Reflowing or applying of pressure to better fill the contact hole

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H01L21/76882

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76882Reflowing or applying of pressure to better fill the contact hole

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including laser treatm...
- Patent number 12,009,255
- Issue date Jun 11, 2024
- RNR LAB INC.
- Jeong Do Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire layer
- Patent number 11,978,667
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaixuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,894,437
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 11,854,878
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive powder formation method and device for forming conductiv...
- Patent number 11,819,923
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Magnetically enhanced high density plasma-chemical vapor deposition...
- Patent number 11,821,068
- Issue date Nov 21, 2023
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFET structure with controlled air gaps
- Patent number 11,804,402
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods and apparatuses for forming the...
- Patent number 11,694,899
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene with short liner
- Patent number 11,664,271
- Issue date May 30, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench filling through reflowing filling material
- Patent number 11,605,555
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,569,126
- Issue date Jan 31, 2023
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing multilayer stack including copper over feature...
- Patent number 11,562,925
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Shirish Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for intermixing layer for enhanced metal reflow
- Patent number 11,527,437
- Issue date Dec 13, 2022
- Applied Materials, Inc.
- Lanlan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 11,469,139
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,437,271
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Yixiong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,373,903
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced low temperature-high density plasma-chemical...
- Patent number 11,306,391
- Issue date Apr 19, 2022
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetically enhanced high density plasma-chemical vapor deposition...
- Patent number 11,286,555
- Issue date Mar 29, 2022
- IonQuest Corp.
- Bassam Hanna Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically and magnetically enhanced ionized physical vapor depos...
- Patent number 11,255,012
- Issue date Feb 22, 2022
- IonQuest Corp.
- Bassam Hanna Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET isolation structure and method for fabricating the same
- Patent number 11,251,181
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038095
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL
- Publication number 20240379407
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240332075
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240234235
- Publication date Jul 11, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION
- Publication number 20240222224
- Publication date Jul 4, 2024
- GLOBALFOUNDRIES U.S. Inc.
- SIVA P. ADUSUMILLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240203883
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seungyong Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM METAL LINERS FOR INTERCONNECTS
- Publication number 20240153816
- Publication date May 9, 2024
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240136245
- Publication date Apr 25, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20240096998
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240079270
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071823
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FORMING CONDUCTIVE POWDER
- Publication number 20230381862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FINFET STRUCTURE WITH CONTROLLED AIR GAPS
- Publication number 20230386904
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20230386917
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20230317459
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chun-Hsu Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF
- Publication number 20230307293
- Publication date Sep 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Filling Through Reflowing Filling Material
- Publication number 20230215758
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH LINER THAT RESONATES DURING MICROWAVE ANNEAL
- Publication number 20230133484
- Publication date May 4, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20230122969
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-LAYER METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP
- Publication number 20230101229
- Publication date Mar 30, 2023
- ASM IP HOLDING B.V.
- Hannu Huotari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR COPPER DOPED HYBRID METALLIZATION FOR LINE AND VIA
- Publication number 20230005789
- Publication date Jan 5, 2023
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20220367660
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...
- Publication number 20220367265
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Reflowing or applying of pressure to better fill the contact hole

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for copper doped hybrid metallization for line and via

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Method of manufacturing semiconductor device including laser treatm...

Doped selective metal caps to improve copper electromigration with...

Method for manufacturing wire layer

Methods and apparatus for forming dual metal interconnects

Vias for cobalt-based interconnects and methods of fabrication thereof

Hybrid conductive structures

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Bi-layer alloy liner for interconnect metallization and methods of...

Conductive powder formation method and device for forming conductiv...

Magnetically enhanced high density plasma-chemical vapor deposition...

FinFET structure with controlled air gaps

Interconnect structures and methods and apparatuses for forming the...

Stepped top via for via resistance reduction

Dual damascene with short liner

Trench filling through reflowing filling material

Interconnect wires including relatively low resistivity cores

Method of depositing multilayer stack including copper over feature...

Methods and apparatus for intermixing layer for enhanced metal reflow

Bottom-up formation of contact plugs

Seamless gap fill

Doped selective metal caps to improve copper electromigration with...

Cobalt based interconnects and methods of fabrication thereof

Magnetically enhanced low temperature-high density plasma-chemical...

Magnetically enhanced high density plasma-chemical vapor deposition...

Electrically and magnetically enhanced ionized physical vapor depos...

FinFET isolation structure and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

BOTTOM-UP FORMATION OF CONTACT PLUGS

GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION

INTEGRATED CIRCUIT DEVICE

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

METHODS TO FORM METAL LINERS FOR INTERCONNECTS

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

HYBRID CONDUCTIVE STRUCTURES

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION

DEVICE FOR FORMING CONDUCTIVE POWDER

FINFET STRUCTURE WITH CONTROLLED AIR GAPS

Bottom-up Formation of Contact Plugs

Interconnect Structures and Methods and Apparatuses for Forming the...

SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF

Trench Filling Through Reflowing Filling Material

INTERCONNECTS WITH LINER THAT RESONATES DURING MICROWAVE ANNEAL

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

METHOD OF DEPOSITING LAYERS

MULTIPLE-LAYER METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP

METHODS FOR COPPER DOPED HYBRID METALLIZATION FOR LINE AND VIA

HYBRID CONDUCTIVE STRUCTURES

Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...