The disclosed invention relates to a fastening device which is useful in facilitating the assembly of associated parts by employing a heat activated assembly element such as a dowel or a disc or a strip constructed to include a target material and a solid substance which will exhibit adhesive and expansive properties on exposure to heat. The heat will be generated in the target material by exposing the target material to electromagnetic waves.
U.S. Pat. No. 4,038,120 to Russell describes the use of an energized heating element or wire to heat a hot melt glue resulting in adhesion between contiguously assembled panels. The reference method involves heating a glue-coated wire to liquefy the glue, producing a cohesive state and facilitating the assembly of panels. This method is useful for introducing a cohesive material (glue) to an area of limited accessibility (groove), but the heating element (wire) requires the direct application of energy (electricity) to provide the heat to melt the glue.
U.S. Pat. No. 3,996,402 to Sindt relates to the assembly of sheet materials by the use of a fastening device utilizing an apertured sheet of eddy current-conducting material sandwiched between coatings of hot-melt glue. An induction heating system is activated causing eddy current heating in the EC-conducting material with consequent melting of the hot-melt glue thus resulting in fusion and bonding of the sheet materials in accordance with the desired construction.
U.S. Pat. No. 3,574,031 to Heller et al. describes a method and material for welding thermoplastic bodies by using a susceptor sealant between the bodies to be joined. The susceptor sealant is characterized by having particles, heatable by induction, dielectric or radiant energy, dispersed in a thermoplastic carrier compatible with the thermoplastic sheets to be welded. The welding of the thermoplastic sheets is effected by applying and exposing the susceptor sealant to heat energy, softening the carrier material and joining all thermoplastic materials.
U.S. Pat. No. 3,612,803 to Klaas discloses a fastening device, which, in its most relevant embodiment, consists of a quantity of heat-activatable adhesive containing a closed electronically conductive loop and a ferromagnetic material insulated from said closed loop. In operation, the fastening device is activated by a solenoid coil energized with alternating electrical current. The current emitted from the solenoid is transferred to the fastening device where a current of large amperage and low voltage is generated in the loop enveloped by the heat-activatable adhesive. The current produces heat that causes the adhesive to become sticky. The efficiency, and apparently the usefulness, of the disclosed device is improved by fitting it with a ferromagnetic core enclosed within the closed loop.
The instantly disclosed fastening device is distinguished from, and goes beyond, the prior art by describing an assembly element which will provide structure, strength and stability to an assembled product while serving as a vehicle for introducing an adhesive material in a neat, non-messy form to internal and inaccessible areas of the parts to be assembled. In addition to providing adhesive properties, the disclosed device simultaneously expands upon exposure to heat; this expansion takes up assembly clearances and provides contact pressure at the interface between the adherends and the device. The disclosed device includes a target material for absorbing and converting electromagnetic waves to heat, and for conducting heat energy to both the expansive assembly element and the adhesive material so that it can be activated to provide an adhesive bond between the associated parts. This disclosure also relates to an improved and expeditious method for the assembly and adherence of associated parts of various materials which are mostly transparent to electromagnetic waves. The improved method utilizes a device which comprises an assembly element which includes a receptive target material for absorbing electromagnetic waves, a solid adhesive material contiguous with the conductive target material which will become physically or chemically adhesive by heat energy resulting from electromagnetic waves absorbed and conducted by the target material, and an expansive material which expands concurrently with the heat from the target material. This disclosure also relates to the assembled products produced according to the method utilizing the disclosed fastening device.
The accompanying drawings incorporated in and forming a part of the specification, illustrate several aspects of the present invention, and together with the description serve to explain the principles of the invention. In the drawings:
a is a sectional view of the fastening device in the shape of a disk, taken along section line 4a:4a of
a is a partial sectional plan view of the fastening device in the shape of a disk depicting depositories of adhesive material and strips of adhesive components; and
b is a sectional view of the fastening device in the shape of a disk taken along section line of
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings, wherein like numerals indicate the same elements throughout the views.
