The present invention relates to nano-ring structure of nano scale, particularly to the fabricating method thereof by directly using the current fabricating facilities so that the number and density of the nano-ring structure in unit area or unit volume can be significantly increased in more evenness manner.
The development of the nano-science nowadays has been extensively applied in a variety of fields, especially in the semiconductor industry, which constantly produces many nano-devices and nano-components, wherein, the nano-ring structure is always used in semiconductor memory (DRAM or SRAM) or hard disk. The number and density of the nano-ring structure in unit area or unit volume will directly affect the memory capacity, quality or performance. Accordingly, the fabricating methods of nano-ring structure, which are disclosed recently such as USA patents in U.S. Pat. No. 6,863,943, U.S. Pat. No. 6,906,369, U.S. Pat. No. 7,002,839 and the like, all address and effort on the issue of number and density of the nano-ring structure in unit area or unit volume though minor differences exist among each other.
As shown in
The conventional process aforesaid is confined to the precision limit of the existing photolithography such that the current best precise nano-scale can only reach 60˜65 nm; Hence, the nano-scale of said nano-aperture 3 from photomask M of pattern transferring photolithography is over 60 nm; Thereby, the nano-scale of said nano quantum dot 4 fabricated from these equipment is also over 60 nm relatively; Thus, the physical size limit of said conventional nano-devices of nano-structure are still in the range of over 60 nm; Therefore, how to breakthrough this bottleneck such that making the nano-scale of nano-aperture 3 be smaller becomes the impending crucial technical tough question of all experts in various fields; The solution being subject to the industrial practical feasibility in mass production and cost-effective economical principle so that the choice of means in technical breakthrough becomes more difficult; The scientists who understand the nano-science and the experts who familiarize with nano-technology are all aware of the benefits of working out the nano-ring structure being smaller than 50 nm or even 1˜2 nm, but none of better solution or effective technical breakthrough is proposed, announced or applied.
The primary object of the present invention is to fabricate out a new nano-ring structure in more miniature manner than that of the current fabricating facilities by directly using the current fabricating facilities without any alteration or redesign of the precision so that the number and density of the nano-ring structure in unit area or unit volume can be significantly increased in more evenness manner.
Another object of the present invention is to provide a “fabricating method of nano-ring structure by nano-lithography”, which comprises the process steps as below: (a): Firstly, deposit sealant of gas molecule or atom state on top-opening of a nano cylindrical pore, which having formed on a preset photo-resist of substrate so that the diameter of said top-opening gradually reduce to become a first reduced nano-aperture, whose opening diameter is smaller than that of said top-opening; (b): Secondly, directly pass a first deposit material of gas molecule or atom state through said first reduced nano-aperture so that a core nano quantum dot of nano-ring structure with diameter being less than 60 nm is directly formed on the surface of said substrate, which being laid beneath the bottom of said nano cylindrical pore; (c): Thirdly, remove the sealant, which is deposited on the top opening of the first reduced nano-aperture to recover the diameter of the top-opening on said nano cylindrical pore; (d): Fourthly, re-deposit the sealant of gas molecule or atom state on the top-opening of the nano cylindrical pore so that the diameter of said top-opening gradually reduce to become a second reduced nano-aperture, whose opening diameter is smaller than that of said top-opening but larger than that of the first reduced nano-aperture; (e): Fifthly, directly pass a second deposit material of gas molecule or atom state through said second reduced nano-aperture so that a ambit nano quantum dot of nano-ring structure with diameter being less than 60 nm is directly formed on the surface of said substrate, which being laid beneath the bottom of said nano cylindrical pore; (f): Sixthly, by means of solution rinsing (i.e. wet etching) or gas etching (i.e. dry etching), remove both of the nano cylindrical pore and the photo-resist on the substrate; and (g): Finally, by means of etching method, selectively remove the first deposit material in the range of core nano quantum dot so that a nano-ring structure is directly formed on the substrate by existing second deposit material between the outer circumference of the core nano quantum dot and the inner circumference of the ambit nano quantum dot.
