1. Field of the Invention
The present invention relates to a fan carrier apparatus for an electronic apparatus, and more particularly, to a fan carrier apparatus for efficiently improving heat dissipation of the electronic apparatus which comprises a plurality of electronic elements being vertically disposed.
2. Description of the Prior Art
For the sake of comfortable operations for users and fitting different living/working circumstances, exterior appearances of many electronic apparatuses are designed to approach a simplified structure. Under such circumstances, it has become an important issue to provide a well-designed heat-dissipation apparatus to maintain efficient operations and considerate protections for the electronic apparatuses.
Therefore, the primary objective of the present invention is to provide a fan carrier apparatus for efficiently elevating heat dissipation of an electronic apparatus.
The present invention discloses a fan carrier apparatus for an electronic apparatus. The fan carrier apparatus comprises a base, comprising at least one opening; at least one fan, disposed at the at least one opening of the base; and a current-conduction module, disposed on the base and comprising at least one hole, such that an air corresponding to the at least one fan penetrates the at least one hole to assist heat dissipation of the electronic apparatus.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Please refer to
As shown in
In details, as shown in
Furthermore, the current-conduction module 104 of the embodiment further comprises at least one air-conduction vane 1042 to be disposed near the hole 1040 for conducting a circulating direction of the air corresponding to the fan 102. In other words, the air-conduction vane 1042 of the embodiment forms a circular board with a height which can be adaptively adjusted rather than being the same in every parts of the circular board. Accordingly, the circular board of the air-conduction vane 1042 can prevent the user from accidentally inserting an object into the hole 1040 while installing/disassembling the fan carrier board 10, and the circular board can also help vertically conduct the air flowing from the bottom to the top, such that the air inside the electronic apparatus 1 will not arbitrarily form local turbulence floating inside the column-shape wind tunnel, so as to improve the heat dissipation of the electronic apparatus 1.
Certainly, a housing of the fan carrier apparatus 10 of the embodiment further comprises at least one heat-dissipation hole (not shown in the hole), and a position of the heat-dissipation hole can be adaptively adjusted according to different composition elements of the electronic apparatus 1. Accordingly, when the air corresponding to the fan 12 flows from the bottom to the top with the assistance of the circular board of the air-conduction vane 1042, the fan 102 can inhale an external gas (i.e. an air having a lower temperature) via the opening 1000 and exhale an internal gas (i.e. an air having a higher temperature) of the fan carrier apparatus 10 via the at least one heat-dissipation hole. Under such circumstances, since a flow amount of the external gas inhaled via the opening 1000 equals another flow amount of the internal gas exhaled via the one heat-dissipation hole, an air convection of the embodiment also accelerates a heat dissipation rate of the electronic apparatus 1.
Besides, since a hot air has a lower density to result in floating upward, the embodiment of the invention provides the scheme that the fan carrier apparatus 10 is disposed at the bottom of the electronic apparatus 1, such that the opening 1000 locating at the bottom can cooperate with the fan 102 to inhale the external gas and the column-shape wind tunnel of the electronic apparatus 1 can be configured to upward dissipate the heat inside the electronic apparatus 1. Certainly, the fan carrier apparatus 10 of the embodiment can also be disposed at a side or a top of the housing of the electronic apparatus 1 to keep the column-shape wind tunnel for generating a rapid air flow, which is also within the scope of the invention. In other embodiments, those skilled in the art can also install at least one assistance fan to be disposed at a top or a side of the housing of the electronic apparatus 1, so as to replace (or cooperate with) the original fan 102 disposed at the bottom of the electronic apparatus 1, so as to have the internal gas to be exhaled outside the electronic apparatus with a faster rate, which is also within the scope of the invention.
For example, please refer to
In summary, the embodiments of the invention provide a fan carrier apparatus for an electronic apparatus, wherein the electronic apparatus has the structural designs, e.g. the column-shape wind tunnel and the current-conduction module, to form an upward air flow by the blowing of the fan, so as to rapidly dissipate the heat generated by the electronic apparatus. Also, the embodiments can utilize different number of the assistance fan(s), such that the heat dissipation rate of the embodiment can be adaptively adjusted under different operations of the electronic apparatus.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
104218567 | Nov 2015 | TW | national |
This application claims the benefit of both U.S. Provisional Application No. 62/193,099, filed on Jul. 16, 2015 and entitled “The structure design of new product”, the contents of which are incorporated herein.
Number | Date | Country | |
---|---|---|---|
62193099 | Jul 2015 | US |