1. Field of the Disclosure
The present disclosure relates to a technical field of film thickness testing, in particular to a film removing device.
2. Description of the Prior Art
It needs to remove a portion of PI during the process of testing film thickness of a liquid crystal orientation layer PI by a step altimeter, and then the thickness of film can be determined according to a segment difference of the film thicknesses of the same layer. During the process of sample fabrication, because the etched position cannot be precisely determined, the removed position of film does not have distinct boundary. Therefore, the equipment cannot test the thickness of the film accurately.
The present disclosure relates to a film removing device. The film removing device can make the film have a distinct boundary after removing part of the film, so that the accuracy of film thickness test can be improved.
In order to achieve the above object, the present disclosure provides a film removing device. The film removing device includes a base, a carrying platform and a first baffle. A face of the carrying platform facing way from the base is bearing face. The carrying platform is mounted on the base. A first side edge and a second side edge of the carrying platform are opposite to each other. The first side edge is in parallel to a surface of the base facing towards the carrying platform. In the direction from the first side edge towards the second side edge, the distance between the bearing surface and the base can be increased. The first baffle is mounted on the carrying platform and located on a side of the carrying platform facing away from the base. The first baffle has a sealing face, which is hermetically matched with a face of a substrate to be processed facing away from the carrying platform when the substrate to be processed is placed on the bearing surface; and a notch, inner walls of which are cooperated with the face of the substrate to be processed facing away from the carrying platform when the substrate to be processed is placed on the bearing surface so as to form a collecting slot opening to the first side edge of the bearing surface. The inner walls of the notch have a stop face facing towards the first side edge. The stop face is in connection with the sealing face and the stop face forms a bottom face of the collecting slot opposite to the opening. The first baffle has a number of liquid guiding holes formed therein. The opening at one end of each of the liquid guiding holes is located at a side of the first baffle facing away from the carrying platform, and the opening at the other end is located at an inner wall of the notch.
When the film removing device is used to remove film, first, the substrate to be processed is flatly placed on the carrying platform, and the sealing face of the first baffle is hermetically matched with a face of the substrate facing away from the carrying platform. The inner walls of the notch are cooperated with the face of the substrate facing away from the carrying platform to form a collecting slot opening towards the first side edge of the bearing surface. The inner walls of the notch are provided with a stop face facing towards the first side edge of the bearing surface. When the etchant is introduced from the openings of the liquid guiding holes located at the side of the first baffle facing away from the carrying platform, the etchant can flow out from the openings of the liquid guiding holes located at the other end of the inner walls of the notch and can be collected in the collecting slot. Because in the direction from the first side edge towards the second side edge, the distance between the bearing surface and the base can be increased, that is, the bearing surface is gradually raised along the direction from the first side edge towards the second side edge, the etchant in the collecting slot can flow from the stop face towards the first side edge of the carrying platform towards which the stop face is facing. Therefore, the etchant can remove the film of the substrate when it passes by. In this way, the removed portion of the film can have distinct removed boundary at the stop face, so when the thickness of the film is determined based on segment difference, the tested thickness of the film can be more accurate.
In an embodiment, the carrying platform is provided with a slideway extending along the direction perpendicular to the first side edge. The first baffle can be mounted in the slideway in a way that the first baffle can slide along the extending direction of the slideway by means of a locking mechanism.
In an embodiment, the slideway is a slideway hole through the thickness direction of the carrying platform.
In an embodiment, the locking mechanism can be locking screw. The screw shaft of the locking screw can be in threaded fit with the first baffle through the slideway hole. A face of the screw cap of the locking screw facing towards the carrying platform is abutted against a surface of the carrying platform facing away from the bearing surface.
In an embodiment, the bearing surface of the carrying platform is formed with a first graduated scale whose graduations extend along a direction perpendicular to the first side edge of the bearing surface.
In an embodiment, the film removing device also includes a second graduated scale mounted on the first baffle. The second graduated scale and the first graduated scale can be matched to form a vernier caliper structure. The projection of the zero graduation line of the second graduated scale on the bearing surface is in the same line with the projection of the stop face on the bearing surface. It can be followed that the projection of the intersection line between the stop face and the surface of the substrate facing away from the carrying platform is in the same line with the projection of the zero graduation line of the second graduated scale on the bearing surface.
In an embodiment, the film removing device also includes a microscope mounted on the first graduated scale for reading the aligned state of graduations of the second graduated scale and the first graduated scale to obtain the readings of the vernier caliper. Because the projection of the intersection line between the stop face and the surface of the substrate to be processed facing away from the carrying platform is in the same line with the projection of the zero graduation line of the second graduation scale on the bearing surface, the position of the intersection line between the stop face and the surface of the substrate to be processed, that is, the initial position of the removed film, can be obtained, so that precise controlling and positioning of the initial position of the removed film can be achieved.