The further object of the present invention is to provide a “fabricating method of nano-ring structure by nano-lithography”, which comprises the process steps as below: (a): Firstly, deposit the sealant of gas molecule or atom state on top-opening of a nano cylindrical pore, which having formed on a preset photo-resist of substrate so that the diameter of said top-opening gradually reduce to become a first reduced nano-aperture, whose opening diameter is smaller than that of said top-opening; (b): Secondly, directly pass a first deposit material of gas molecule or atom state through said first reduced nano-aperture so that a core nano quantum dot of nano-ring structure with diameter being less than 40 nm is directly formed on the surface of said substrate, which being laid beneath the bottom of said nano cylindrical pore; (c): Thirdly, remove the sealant, which is deposited on the top opening of the first reduced nano-aperture to recover the diameter of the top-opening on said nano cylindrical pore; (d): Fourthly, by means of etching method, expand the nano cylindrical pore for the recovered top-opening such that the diameter of the expanded nano cylindrical pore becomes larger than that of the top-opening on the original nano cylindrical pore; (e): Fifthly, perpendicularly pass a second deposit material of gas molecule or atom state through said expanded nano cylindrical pore so that a ambit nano quantum dot, which encloses the core nano quantum dot, having diameter being same as that of the expanded nano cylindrical pore is directly formed on the surface of said substrate, which being laid beneath the bottom of said nano cylindrical pore; (f): Sixthly, by means of solution rinsing (i.e. wet etching) or gas etching (i.e. dry etching), remove both of the expanded nano cylindrical pore and the photo-resist on the substrate; and (g): Finally, by means of etching method, selectively remove the first deposit material in the range of core nano quantum dot so that a nano-ring structure is directly formed on the substrate by existing second deposit material between the outer circumference of the core nano quantum dot and the inner circumference of the ambit nano quantum dot.
The other object of the present invention is to provide a “fabricating method of nano-ring structure by nano-lithography”, which comprises the process steps as below: (a): Firstly, deposit a sealant of gas molecule or atom state on top-opening of a nano cylindrical pore, which having formed on a preset photo-resist of substrate so that the diameter of said top-opening gradually reduce to become a reduced nano-aperture, whose opening diameter is smaller than that of said top-opening; and (b): Secondly, firmly place said substrate on a tilt-rotary console having capability of 3-D tilt with rotation and one-by-one orderly adjust said tilt-rotary console in rotation angles Φ1, Φ2, Φ3, Φ4 together with forwards and backwards tilt angles as well as leftwards and rightwards yaw angles θ1, θ2, θ3, θ4 so that a deposit material of gas molecule or atom state can orderly pass the reduced nano-aperture to one-by-one continuously form a nano-ring structure on the surface of the substrate with diameter less than that of the nano cylindrical pore.
a is the first step in flow chart showing the fabrication of nano-quantum-dot structure according to conventional nano-technology.
b is the second step in flow chart showing the fabrication of nano-quantum-dot structure according to conventional nano-technology.
c is the third step in flow chart showing the fabrication of nano-quantum-dot structure according to conventional nano-technology.
a is the first step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
b is the second step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
c is the third step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
d is the fourth step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
e is the fifth step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
f is the sixth step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
g is the seventh step in flow chart showing the implementing process of first reduced nano-aperture on the top of nano cylindrical pore for the present invention.
a is the first step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
b is the second step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
c is the third step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
d is the fourth step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
e is the fifth step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
f is the sixth step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
g is the seventh step in flow chart showing the implementing process of second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
a is the first step in flow chart showing the implementing process of first reduced nano-aperture in different geometric shape on the top of nano cylindrical pore for the present invention.
b is the second step in flow chart showing the implementing process of first reduced nano-aperture in different geometric shape on the top of nano cylindrical pore for the present invention.