The disclosed device 10, shown in
Two types of adhesives, hot-melt and heat-activated cure, are proposed for use with the disclosed device. Both types of adhesives are initiated by heat emanating from the conductive target material. Hot-melt adhesives are solid at ambient temperatures, but melt or liquefy when the temperature is elevated by heat flowing from the conductive target material. The melted adhesive wets the adherends and, in the case of porous, foraminous, or fibrous adherends, penetrates the surface of the parts to be bonded. As the adhesive cools, the adherends and adhesive are bonded. In the case of porous, foraminous, or fibrous adherends, mechanical interlocking can contribute to bond strength. Note that for the hot-melt mechanism, the bonding is reversible. Thus, by repeating the induction heating procedure, the bond can be undone and the adherends separated. The ability to reverse the adhesion and separate assembled parts is not a trivial attribute. In addition to the advantage of being able to re-assemble or repair misaligned parts, it is also desirable to be able to disassemble manufactured articles to facilitate serviceability and repair. Often, when working with associated parts of different materials, it will be beneficial to disassociate assembled parts to facilitate recycling. Heat-activated curing adhesives are also solid and easy to manipulate at ambient temperatures, but when the adhesive temperature is elevated by the heat from the conductive target material, a chemical reaction is initiated. This reaction involves a cure or crosslinked bonding either within the adhesive or between the adhesive and the adherends. Such bonds are typically irreversible. Frequently, a heat activated curing adhesive bond will demonstrate an electrostatic attraction between the adhesive and the adherends and a crosslinked bond within itself. In one form of a typical embodiment of the disclosed fastening device 10, the adhesive coated target material can comprise or be affixed to, or incorporated into, an expansive assembly element 13, such as a dowel, a strip, or a disc. In one preferred embodiment as shown in
The expansive assembly element 13 is to be fabricated from a variety of materials that exhibit suitable compressibility and mixed with a heat activated binder material. Suitable compressible materials will be either fibrous, foraminous, or rubber-like in nature and have suitable temperature resistance to allow activation of the binder material. Suitable fibrous materials include fiberglass, ceramic fibers, graphite fibers, metal wool, plant fibers, animal bristles, and mixtures of the preceding. Suitable foraminous materials include sponges, crushed nutshells, hollow plastic spheres, and synthetic foam products. Binder materials will be either hot melt adhesives or heat curing adhesives.
Alternatively, the expansive component may be derived from the product of a heat activated or enabled chemical reaction, and not necessarily be pre-compressed. Either reaction products from the combination of two or more materials or decomposition products from one or more components may produce a product with a significant or required increase in specific volume. Such ingredients may or may not be encapsulated. The most dramatic reaction products will become gases at least at an elevated temperature during thermal activation. Upon cooling, an element of the expansion will remain. Examples include voids in the case of gases and regions of material with overall lower densities, i.e., increased specific average volumes.
Alternatively, the expansive component may be derived from a purely physical phase change. One or more components may become gaseous at least at an elevated temperature during thermal activation. Upon cooling or vitrification from chemical reaction, voids may remain as a result of gaseous expansion. A further example would include encapsulated materials under pressure whose shells collapse or melt as temperature increases, allowing a gas to expand or a solid or liquid to phase change to a gas and to expand.
As shown in
The operation of the fastening device is illustrated in
Alternative embodiments of the fastening device are illustrated in
In laboratory experiments with an assembly device as disclosed here, a fiberglass mat originally 0.188 inches thick was heated in an oven with a film of a polyamide hot melt adhesive on top. The oven temperature was set at 450° F., which is slightly above the melting point. Upon melting the adhesive was absorbed into the fiberglass. The hot adhesive wetted mat was removed from the oven, sandwiched between two sheets of aluminum foil and placed in a press. Pressure was applied until the adhesive was observed to be solidified. Thickness was measured to be 0.100 inches. The lamination was then heated using electromagnetic waves with a frequency of approximately 100,000 hertz (100 kHz) until expansion of the lamination was observed. The lamination continued to expand after removal of the heating source. Upon cooling the lamination thickness was measured at 0.147 inches.
Immediate needs for the disclosed fastening device have been identified in the furniture industry where neat, effective and efficient assembly methods can readily be exploited to manufacture affordable units in a fast, effective and clean manner. Furniture and cabinet manufacturing applications will involve the assembly of associated parts of wood and plastic, both of which are transparent to electromagnetic waves and receptive to adhesive bonding. Other uses for the disclosed device include the fabrication of lattice panels, the installation of trim molding and fence erection. Also envisioned is the assembly of plywood, gypsum board and combination boards to wall ceiling and floor framing materials. In the packaging industry, there is a need to facilitate the fast and effective construction of containers made of wood, plastic, and engineered fiber base materials, which could all be readily assembled using the disclosed device. In addition to the simplest configuration of the fastening device where the assembly element is a disc, dowel or strip coated with an adhesive material, other configurations of the fastening device are also envisioned. One such configuration features a fastening device comprising an expansive assembly element providing alignment and support to assembled associated parts, a conductive target material integrated with the expansive assembly element, for absorbing electromagnetic waves and an adhesive material, contiguous with the RF susceptor material, becoming adhesively active by heat energy resulting from the electromagnetic waves absorbed and conducted by the target material.
While the foregoing is a complete description of the disclosed method, numerous variations and modifications may also be employed to implement the purpose of the invention. And, therefore, the elaboration provided should not be assumed to limit the scope of the invention that is intended to be defined by the appended claims.
