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Reflowing or applying of pressure to better fill the contact hole
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Industry
CPC
H01L21/76882
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/76882
Reflowing or applying of pressure to better fill the contact hole
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