c is the third step in flow chart showing the implementing process of first reduced nano-aperture in different geometric shape on the top of nano cylindrical pore for the present invention.
a is the schematic view showing the first combination of triangular first reduced nano-aperture and round second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
b is the schematic view showing the second combination of triangular first reduced nano-aperture and triangular second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
a is the first step in flow chart showing the implementing process of first reduced nano-aperture in another different geometric shape on the top of nano cylindrical pore for the present invention.
b is the second step in flow chart showing the implementing process of first reduced nano-aperture in another different geometric shape on the top of nano cylindrical pore for the present invention.
c is the third step in flow chart showing the implementing process of first reduced nano-aperture in another different geometric shape on the top of nano cylindrical pore for the present invention.
d is the fourth step in flow chart showing the implementing process of first reduced nano-aperture in another different geometric shape on the top of nano cylindrical pore for the present invention.
a is the schematic view showing the first combination of square first reduced nano-aperture and round second reduced nano-aperture on the top of nano cylindrical pore for the process steps of view-a through view-d in the
b is the schematic view showing the second combination of square first reduced nano-aperture and square second reduced nano-aperture on the top of nano cylindrical pore for the process steps of view-a through view-d in the
a is the schematic view showing the first combination of round first reduced nano-aperture and triangular second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
b is the schematic view showing the second combination of round first reduced nano-aperture and square second reduced nano-aperture on the top of nano cylindrical pore for the present invention.
a is the first step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
b is the second step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
c is the third step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
d is the fourth step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
e is the fifth step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
f is the sixth step in operation schematic view showing the implementing process of nano ring structure on the bottom surface of nano cylindrical pore via reduced nano-aperture for the third exemplary embodiment of present invention.
Please refer to
Please further refer to
(a): Firstly, deposit a sealant A, which is also known as sealing material colloquially, of gas molecule or atom state on top-opening 11 of a nano cylindrical pore 10, which having formed on a preset photo-resist 2 of substrate 1 (as shown in the
(b): Secondly, directly pass a first deposit material B of gas molecule or atom state through said first reduced nano-aperture 20 (as shown in the
(c): Thirdly, remove the sealant A, which is deposited on the top opening of the first reduced nano-aperture 20 to recover the diameter of the top-opening 11 on said nano cylindrical pore 10 (as shown in the
(d): Fourthly, re-deposit the sealant A of gas molecule or atom state on the top-opening 11 of the nano cylindrical pore 10 so that the diameter of said top-opening 11 gradually reduce to become a second reduced nano-aperture 21, whose opening diameter is smaller than that of said top-opening 11 but larger than that of the first reduced nano-aperture 20 (as shown in the
(e): Fifthly, directly pass a second deposit material C of gas molecule or atom state through said second reduced nano-aperture 21 (as shown in the
(f): Sixthly, by means of solution rinsing (i.e. wet etching) or gas etching (i.e. dry etching), remove both of the nano cylindrical pore 10 and the photo-resist 2 on the substrate 1 (as shown in the
(g): Finally, by means of etching method, selectively remove the first deposit material B in the range of core nano quantum dot 30 so that a nano-ring structure 50 is directly formed on the substrate 1 by existing second deposit material C between the outer circumference of the core nano quantum dot 30 and the inner circumference of the ambit nano quantum dot 40 (as shown in the
Wherein, the implementing process of the aforesaid step (a) in forming said reduced nano-aperture 20 on said top-opening 11 of said nano cylindrical pore 10 is shown in the
