1. Technical Field
The disclosure relates to a heat dissipation device and, more particularly, to an evaporator and a loop heat pipe employing it.
2. Description of Related Art
Loop heat pipes have excellent heat transfer performance due to their low thermal resistance, and are therefore an effective means for transfer or dissipation of heat from heat-generating components such as central processing units (CPUs) of computers.
A conventional loop heat pipe includes an evaporator having a wick structure adhered to an inner wall thereof. The evaporator includes an evaporation chamber and a compensation chamber. A predetermined quantity of bi-phase working medium is contained in the evaporator.
During operation of the loop heat pipe, the wick structure disposed in the evaporation chamber absorbs heat from the CPU. A part of the heat absorbed by the wick structure in the evaporation chamber evaporates the working medium in the evaporation chamber into vapor; another part of the heat is transferred to the wick structure in the compensation chamber and evaporates the working medium in the compensation chamber into vapor. The compensation chamber gets a reverse vapor pressure to make thus an effective vapor pressure of the loop heat pipe increasingly decreased. On the other hand, the wick structure in the compensation chamber has a large amount of air bubbles accreted thereon to reduce a permeation rate of the working medium in the compensation chamber resulting in that the working medium is evaporated out.
What is needed, therefore, is a loop heat pipe which can overcome the above problems.
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Referring to
The first tube 11 comprises a first circumferential wall 110, a first sidewall 111 and the partition 12 extending inwards perpendicularly from two opposite ends of the first circumferential wall 110, respectively. The first circumferential wall 110, the first sidewall 111 and the partition 12 cooperatively define the evaporation chamber 14. The first sidewall 111 and the partition 12 define a through hole (not labeled) in a center thereof, respectively. The right end of the first circumferential wall 110 has an annular outer groove 112 defined in an outer surface thereof corresponding to an edge of the partition 12.
The second tube 13 comprises a second circumferential wall 130 and a second sidewall 131 extending inwards perpendicularly from a right end of the second circumferential wall 130. A left end of the second circumferential wall 130 has an annular inner groove 132 defined in an inner surface thereof to form an insert 133. The insert 133 is inserted into the outer groove 112 of the first circumferential wall 110 to make the first tube 11 and the second tube 13 engaging together, whereby the second tube 13 and the partition 12 cooperatively define the compensation chamber 16. The second sidewall 131 defines a through hole (not labeled) in a center thereof. The pipe 20 has an end extending through the through hole of the first sidewall 111 and into the evaporation chamber 14, and another end extending through the through hole of the second sidewall 131 and into the compensation chamber 16.
The wick structure 18 comprises a disc-like main body 180, a pipe-shaped evaporation portion 182 extending perpendicularly from a left side face of the main body 180 and a cylinder protrusion 184 extending perpendicularly from a right side face of the main body 180. The main body 180 and the evaporation portion 182 are located in the evaporation chamber 14, and the protrusion 184 is located in the compensation chamber 16.
The main body 180 has the right side face adhered to a left side face of the partition 12, and has an outer circumferential face adhered to an inner surface of the first circumferential wall 110. The main body 180 is isolated from the working medium in the compensation chamber 16 by the partition 12 for preventing the working medium from permeating the main body 180 directly. The evaporation portion 182 is adhered to the inner surface of the first circumferential wall 110. A columnar vapor channel 140 is defined in a middle portion of the evaporation portion 182 of the wick structure 18 and communicates with the pipe 20. The cross-sectional area of the vapor channel 140 is larger than that of the pipe 20, whereby a vapor in the vapor channel 140 can flow into the pipe 20 quickly. The protrusion 184 extends through the through hole of the partition 12 and into the compensation chamber 16, and absorbs the working medium into the main body 180 and the evaporation portion 182. The protrusion 184 has an outer surface spaced from an inner surface of the second circumferential wall 130.
The wick structure 18 can, for example, consist of porous structures, such as fine grooves integrally formed at the inner surface of the first circumferential wall 110 and at the left side face of the partition 12 and extending into the compensation chamber 16, screen mesh or fiber inserted into the evaporation chamber 14 and the compensation chamber 16, and held against the first circumferential wall 110, or sintered powders combined to the inner surface of the first circumferential wall 110 and the left side face of the partition 12 using a sintering process and extending into the compensation chamber 16.
The working medium is selected from a liquid which has a low boiling point such as water, methanol, or alcohol. The pipe 20 is made of deformable materials compatible with the working medium, such as aluminum, stainless steel, or copper.
In operation of the loop heat pipe, the working medium in the evaporation chamber 14 absorbs heat from the heat generating electronic component and evaporates into vapor. A positive vapor pressure is generated due to the vaporization of the working medium and propels the vaporized working medium into the pipe 20 and toward the heat dissipating component 30. The vaporized working medium dissipates its heat to the heat dissipating component 30 and condenses to liquid in the pipe 20. The positive vapor pressure still exists since the evaporation chamber 14 supplies the vapor continuously. The positive vapor pressure, therefore, propels the condensed working medium in the pipe 20 into the compensation chamber 16. The condensed working medium is accumulated in the compensation chamber 16 and submerges the protrusion 184 of the wick structure 18. The condensed working medium is absorbed by the wick structure 18 from the protrusion 184 to the main body 180 and the evaporation portion 182, and into the evaporation chamber 14 via a capillary force of the wick structure 18. The condensed working medium then evaporates to vapor thus starting another cycle in the loop heat pipe and continuously absorbing heat from the heat generating electronic component and dissipating the heat to the heat dissipating component 30.
The partition 12 prevents the main body 180 of the wick structure 18 from directly contacting with the working medium in the compensation chamber 16, decreasing a contact area of the wick structure 18 with the working medium in the compensation chamber 16, thereby decreasing a reverse evaporation area of the wick structure 18. A reverse vapor pressure of the compensation chamber 16 is reduced, keeping the positive vapor pressure in a normal range. On the other hand, the protrusion 184 of the wick structure 18 extends into the working medium in the compensation chamber 16. Heat that is transferred to the protrusion 184 is condensed quickly, and air bubbles on the protrusion 184 are decreased to keep a permeation rate of the working medium in the compensation chamber 16 for preventing the working medium in the evaporation chamber 14 from being evaporated out.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200810306508.9 | Dec 2008 | CN | national |