Cooling of mounted components

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CPC
H05K1/0203

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0203Cooling of mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling electronic devices
- Patent number 12,261,098
- Issue date Mar 25, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling system for precise temperature control of radiation...
- Patent number 12,262,463
- Issue date Mar 25, 2025
- Radialis Medical, Inc.
- Oleksandr Bubon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 12,262,472
- Issue date Mar 25, 2025
- Hyundai Motor Company
- Nam Sik Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing apparatus that can efficiently radiate heat from an...
- Patent number 12,256,134
- Issue date Mar 18, 2025
- Canon Kabushiki Kaisha
- Kei Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including battery
- Patent number 12,249,840
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Seunghoon Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Radiation shield with zipper
- Patent number 12,250,800
- Issue date Mar 11, 2025
- Intel Corporation
- Yew San Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna module
- Patent number 12,250,766
- Issue date Mar 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and manufacturing...
- Patent number 12,245,358
- Issue date Mar 4, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aerosol generating device having heater
- Patent number 12,245,341
- Issue date Mar 4, 2025
- KT & G Corporation
- Hun Il Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hardened optical platform including high-power electro-optics and h...
- Patent number 12,238,851
- Issue date Feb 25, 2025
- Ciena Corporation
- Chander Prakash Gupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including sheilding structure
- Patent number 12,238,911
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Haejin Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board assembly and electronic device including the same
- Patent number 12,237,561
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jongwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture generating unit for a head-up display
- Patent number 12,222,516
- Issue date Feb 11, 2025
- Hyundai Mobis Co., Ltd.
- Byung Ki Kim
- G02 - OPTICS
Information Patent Grant
Electrical device
- Patent number 12,225,695
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Youji Shirato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-mounted heat sink and power module using same
- Patent number 12,225,694
- Issue date Feb 11, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Mingjuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Damper system for a lidless integrated circuit
- Patent number 12,219,690
- Issue date Feb 4, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly with integrated vapor chamber
- Patent number 12,219,691
- Issue date Feb 4, 2025
- NVIDIA Corporation
- David Haley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical device and method for producing a first and second elect...
- Patent number 12,213,290
- Issue date Jan 28, 2025
- Sew-Eurodrive GmbH & Co. KG
- Martin Schörner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wearable device antenna system
- Patent number 12,212,046
- Issue date Jan 28, 2025
- Snap Inc.
- Andrea Ashwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector assembly having a heat sink and a retention member...
- Patent number 12,207,389
- Issue date Jan 21, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Fu-Jin Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having both chassis and module dual-flow connec...
- Patent number 12,200,854
- Issue date Jan 14, 2025
- Eagle Technology, LLC
- Voi Nguyen
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressurizing device and electronic device including pressurizing de...
- Patent number 12,200,874
- Issue date Jan 14, 2025
- Tyco Electronics (Shanghai) Co., Ltd.
- Wei (David) Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back-to-back solid state lighting devices and associated methods
- Patent number 12,191,298
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
- Publication number 20250106978
- Publication date Mar 27, 2025
- LG Innotek Co., Ltd.
- Ho Sung KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...
- Publication number 20250098062
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK, HEAT DISSIPATION UNIT, AND SERVER
- Publication number 20250089151
- Publication date Mar 13, 2025
- SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
- Yuefeng WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...
- Publication number 20250089152
- Publication date Mar 13, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Yaniv Kazav
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL HEAT PIPE CONFIGURATIONS
- Publication number 20250089213
- Publication date Mar 13, 2025
- Honeywell International Inc.
- Tao Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087601
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, DISPLAY APPARATUS AND COMPOSITE ADHESIVE TAPE FOR A...
- Publication number 20250076713
- Publication date Mar 6, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Yang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081415
- Publication date Mar 6, 2025
- CANAAN CREATIVE CO., LTD.
- Fuxing LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Module and Communication Device
- Publication number 20250081326
- Publication date Mar 6, 2025
- Huawei Technologies Co., Ltd
- Xiaodong Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250063667
- Publication date Feb 20, 2025
- ASUSTek COMPUTER INC.
- Chih-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...
- Publication number 20250063650
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Matthew David TURNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20250056717
- Publication date Feb 13, 2025
- VALEO COMFORT AND DRIVING ASSISTANCE
- Matthias Wellens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250054897
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...
- Publication number 20250043967
- Publication date Feb 6, 2025
- GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD.
- Zhiguo SHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...
- Publication number 20250048530
- Publication date Feb 6, 2025
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250048588
- Publication date Feb 6, 2025
- DENSO CORPORATION
- Hiroki CHITAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20250048531
- Publication date Feb 6, 2025
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES
- Publication number 20250048532
- Publication date Feb 6, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA DEVICE AND OPTICAL INSTRUMENT
- Publication number 20250039523
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- Deok Yong LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE
- Publication number 20250040025
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- KOICHI SHIGETA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20250040050
- Publication date Jan 30, 2025
- ROHDE & SCHWARZ GMBH & CO. KG
- Rene KRUEGER-MOLL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Internal Recirculation Cooling Module
- Publication number 20250031342
- Publication date Jan 23, 2025
- Jetcool Technologies Inc.
- Ludwig C. HABER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250031297
- Publication date Jan 23, 2025
- Canon Kabushiki Kaisha
- TORU MIYAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK
- Publication number 20250024583
- Publication date Jan 16, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Peter Sturm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUXILIARY MODULE TO SUPPORT PRINTED CIRCUIT ASSEMBLY OF ELECTRONIC...
- Publication number 20250024582
- Publication date Jan 16, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- John P. Franz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...
- Publication number 20250016934
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cooling of mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Immersion cooling electronic devices