(1): Firstly, firmly place said substrate 1 on a tilt-rotary console R having capability of 3-D tilt with rotation and adjust said tilt-rotary console R in tilt angle θ (as shown in a view of the
(2): Secondly, let said tilt-rotary console R keep in tilt angle θ inclination, and gradually rotate it one complete rotation (as respectively shown in the
Moreover, the output of said first deposit material B of gas molecule or atom state in step (a) aforesaid is supplied by said deposit source device 100; In order to regulate said first deposit material B of gas molecule or atom state to pass through said reduced nano-aperture 20 in manner of straight line path, a collimator 200 can be installed between said deposit source device 100 and said first reduced nano-aperture 20 (as shown in the
Therefore, the outermost circumferential diameter of a nano-ring structure 50 fabricated by the aforesaid process steps (a) through (g) (as shown in the
Furthermore, as shown in the
As further shown in the
Moreover, as shown in the
(a): Firstly, deposit a sealant A of gas molecule or atom state on top-opening 11 of a nano cylindrical pore 10, which having formed on a preset photo-resist 2 of substrate 1 so that the diameter of said top-opening 11 gradually reduce to become a first reduced nano-aperture 23, whose opening diameter is smaller than that of said top-opening 11 (as shown in the
(b): Secondly, directly pass a first deposit material B of gas molecule or atom state through said first reduced nano-aperture 23 (as shown in the
(c): Thirdly, remove the sealant A, which is deposited on the top opening of the first reduced nano-aperture 23 to recover the diameter of the top-opening 11 on said nano cylindrical pore 10 (as shown in the
(d): Fourthly, by means of etching method, expand the nano cylindrical pore 10 for the recovered top-opening 11 such that the diameter of the expanded nano cylindrical pore 12 becomes larger than that of the top-opening 11 on the original nano cylindrical pore 10 (as shown in the
(e): Fifthly, perpendicularly pass a second deposit material C of gas molecule or atom state through said expanded nano cylindrical pore 12 so that a ambit nano quantum dot 80, which encloses the core nano quantum dot 70, having diameter being same as that of the expanded nano cylindrical pore 12 is directly formed on the surface of said substrate 1, which being laid beneath the bottom of said nano cylindrical pore 10 (as shown in the
(f): Sixthly, by means of solution rinsing (i.e. wet etching) or gas etching (i.e. dry etching), remove both of the expanded nano cylindrical pore 12 and the photo-resist 2 on the substrate 1 (as shown in the
(g): Finally, by means of etching method, selectively remove the first deposit material B in the range of core nano quantum dot 70 so that a nano-ring structure 90 is directly formed on the substrate 1 by existing second deposit material C between the outer circumference of the core nano quantum dot 70 and the inner circumference of the ambit nano quantum dot 80 (as shown in the
Wherein, the redundant description for the implementing process of the aforesaid step (a) in forming said reduced nano-aperture 23 on said top-opening 11 of said nano cylindrical pore 10 is eliminated because it is the same as that of the first exemplary embodiment. The second exemplary embodiment of the present invention is applicable to the case for more precision in nano pattern of photomask M as the size of the nano cylindrical pore 10 on the photoresist 2 of the substrate 1 is normally less than 40 nm; therefore, the expanded nano cylindrical pore 12 by etching method is adopted to implement the ambit nano quantum dot 80.
As shown in the
(a): Firstly, deposit a sealant A of gas molecule or atom state on top-opening 11 of a nano cylindrical pore 10, which having formed on a preset photo-resist 2 of substrate 1 so that the diameter of said top-opening 11 gradually reduce to become a reduced nano-aperture 24, whose opening diameter is smaller than that of said top-opening 11 (as shown in the
(b): Secondly, firmly place said substrate 1 on a tilt-rotary console R having capability of 3-D tilt with rotation and one-by-one orderly adjust said tilt-rotary console R in rotation angles Φ1, Φ2, Φ3, Φ4 together with forwards and backwards tilt angles as well as leftwards and rightwards yaw angles θ1, θ2, θ3, θ4 (as shown in a view of the
This application claims the benefit of provisional U.S. Patent Application No. 60/929,460, field Jun. 28, 2007.
| Number | Date | Country | |
|---|---|---|---|
| 60929460 | Jun 2007 | US |