This application is related to commonly-assigned applications entitled, “METHOD FOR MANUFACTURING FIELD EMISSION ELECTRON SOURCE HAVING CARBON NANOTUBES”, filed **** (Atty. Docket No. US18587); “CARBON NANOTUBES NEEDLE AND METHOD FOR MAKING THE SAME”, filed **** (Atty. Docket No. US18588); “ELECTRON EMISSION APPARATUS”, filed **** (Atty. Docket No. US18178); “ELECTRON EMISSION APPARATUS AND METHOD FOR MAKING THE SAME”, filed **** (Atty. Docket No. US18177). The disclosure of the respective above-identified application is incorporated herein by reference.
1. Field of the Invention
The invention relates to a field emission electron source employing carbon nanotubes.
2. Discussion of Related Art
Carbon nanotubes (CNTs) produced by means of arc discharge between graphite rods were first discovered and reported in an article by Sumio Iijima, entitled “Helical Microtubules of Graphitic Carbon” (Nature, Vol. 354, Nov. 7, 1991, pp. 56-58). CNTs also feature extremely high electrical conductivity, very small diameters (much less than 100 nanometers), large aspect ratios (i.e. length/diameter ratios greater than 1000), and a tip-surface area near the theoretical limit (the smaller the tip-surface area, the more concentrated the electric field, and the greater the field enhancement factor). These features tend to make CNTs ideal candidates for field emission electron sources.
Generally, a field emission electron source having CNTs includes a conductive base, along with CNTs formed on the conductive base. The CNTs act as an emitter of the field emission electron source. The methods adopted for forming the CNTs on the conductive base mainly include mechanical methods and in situ synthesis methods. The mechanical method is performed by respectively placing a single CNT on a conductive base by an atomic force microscope (AFM), subsequently fixing the CNT on the conductive base by conductive or non-conductive adhesives. However, the controllability of the mechanical method is not as desirable because a single CNT is too small in size. As a result, the single CNT will easily be drawn away from the conductive base due to the electric field force. Otherwise, that would damage the field emission electron source and/or decrease its performance.
The in-situ synthesis method is performed by coating metal catalysts on a conductive base and synthesizing CNTs on the conductive base directly by means of chemical vapor deposition (CVD). However, the mechanical connection between the CNTs and the conductive base generally is relatively weak and, thus, unreliable. In use, such CNTs are also easily drawn away from the conductive base due to the electric field force, which would damage the field emission electron source and/or decrease its performance. Furthermore, the shield effect between adjacent CNTs may reduce the field emission efficiency thereof.
What is needed, therefore, is a field emission source with a high field emission efficiency, along with a controllable method for manufacturing the field emission source.
In one embodiment, a field emission electron source includes a CNT needle and a conductive base. The CNT needle has an end portion and a broken end portion; the end portion is contacted with and electrically connected to a surface of the conductive base. The CNTs at the broken end portion form a taper-shaped structure, wherein one CNT protrudes and is higher than the adjacent CNTs.
Compared to conventional technologies, the field emission electron source provided by the present method has the following advantages: firstly, the CNT needle having a larger scale than the CNT is used as the electron emitter and, thus, the CNT needle is not easily drawn away from the conductive base due to the electric field force. As a result, the present emission electron source is more substantial. Furthermore, the electric and thermal conductivity, and mechanical strength of the CNT needle are better than the single CNT. As a result, the field emission efficiency of the field emission electron source is improved.
Other advantages and novel features of the present field emission source will become more apparent from the following detailed description of exemplary embodiments when taken in conjunction with the accompanying drawings.
Many aspects of the present field emission source can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present field emission source.
Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate at least one preferred embodiment of the present method, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
References will now be made to the drawings to describe the exemplary embodiments of the present method for manufacturing a field emission electron source, in detail.
Referring to
The CNT needle 12 is a CNT bundle. Each carbon nanotube bundle includes a plurality of continuously oriented and substantially parallel carbon nanotubes joined end-to-end by van der Waals attractive force. A diameter of the CNT needle 12 approximately ranges from 1 to 20 microns (μm), and a length thereof ranges from 0.01 to 1 millimeters (mm). Referring to
Referring to
In step (a), the CNT film is formed by the following substeps: (a1) providing a CNT array; and (a2) drawing CNT segments having a predetermined width from the super-aligned CNTs array at an even/uniform speed to achieve a uniform carbon nanotube film.