Liquid cooling system for precise temperature control of radiation...

Power module

Heat sinks with beyond-board fins

Image capturing apparatus that can efficiently radiate heat from an...

Electronic device including battery

Radiation shield with zipper

Antenna module

Circuit board with embedded electronic component and manufacturing...

Aerosol generating device having heater

Heatsink techniques for optical and electrical modules

Hardened optical platform including high-power electro-optics and h...

Electronic device including sheilding structure

Circuit board assembly and electronic device including the same

Picture generating unit for a head-up display

Electrical device

Surface-mounted heat sink and power module using same

Apparatus and power module

Damper system for a lidless integrated circuit

Printed circuit board assembly with integrated vapor chamber

Electrical device and method for producing a first and second elect...

Wearable device antenna system

Socket connector assembly having a heat sink and a retention member...

Electronic assembly having both chassis and module dual-flow connec...

Electronic device with heat-conductive cover

Electronic package and manufacturing method thereof

Embeddable electrically insulating thermal connector and circuit bo...

Pressurizing device and electronic device including pressurizing de...

Back-to-back solid state lighting devices and associated methods

Circuit board module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE

MANUFACTURING METHOD OF POWER MODULE

SEMICONDUCTOR MODULE

TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...

HEAT SINK, HEAT DISSIPATION UNIT, AND SERVER

DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...

NOVEL HEAT PIPE CONFIGURATIONS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE, DISPLAY APPARATUS AND COMPOSITE ADHESIVE TAPE FOR A...

ELECTRONIC DEVICE

Circuit Board Module and Communication Device

ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...

ELECTRONIC ASSEMBLY

SEMICONDUCTOR MODULE

ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...

CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...

ELECTRONIC DEVICE

POWER MODULE WITH INDUCTOR-COOLED POWER STAGE

THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES

CAMERA DEVICE AND OPTICAL INSTRUMENT

ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE

PRINTED CIRCUIT BOARD ARRANGEMENT

Internal Recirculation Cooling Module

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK

AUXILIARY MODULE TO SUPPORT PRINTED CIRCUIT ASSEMBLY OF ELECTRONIC...

CHIP SYSTEM AND ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...