Claims
- 1. A semiconductor device manufacturing system comprising:a hermetically sealed reflow chamber capable of being evacuated; semiconductor substrate holding means rotatively mounted in said hermetically sealed reflow chamber and having a holding surface for holding a semiconductor substrate substantially perpendicular to a rotation radius direction; driving means for rotating said semiconductor substrate holding means; and semiconductor substrate heating means for solely heating said semiconductor substrate held by said semiconductor substrate holding means without depositing a substance on said semiconductor substrate.
- 2. A semiconductor device manufacturing system according to claim 1, wherein said semiconductor substrate holding means includes a drum having a radius in a range from about 10 cm to about 50 cm.
- 3. A semiconductor device manufacturing system according to claim 1, wherein said driving means rotates said semiconductor substrate holding means at a rotation speed in a range from about 10 rpm to about 100,000 rpm.
- 4. A semiconductor device manufacturing system according to claim 1, wherein said driving means rotates said semiconductor substrate holding means at a rotation speed in a range from about 10 rpm to about 10,000 rpm.
- 5. A semiconductor device manufacturing system according to claim 1, wherein said driving means rotates said semiconductor substrate holding means at a rotation speed in a range from about 100 rpm to about 100,000 rpm.
- 6. A semiconductor device manufacturing system according to claim 1, wherein said semiconductor substrate holding means rotates said semiconductor substrate about a horizontal axis.
- 7. A semiconductor device manufacturing system according to claim 1, wherein said semiconductor substrate holding means rotates said semiconductor substrate about a vertical axis.
- 8. A semiconductor device manufacturing system according to claim 1, wherein said semiconductor substrate holding means holds the semiconductor substrate with a front surface thereof directed to a center of rotation.
- 9. A semiconductor device manufacturing system according to claim 1, further comprising:a deposition system for depositing a metal layer on a front surface of the substrate; and a substrate transport system capable of transporting the semiconductor substrate from the deposition system to the reflow chamber. substrate holding means rotatively mounted in said hermetically sealed reflow chamber and having a holding surface for holding a semiconductor substrate substantially perpendicular to a rotation radius direction; driving means for rotating said semiconductor substrate holding means; and semiconductor substrate heating means for solely heating said semiconductor substrate held by said semiconductor substrate holding means without depositing a substance on said semiconductor substrate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-026794 |
Feb 1995 |
JP |
|
Parent Case Info
This is a divisional of application Ser. No. 08/599,646, filed Feb. 12, 1996, U.S. Pat. No. 6,130,158.
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