This invention relates to the inspection of glass sheets and, in particular, to the inspection of glass sheets of the type used as substrates in liquid crystal displays (LCDs).
As is well known, liquid crystal displays (LCDs) are composed of a layer of a liquid crystal material sandwiched between two thin glass sheets. Typically, one of the glass sheets serves as a substrate upon which electrical components, e.g., thin film transistors (TFTs), are formed to define the individual pixels of the display. LCDs of this type are known as active matrix liquid crystal displays or AMLCDs.
Thin film transistors formed on glass substrates have narrow performance tolerances. Substrate defects, such as, glass chips, scratches, blisters, inclusions, and stains, can readily lead to product rejects. In particular, the thin contact leads for the TFTs are especially sensitive to sharp variations in height, which can cause open circuits.
To address these problems, glass sheets which are to be used as substrates for LCDs are subjected to on-line inspection as part of the manufacturing process. For example, at Corning Incorporated, the assignee of this application, inspection of glass substrates currently involves a combination of human visual inspection and an operator-assisted automatic inspection system, which uses brightfield and darkfield microscopy techniques.
Human inspection is very fast but has poor resolution, at no better than 50 microns, and poor repeatability. Higher resolution can be achieved with a brightfield/darkfield automatic inspection system. However, increases in resolution for such systems has meant slower inspection speeds. For the glass sheets currently being manufactured for use as LCD substrates, speed considerations have limited automatic inspection to the 20 micron level.
Current trends in the LCD substrate field are in the direction of larger substrates with tighter tolerances on defects. These trends place ever higher demands on an inspection system. For example, it is expected that glass sheets having sizes on the order of 2,000 mm×2,000 mm will need to be inspected on at least one of their sides, i.e., the side on which the TFTs will be formed, for defects on the order of 0.5 microns in size and 0.25 microns in height.
Significantly, neither visual nor current brightfield/darkfield automatic inspection can measure heights of defects. Moreover, conventional approaches for determining the height of surface features, such as, Phase Shifting Interferometry (PSI) and Atomic Force Microscopy (AFM), are ill-suited for large area scans. This becomes especially evident when it is considered that on-line sheet inspection typically needs to be performed in 30 seconds or less.
The particular nature of a defect, e.g., whether it is a bubble, scratch, stain, chip, or the like, is in general not of concern to the purchasers of glass substrates, i.e., the purchaser wants a substrate that is free of objectionable defects, irrespective of the type of defect. However, from a glass manufacturing point of view, it is desirable to have information regarding the type of defect which is appearing in the finished glass sheets so that appropriate corrective measures can be taken to eliminate the defect.
Thus, although defect identification and height measurements are of primary concern, an on-line inspection system which also provides information regarding defect type would also be desirable.
In accordance with one of its aspects, the invention provides a method for inspecting a surface (11) of a sheet of material (e.g., a glass sheet 31 having an optical reflectivity of less than 10% and typically less than 5%) comprising:
In accordance with certain preferred embodiments of this aspect of the invention, step (b) comprises using the detected intensity for the interfering reference and measurement beams for at least one of the fibers (15) as a feedback variable for positioning the array (13) adjacent to the surface (11).
In accordance with another of its aspects, the invention provides a method for inspecting a surface (11) of a sheet of material (31) comprising:
In accordance with a still further aspect, the invention provides a method for inspecting a region (27) of a surface (11) of a sheet of material (31) comprising:
Preferably, the entire usable surface of a sheet of material is inspected by repeated application at different positions on the surface of one or more of the foregoing aspects of the invention so that the entire surface is scanned, e.g., by moving fiber array 13 along one or both of the x and y axes in
The invention also provides apparatus for practicing each of the above inspection methods.
The reference numbers used in the above summaries of the various aspects of the invention are only for the convenience of the reader and are not intended to and should not be interpreted as limiting the scope of the invention. More generally, it is to be understood that both the foregoing general description and the following detailed description are merely exemplary of the invention and are intended to provide an overview or framework for understanding the nature and character of the invention.
Additional features and advantages of the invention are set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the invention as described herein. The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.
In the above drawings, like reference numbers designate like or corresponding parts throughout the several views. The elements to which the reference numbers generally correspond are set forth in Table 1.
In its preferred embodiments, the present invention relates to the inspection of glass sheets and, in particular, to the inspection of LCD glass sheets to determine if defects are present which make the sheet unsuitable for use in the manufacture of liquid crystal displays.
In overview, the invention employs a parallel array of all-fiber interferometers (arranged in a Fizeau or Fabry-Perot configuration) which is scanned along an axis normal to the plane of the array (e.g., the array is scanned along the y-axis in
Individual fibers of the fiber arrays used in the invention cover an area of the substrate limited primarily by the core-to-core separation distance between the fibers. The effects of diffraction at the cleaved ends of the fibers are lessened by using short wavelength sources and reducing the spacing between the fibers and the surface. If desired, the array may be dithered normal to the scan direction in order to increase the coverage of the array. As discussed more fully below, full coverage can also be achieved by using multiple layers of fibers. For a suitable number of staggered rows of fibers (depending on the core size), full coverage throughout the width of the array can be achieved without the need for lateral dithering.
The scan size of the fiber array interferometer is limited only by the number of fibers in the array and the range of motion of the controller used to move the array over the surface being inspected. The scan speed is proportional to the product of the fiber array size and the detection bandwidth of the interferometers, both of which can be very large (e.g., a typical detector such as a PIN photodiode has a response time of around 25 nanoseconds).
More particularly, motion control system 17 both positions the ends of the fibers sufficiently close to surface 11 to produce a suitable contrast in the interferometric signal (e.g., at a distance of less than about 100 microns) and scans array 13 in one or more passes over the surface to detect defects. Depending on the sizes of the substrate and the array, the scanning can be along just the y-axis in
Typically, the substrate will be stationary during scanning, but can be moved to, for example, bring different parts of surface 11 into position for inspection. Alternatively, but not preferred, array 13 can be held stationary and the substrate moved during a scan. Although shown horizontal in
Preferably, as shown in these figures, the plastic protective coating (plastic jacket) which surrounds the cladding of a typical optical fiber is removed in the region of the cleaved ends so that the claddings of the individual fibers can be brought into contact, i.e., so that a close-packed arrangement can be achieved. In this way, the distance between cores 21 is reduced which increases the spatial resolution of the array, i.e., it reduces the distance on the surface of the substrate between the spots of light produced by the individual fibers. If desired, a further reduction in the spacing of the cores can be achieved by tapering the claddings in the region of the cleaved ends. For example, for a fiber having a core diameter of 8 microns and a cladding diameter of 125 microns, a taper which reduces the cladding diameter to 10 microns over a distance of 1 millimeter from cleaved end 19 can be used in the practice of the invention.
The interferometric setup of
In the present invention, light is reflected directly from the surface of a substrate without any added reflective coatings. Moreover, glass substrates have low reflectivity. For example, for each fiber in array 13, much less than 10 percent, e.g., less than 5 percent, of the light that passes out of the fiber reflects from the region of the surface associated with the fiber. The rest of the light simply passes through the transparent substrate. Yet, as demonstrated by, for example, the data presented below, the invention has been found to be highly effective in inspecting transparent glass surfaces for changes in height, notwithstanding this low reflectivity.
As shown by arrow 45 in
As shown by arrow 49 (in particular, the right hand arrowhead of this arrow), light from the second output arm of the coupler is transmitted towards surface 11 of substrate 31 by fiber 15. The distal end of this fiber is cleaved, e.g., normal to the fiber axis, and is brought close to the substrate surface, e.g., within 100 microns of the surface and preferably within a few microns of the surface. The cleaved surface collects light which has reflected from the surface and that light plus light which has reflected from the cleaved surface without leaving the fiber, propagate back through fiber 15 towards coupler 43 (see the left hand arrowhead of arrow 49).
As shown by arrow 51, this backwards propagating light exits coupler 43 and is transmitted to high bandwidth (e.g., 40 Mhz) photodetector 33 by fiber 39. Because the light which reaches the photodetector is composed of the coherent superposition of light which has reflected from the cleaved end without leaving fiber 15 (the reference beam) and light which has left the fiber, reflected from surface 11, and reentered the fiber (the measurement beam), the output signal of the photodetector depends on the relative phases of those beams, which, in turn, depends on the distance between the cleaved end of the fiber and the surface.
In particular, for an input beam of intensity I0 in fiber 15, the beam which reflects from the cleaved end without leaving the fiber (the reference beam) will have an intensity (I1) of about 0.04•I0. This intensity is based on the Fresnel reflection coefficient R which, for normal incidence, is given by:
where n1 and n2 are the indices of refraction of the two media, which in this case are glass (n1≈1.5) and air (n2≈1.0).
The remaining 0.96•I0 is incident upon the substrate. For a glass substrate, reflection off the glass and again at the air-fiber interface leads to a beam (the measurement beam) of intensity I2≈0.037•I0 propagating back into the fiber coupler. The two beams superimpose, producing an interference pattern at photodetector 33 given by
I=I1+I2+2{square root}{square root over (I1I2)}cos δ (1)
where δ is the optical path length (OPL) difference between the two beams. In this case,
where d represents the spacing between the cleaved end of the fiber and the glass surface and λ is the wavelength of light produced by the laser diode. Additional reflections, say from the back side of a glass substrate, can be considered for higher order interference effects. In practice, these additional components can be minimized by using a short coherence length laser.
Assuming that the two beam intensities, I1 and I2, remain constant, the response of the system is given by
The most sensitive operating point of the interferometer is at quadrature (see reference number 55 in
In practice, a stable laser light source is used and so Δλ≈0 and enough phase resolution exists to discern variations in the separation between the fiber and the substrate surface at the angstrom level. It should be noted that compared to free-space optics, the fiber-based scanning interferometer of the present invention is substantially immune to thermal effects and vibrations in the common-path components, both of which can be present when inspection is being performed on newly-formed glass sheets since this may be at an elevated temperature. The compactness and immunity to phase distortions of the common-path interferometer make it ideal for an approach where a large number of independent interferometers is scanned over a surface. For example, no signal artifacts would be generated here by flexing the large bundle of fibers as the array is maneuvered over, for example, a 4 meter2 area.
For displacements greater than around λ/40, the non-linear phase relationship should be taken into account. A change in d of λ/4 corresponds to an interference “fringe” where the interference intensity passes through an extremum (see reference number 53 in
and varies between 0 and 1. Note that fringe visibility is independent of the signal-to-noise of the interferometer.
Such changes in polarization are characteristic of the nature of the surface defect and can allow identification of defect type, which is sometimes left ambiguous in a purely topographical map of a surface. Examples of defects which are capable of producing a polarization change include defects with high aspect ratios, such as, scratches and some bubbles, and defects at which the chemical nature of the surface changes, such as, platinum protrusions and certain stains. Topography alone may not always provide a full characterization of these types of defects.
As opposed to the system of
Other than the foregoing changes, the system of
For the system of
Using apparatus of the type shown in
The array may be scanned in either open or closed-loop modes. In both modes, the separation between each fiber and the substrate is monitored as a function of position along the scan and then used to generate a 3-dimensional contour map of the surface. In closed-loop scanning, the z-axis offset of the array is compared to a set-point value and maintained constant through sensitive motion control along the z-axis of motion control system 17 of
Closed-loop feedback is usually desirable in order to prevent accidental contact between the array and the surface due to a large variation in the height of the substrate, e.g., the presence of a large defect such as a glass chip or simply the sample tilt over large distances. Also, the sensitivity (that is, the visibility) of the interferometer varies with distance from the surface being inspected. Accordingly, for a sample with a tilt, the sensitivity can be greater at the beginning of a scan and decrease as the scan progresses, or vice versa. Closed-loop feedback avoids this problem by holding the distance between the cleaved ends of the fibers and the surface precisely constant throughout the scan. When closed-loop feedback is used, it can be based on a single fiber in the array or multiple fibers, as desired.
Without intending to limit it in any manner, the present invention will be more fully described by the experimental data of
The data of these figures was acquired using a single fiber system of the type shown in
The experiments were performed using open-loop scanning. Positioning of the fiber and analysis of the output of the photodetector were performed using the commercially available LABVIEW software package from National Instruments. The tests were performed using 0.7 mm thick samples of Code 1737G LCD glass sold by Corning Incorporated. The fiber used was CORNING PUREMODE HI 780 (Corning Incorporated, Corning, N.Y.), and the laser diode operated at a wavelength of 787 nanometers. The data of
As discussed above, a significant change in the distance between the cleaved end of a fiber and the surface being inspected alters the sensitivity of the interferometer. To adjust for this effect, the detector signal trace envelope was fit to a cubic spline to determine the top and bottom edges of the fringe pattern. The fit generated a variable scaling factor which was used to stretch the low-visibility data so that all the fringes would have the same peak-to-valley values.
In addition to the scaling, the surface map is preferably expressed in terms of real-world units. Thus, stepper motor encoder steps are preferably converted to millimeters using the encoder quadrature spacing as a calibration reference and detector volts are preferably converted to nanometers. This is done by taking the arccosine of the voltage signal and multiplying by a factor of λ/4π. The wavelength of the laser then serves as the built-in calibration of the interferometer.
The peaks and valleys of the resulting trace were then identified using a standard approach of differentiating the trace and finding the locations where the slope passes through zero. This approach finds both interferometric fringes and various smaller peaks (those between the min and max values) which represent actual surface details. Ultimately, the smaller peaks are of interest, but to find them, the interferometric fringes need to be removed (unfolded) from the data.
To eliminate the smaller peaks from consideration during the unfolding process, a series of logic conditions were applied to the series of peaks to identify peaks that were interferometric fringes. First, to be the result of an interferometric fringe, the peak must occur within a certain percentage of the min or max envelope (this is an adjustable parameter which was set to ˜80% in most cases). Second, in practice it has been found that peaks due to interferometric fringes can only occur with a certain frequency. Accordingly, if multiples of the same type of fringe (say, many peak fringes) occur in a small distance, these represent actual features and only the first fringe is unfolded. The dotted vertical lines in
To remove (unfold) the interferometric fringes from the data an assumption is made that the surface is sufficiently smooth so that all occurrences where the interferometer signal passes through a fringe indicate no actual change in the sign of the surface slope. That is, true features on the surface generate details on the interferometric trace which occur between the minimum and maximum of the signal values. The parts of the trace where the signal goes through a fringe (an extremum) actually indicate a continuation of the surface along the previous incline.
Each datum in the array is then added to or subtracted from the previous data such that the real features are preserved and the peaks due to interferometric fringes are removed. In particular, for small defects, e.g., defects of the type which exist on LCD glass, the topography is usually dominated by an overall sample tilt, i.e., an overall upwardly or downwardly sloping line for a one-dimensional scan or a sloping plane for a two-dimensional scan.
For a passive scan, the tilt causes the interferometer signal to undergo several fringes during a typical scan (see, for example,
Although this can be accomplished in various ways, one approach which has been found to work successfully in practice comprises first locating the peaks and valleys on each trace which correspond to extrema in the cosine term due to the overall slope. Then, each line trace is reconstructed point-by-point in order to remove the fringes.
The first step in the reconstruction is to functionally establish an initial slope to the trace using the first two data points. The height values for the trace are then preserved unchanged for the initial part of the line until the first peak (or valley) is encountered. From this point on, the data points are added or subtracted to the previous data set based on the slope of the particular fringe in which they occur. Table 2 sets forth a conceptual algorithm for this procedure assuming an original 1-dimensional array of height values indexed along position x (i.e., original_trace(x)) and a new “unfolded” array of height values, again indexed along position x (i.e., new_trace(x)). The results of using the procedure of Table 2 are shown in
As can be seen in this figure, the surface map exhibits an overall slope or tilt, with superimposed waviness. As indicated above, this overall slope or tilt is typical since topography data is usually dominated by an overall plane tilt, which can be due to stage, sample, and/or detector offsets.
To remove the tilt from the open-loop data of this experiment, a best fit line was subtracted from the plot of
From the foregoing, it can be seen that the invention provides methods and apparatus for inspecting large flat substrates for surface defects in a short amount of time. Through the use of a scanning imaging head which comprises a parallel array of all-fiber Fizeau (or Fabry-Perot type) interferometers, a large area topographic map of a surface can be generated with excellent height resolution, e.g., resolution down to the angstrom level. Because of the low cost and low complexity of creating a large size array and the high bandwidth of the detectors used to monitor the output of the interferometers, the time needed to prepare such a map is a small fraction of that of current surface imaging techniques.
Although specific embodiments of the invention have been described and illustrated, it is to be understood that modifications can be made without departing from the invention's spirit and scope. For example, although the preferred application of the invention is in the inspection of glass substrates, e.g., LCD substrates, flat substrates used in such areas as semiconductors and magnetic recording media can also be inspected using the methods and apparatus of the invention.
A variety of other modifications which do not depart from the scope and spirit of the invention will be evident to persons of ordinary skill in the art from the disclosure herein. The following claims are intended to cover the specific embodiments set forth herein as well as such modifications, variations, and equivalents.