In an embodiment, the liquid guiding holes can be tapering through holes. The axis of the tapering through hole is perpendicular to plane where the bearing surface of the carrying platform is located. In the direction from the openings of the side of the first baffle facing away from the carrying platform towards the opening at the inner wall of the notch, the diameter of the tapering through hole is gradually decreased.
In an embodiment, at the first side edge of the bearing surface, the carrying platform is pivotally mounted on the base through a pivot shaft. The axis of the pivot shaft is parallel to the first side edge. A lifting device is connected between the base and the carrying platform to drive the carrying platform to rotate around the pivot shaft. The inclination of the bearing surface of the carrying platform can be controlled by the lifting device, so that the flow rate of the etchant from the stop face to the first side edge of the carrying platform towards which the stop face is facing can be controlled to make the removing of the film be more uniform.
In an embodiment, the film removing device also includes a second baffle mounted on the carrying platform and located on a side of the carrying platform facing away from the base. The side face of the second baffle facing towards the first baffle is in parallel to the stop face of the first baffle, and the second baffle is located at a side of the first baffle facing towards the first side edge of the bearing surface. By providing the second baffle, the removed portion of the film can be defined between the first baffle and the second baffle, defining the width of the removed film.
The technical solution in the embodiments of the present disclosure will be fully and clearly described in more detail in conjunction with the attached drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, nor all embodiments. Based on the embodiments of the present disclosure, all other embodiments envisioned by those skilled in the art without creative work are within the protection scope of the present disclosure.
Please refer to
As shown in
When the film removing device is used to remove film, first, the substrate 9 to be processed is flatly placed on the carrying platform 2, and the sealing face of the first baffle 4 is hermetically matched with the face of the substrate 9 facing away from the carrying platform. The inner walls of the notch 41 are cooperated with the face of the substrate 9 facing away from the carrying platform 2 to form a collecting slot opening towards the first side edge 23 of the bearing surface. The inner walls of the notch 41 are provided with a stop face 411 facing towards the first side edge 23. When etchant is introduced from the openings of the liquid guiding holes 42 located at the side of the first baffle 4 facing away from the carrying platform 2, the etchant can flow out from the openings at the other end of the liquid guiding holes 42 located at an inner wall of the notch 41 and can be collected in the collecting slot. Because in the direction from the first side edge 23 towards the second side edge, the distance between the bearing surface of the carrying platform 2 and the base 1 can be increased, that is, the bearing surface is gradually raised along the direction from the first side edge 23 towards the second side edge, the etchant in the collecting slot can flow from the stop face 411 to the first side edge 23 of the carrying platform towards which the stop face 411 is facing. Therefore, the etchant can remove the film on the substrate 9 when it passes by. In this way, the removed portion of the film can have distinct removed boundary at the stop face 411, so when the thickness of the film is determined based on the segment difference, the tested thickness of the film can be more accurate.
As shown in
By providing the second baffle 7, the removed portion of the film can be defined between the first baffle 4 and the second baffle 7, defining the removed extent of the film.
Please refer to
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In a specific embodiment, the slideway 21 can be slideway hole through the thickness direction of the carrying platform 2. As shown in
The locking mechanism can be locking screw, as shown in
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A microscope 6 is mounted on the second graduated scale 5 and can slide along the graduation direction of the second graduated scale 5 to read the aligned state of a certain graduation point on the second graduated scale 5 with a graduation on the first graduated scale 22.
The readings of the vernier caliper can be obtained by observing the aligned state of the graduations of the second graduated scale 5 and the first graduated scale 22 through the microscope 6. Because the projection of the intersection line between the stop face 411 and the surface of the substrate 9 to be processed facing away from the carrying platform 2 is in the same line with the projection of the zero graduation line of the second graduation scale 5 on the bearing surface, it can be followed that the position of the intersection line between the stop face 411 and the surface of the substrate 9 to be processed facing away from the carrying platform 2, that is, the initial position of the removed film, can be determined. Therefore, a precise controlling and positioning of the initial position of the removed film can be achieved.
As to how to precisely determine the initial position of the removed film by using the first graduated scale 22 and the second graduated scale 5, the following will be described with reference to
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With reference to
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The inclination of the bearing surface of the carrying platform 2 can be controlled by means of the lifting device 3, so that the flow rate of the etchant from the stop face 311 to the first side edge 23 of the bearing surface towards which the stop face 411 is facing can be controlled, and the removing of the film can be more uniform.
Obviously, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present disclosure. In this way, if those modifications and variations are within the scope of the claims of the present disclosure and its equivalents, the present disclosure is meant to include those modifications and variations.
Number | Date | Country | Kind |
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201410289294.4 | Jun 2014 | CN | national |