.
Masato ISHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Rotating Disk Reactor with Split Substrate Carrier
Publication number
20220243325
Publication date
Aug 4, 2022
VEECO INSTRUMENTS, INC.
Sandeep Krishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS
Publication number
20220230857
Publication date
Jul 21, 2022
TOKYO ELECTRON LIMITED
Eiichi SUGAWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STICKING AND BREAKAGE MITIGATION
Publication number
20220220627
Publication date
Jul 14, 2022
LAM RESEARCH CORPORATION
Aaron Berke
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS