The present disclosure relates to a heat conduction component, especially to a fiber-embedded vapor chamber structure.
A related-art vapor chamber is a vacuum chamber formed by an upper plate and a lower plate with a good thermal conductivity having the edges thereof being soldered and sealed. The interior of the chamber includes materials having a high thermal conducting performance, for example a capillary structure and a working fluid. After the vapor chamber is in contact with a thermal source, the thermal energy may be cooled by being rapidly transferred and diffused to a plate surface having a large area. As such, the vapor chamber has become one of the necessary thermal energy dissipating components.
For increasing the thermal energy exchanging efficiency in the vapor chamber, a capillary structure formed by sintered powders and a metal woven net is provided, and a manner of additionally disposing fibers to allow a liquidous working fluid to rapidly transfer may be also provided. However, supporting structures are disposed in the vapor chamber to maintain the space inside the chamber. After the supporting structures are distributed in the vapor chamber, the fibers may only be arranged in a space between each of the supporting structures, thus the space which has not been enough to allow the steam to flow is further reduced. As such, the vaporized working fluid is not provided with a sufficient steam flowing space to perform the heat conduction through phase changes.
Accordingly, the applicant of the present disclosure has devoted himself for improving the mentioned shortages.
The present disclosure is to provide a fiber-embedded vapor chamber structure, in which fibers are disposed below a part of supporters, and a space allowing the steam to flow is reserved between the supporters to maintain a sufficient steam space.
Accordingly, the present disclosure provides a fiber-embedded vapor chamber structure, which includes a lower plate, an upper plate engaged with the lower plate and a plurality of supporters disposed between the lower plate and the upper plate. The lower plate has a sealing edge surrounding a periphery of the lower plate, and a recessed zone surrounded by the sealing edge and disposed on an inner surface of the lower plate. A lower capillary layer is disposed on an inner wall of the recessed zone. The upper plate has an upper capillary layer disposed on a surface of the upper plate corresponding the lower plate. The upper plate and the sealing edge of the lower plate are correspondingly sealed: thus, the upper plate is sealed in the recessed zone of the lower plate. Each of the supporters is disposed in the recessed zone and respectively extended from the recessed zone towards the lower plate and the upper plate to make each of the supporters abut against the lower capillary layer and the upper capillary layer. At least one strip-shaped fiber layer is disposed in the recessed zone. The fiber layer is flatly attached on the lower capillary layer or the upper capillary layer and pressed by a part of the supporters. The fiber layer is hidden at a lower portion or an upper portion of the part of supporters. As such, a space between each of the supports in the recessed zone is reserved to make steam flow.
The features of the disclosure believed to be novel are set forth with particularity in the appended claims. The disclosure itself, however, may be best understood by reference to the following detailed description of the disclosure, which describes a number of exemplary embodiments of the disclosure, taken in conjunction with the accompanying drawings, in which:
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
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The lower plate 1 and the upper plate 2 are plate members made of a material such as aluminum or copper. The lower plate 1 has a sealing edge 10 surrounding a periphery of the lower plate 1, and a recessed zone 11 surrounded by the sealing edge 10 and disposed on an inner surface of the lower plate 1. A lower capillary layer 110 is disposed on an inner wall of the recessed zone 11, and the lower capillary layer 110 is formed by sintered powders or a woven net. A lower degassing end 12 protrudes from any side of the lower plate 1.
The upper plate 2 is mutually engaged with the lower plate 1. The upper plate 2 is formed in a flat plate status. An upper capillary layer 20 is disposed on a surface of the upper plate 2 corresponding the lower plate 1. The upper capillary layer 20 is formed by sintered powders or a woven net. The upper plate 2 and the sealing edge 10 of the lower plate 1 are correspondingly sealed to form a sealing status, thus the upper plate 2 is sealed in the recessed zone 11 of the lower plate 1. Moreover, an upper degassing end 21 protrudes from any side of the upper plate 2. The upper degassing end 21 is corresponding to the lower degassing end 12 of the lower plate 1, thus gas is discharged after the lower plate 1 and the upper plate 2 are sealed. After the gas is discharged, a penetrated hole formed between the lower degassing end 12 and the upper degassing end 21 is used to make a working fluid (not shown in figures) be filled in, thus the working fluid transfers thermal energy through phase changes in the recessed zone 11 located between the lower plate 1 and the upper plate 2.
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Accordingly, the fibbed-embedded vapor chamber structure of the present disclosure is assembled.
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According to the fiber-embedded vapor chamber structure provided by the present disclosure, the fiber layer 40 is disposed below a part of the supporters 3, the spaces between the supporters 3 of the recessed zone 11 and the supporters 3a of the convex platform 100 are reserved to make the steam to flow through, thus the space allowing the steam to flow is sufficiently maintained. Moreover, the function of transferring provided by the fiber layer 40 is kept.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.