In step (a1), initially, a substrate is provided, and the substrate is a P-type silicon or N-type silicon substrate. Secondly, a catalyst layer is deposited on the substrate. The catalyst layer is made of a material selected from a group consisting of iron (Fe), cobalt (Co), nickel (Ni), and their alloys. Thirdly, the substrate with the catalyst layer is annealed at a temperature approximately ranging from 700 to 900 degrees centigrade (° C.) under a protecting gas for approximately 30 minutes to 90 minutes. Fourthly, the substrate with the catalyst layer is heated to a temperature approximately ranging from 500° C. to 740° C. and a mixed gas including a carbon containing gas and a protecting gas is introduced for approximately 5 to 30 minutes to grow a super-aligned CNTs array. The carbon containing gas is a hydrocarbon gas, such as acetylene or ethane. The protecting gas is an inert gas. The grown CNTs are aligned in columns parallel to each other and held together by van der Waals force interactions therebetween. The CNTs array has a high density and each of the CNTs has an essentially uniform diameter.
In step (a2), the CNT segment having a predetermined width includes a plurality of CNTs parallel to each other. The CNT segment is gripped by using an adhesive tape such as the tool to contact the super-aligned array. The pulling direction is substantially perpendicular to the growing direction of the super-aligned array of carbon nanotubes.
In step (b), the first electrode and the second electrode are insulated and separated from each other, a distance between the first electrode and the second electrode ranges from 50 micrometers to 1 millimeter.
Referring to
Referring to
In step (d1), the chamber 20 is a vacuum or filled with an inert gas. A diameter of the CNT string 28 approximately ranges from 1 to 20 micrometers, and a length thereof approximately ranges from 0.05 millimeters to 1 millimeter. In the present embodiment, the vacuum chamber 20 is a vacuum and the pressure thereof is lower than 1×10−1 Pascal (Pa).
In step (d2), the voltage can be set according to a diameter and/or a length of the CNT strings 28. In the present embodiment, when a length of the CNT string 28 is 300 μm and a diameter thereof is 2 μm, the voltage is 40 voltage (V). A vacuum of the chamber 20 is less than 2×10−5 Pascal (Pa). In the present embodiment, a vacuum of the chamber 20 is 2×10−5 Pa.
Referring to
Referring to
The CNTs at the broken end portion have smaller diameters and a fewer number of walls, typically, less than 5 nanometers (nm) in diameter and have about 2-3 walls. However, the CNTs in the CNT needle 12 other than the break-end portion are about 15 nm in diameter and more than 5 in wall. It is concluded that the diameter and the number of the walls of the CNTs are decreased in the vacuum breakdown process. A wall-by-wall breakdown of CNTs is due to Joule-heating at a temperature higher than 2000K, with a current decrease process. The high-temperature process can efficiently remove the defects in CNTs and, consequently, improve electric and thermal conductivities and mechanical strength thereof.
The CNT needle 12 has improved field emission efficiency, because of good electric and thermal conductivities, and mechanical strength. Moreover, the break-end portion is in the taper-shaped structure. That can prevent the shield effect caused by the adjacent CNTs, consequently, the field emission efficiency of the CNT needle 12 is further improved.
Referring to
In step (e1), the three-DOF translational machine can move accurately in the three-DOF, and as a result, the conductive base 14 can move accurately in the three-DOF.
Step (e2) can be executed under a microscope to observe and control the distance between the CNT needle 12 and the conductive base 14 more acutely.
After the CNT needle 12 is attached to the conductive base 14, the field emission electron source 10 is formed. The conductive base 14 is made of an electrically conductive material, such as nickel, copper, tungsten, gold, molybdenum or platinum. The conductive base 14 is an insulated base with a conductive film formed thereon. The size of the CNT needle 12 is so tiny that the CNT needle 12 will be destroyed when a mechanical tool is used to cut the CNT needle 12 directly.
Referring to
In step (f1), The support 16 is a linear structure, a diameter thereof approximately ranges from 50 μm to 200 μm. A thickness of the conductive adhesive 18 approximately ranges from 5 μm to 50 μm. In the present embodiment, the support 16 is a fiber, a diameter of the fiber is 125 μm, a thickness of the lay of conductive adhesive 18 is 125 μm, and the conductive adhesive 18 is a silver paste.
Step (f3) is operated under the microscope. Since the conductive adhesive 14 is a silver paste, and part of the field emission source 10 enters the layer of conductive adhesive, the conductive adhesive 18 is adhered to the joint of the CNT needle 12 and the conductive base 14 when the field emission electron source 10 is moved slowly. As there is intermolecular force between the CNT needle 12 and the conductive base 14, the CNT needle 12 will not depart from the conductive base 14.
In step (f4), the organic component in the conductive adhesive 18 is removed, and as the conductive adhesive 18 becomes solid, the CNT needle 12 is firmly fixed on the conductive base 14.
Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Number | Date | Country | Kind |
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200810066123.X | Mar 2008 | CN | national |