This application is a continuation-in-part application of U.S. patent application Ser. No. 09/376,172, filed on Aug. 17, 1999 now U.S. Pat. No. 6,543,976, which is a continuation-in-part of U.S. patent application Ser. No. 09/072,301, filed on May 4, 1998, now U.S. Pat. No. 5,938,386, which is a continuation-in-part of U.S. patent application Ser. No. 08/642,826 filed on May 3, 1996, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3391846 | White | Jul 1968 | A |
3574031 | Heller et al. | Apr 1971 | A |
3612803 | Klass et al. | Oct 1971 | A |
3816203 | Bascom et al. | Jun 1974 | A |
3941643 | Balla | Mar 1976 | A |
3996402 | Sindt | Dec 1976 | A |
4023829 | Staats | May 1977 | A |
4029837 | Leatherman | Jun 1977 | A |
4029838 | Chamis et al. | Jun 1977 | A |
4120712 | Sindt | Oct 1978 | A |
4123305 | Krzeszowski | Oct 1978 | A |
4355222 | Geithman et al. | Oct 1982 | A |
4420352 | Schroeder et al. | Dec 1983 | A |
4468418 | Freeman | Aug 1984 | A |
4521659 | Buckley et al. | Jun 1985 | A |
4657717 | Cattanach et al. | Apr 1987 | A |
4710539 | Siadat et al. | Dec 1987 | A |
4730556 | Cobbs, Jr. | Mar 1988 | A |
4749833 | Novorsky et al. | Jun 1988 | A |
4833002 | Sinclair | May 1989 | A |
4878978 | Goel et al. | Nov 1989 | A |
4900390 | Colton et al. | Feb 1990 | A |
4906497 | Hellmann et al. | Mar 1990 | A |
4910048 | Sinclair | Mar 1990 | A |
5004111 | McCarthy | Apr 1991 | A |
5043741 | Spehrley, Jr. | Aug 1991 | A |
5075034 | Wanthal | Dec 1991 | A |
5129977 | Leatherman | Jul 1992 | A |
5266764 | Fox et al. | Nov 1993 | A |
5277737 | Li et al. | Jan 1994 | A |
5313034 | Grimm et al. | May 1994 | A |
5326605 | Ono et al. | Jul 1994 | A |
5338497 | Murray et al. | Aug 1994 | A |
5340649 | Roeker et al. | Aug 1994 | A |
5391595 | Clark, Jr. et al. | Feb 1995 | A |
5447592 | Berce et al. | Sep 1995 | A |
5500511 | Hansen et al. | Mar 1996 | A |
5508496 | Hansen et al. | Apr 1996 | A |
5556565 | Kirkwood et al. | Sep 1996 | A |
5558735 | Rettew et al. | Sep 1996 | A |
5599622 | Kinzer et al. | Feb 1997 | A |
5645744 | Matsen et al. | Jul 1997 | A |
5705796 | Hansen et al. | Jan 1998 | A |
5717191 | Christensen et al. | Feb 1998 | A |
5723849 | Matsen et al. | Mar 1998 | A |
5728309 | Matsen et al. | Mar 1998 | A |
5751303 | Erickson et al. | May 1998 | A |
5756973 | Kirkwood et al. | May 1998 | A |
5770296 | Remerowski et al. | Jun 1998 | A |
5795638 | Roder et al. | Aug 1998 | A |
5808281 | Matsen et al. | Sep 1998 | A |
5827913 | Baetzold et al. | Oct 1998 | A |
5833795 | Smith et al. | Nov 1998 | A |
5843057 | McCormack | Dec 1998 | A |
5894700 | Sweet | Apr 1999 | A |
5916469 | Scoles et al. | Jun 1999 | A |
5919387 | Buckley et al. | Jul 1999 | A |
5935475 | Scoles et al. | Aug 1999 | A |
5935698 | Pannell | Aug 1999 | A |
Number | Date | Country |
---|---|---|
3805421 | Sep 1989 | DE |
3940461 | Jun 1991 | DE |
0314548 | Jul 1988 | EP |
0440410 | Aug 1991 | EP |
2065027 | Jun 1981 | GB |
2240980 | Aug 1991 | GB |
04364926 | Dec 1992 | JP |
05138742 | Jun 1993 | JP |
6116029 | Apr 1994 | JP |
WO 8700074 | Jan 1987 | WO |
Number | Date | Country | |
---|---|---|---|
20030170091 A1 | Sep 2003 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 09376172 | Aug 1999 | US |
Child | 10405832 | US | |
Parent | 09072301 | May 1998 | US |
Child | 09376172 | US | |
Parent | 08642826 | May 1996 | US |
Child | 09072301 | US |