The present invention relates to a fine adjustment device for adjusting a height or an inclination of a chuck table and to a processing apparatus including the fine adjustment device.
As disclosed in Japanese Patent Laid-Open No. 2002-001653 and Japanese Patent Laid-Open No. 2008-264913, a grinding apparatus that grinds a workpiece held on a holding surface of a chuck table by use of a grindstone includes fine adjustment devices for adjusting an inclination of the chuck table such that the holding surface becomes parallel to a lower surface of the grindstone.
Such fine adjustment devices rotate screw support columns supporting the chuck table by motors, and, by screwing-in of the screw support columns, the chuck table is pressed upward or pressed downward to modify the inclination of the chuck table.
Conventionally, when the chuck table is lowered, rotation of the screw support columns in the direction for lowering the chuck table may cause the chuck table to be lowered excessively, and, by the excessive amount, the screw support columns are rotated in the direction for raising the chuck table to raise the chuck table (backlash adjustment). Therefore, there has been a problem that it takes time to adjust the inclination of the chuck table.
Accordingly, an object of the present invention is to provide a fine adjustment device for a chuck table that can shorten the adjustment time and a processing apparatus including the fine adjustment device.
In accordance with an aspect of the present invention, there is provided a fine adjustment device that is interposed between a table base rotatably supporting a chuck table for holding a workpiece on a holding surface and a base supporting the table base and that adjusts a distance between the table base and the base. The fine adjustment device includes a support member that has an upper section and an intermediate section and a lower section, with the upper section fixed to the table base and with the intermediate section fixed to the base; an accommodating chamber formed in the support member; a piezoelectric actuator that is accommodated in the accommodating chamber and is capable of contracting and extending in a perpendicular direction; and a contraction-extension structure in which first slits for cutting the intermediate section partially from a first side and second slits for cutting the intermediate section partially from a side opposite to the first side are alternately formed in plurality, whereby the accommodating chamber is capable of being contracted and extended in the perpendicular direction. By controlling a voltage supplied to the piezoelectric actuator, the piezoelectric actuator is contracted and extended, and the contraction-extension structure is contracted and extended to enable the distance between the base and the table base to be changed.
Preferably, a plurality of the fine adjustment devices are disposed between the table base and the base at intervals in a circumferential direction, and, by finely adjusting the plurality of fine adjustment devices, an inclination of the holding surface of the chuck table mounted on the table base is adjusted. Preferably, the abovementioned fine adjustment device further includes a compression spring mechanism that compresses the contraction-extension structure.
In accordance with another aspect of the present invention, there is provided a processing apparatus including a chuck table that holds a workpiece on a holding surface; a processing unit that has a processing tool disposed in a rotatable manner and that processes the workpiece held on the holding surface of the chuck table; a control unit; and a fine adjustment device that is interposed between a table base rotatably supporting the chuck table and a base on which the table base is disposed and that adjusts a distance between the table base and the base. The fine adjustment device includes a support member that has an upper section and an intermediate section and a lower section, with the upper section fixed to the table base and with the intermediate section fixed to the base; an accommodating chamber formed in the support member; a piezoelectric actuator that is accommodated in the accommodating chamber and is capable of contracting and extending in a perpendicular direction; and a contraction-extension structure in which first slits for cutting the intermediate section partially from a first side and second slits for cutting the intermediate section partially from a side opposite to the first side are alternately formed in plurality, whereby the accommodating chamber is capable of being contracted and extended in the perpendicular direction. The control unit controls a voltage supplied to the piezoelectric actuator of the fine adjustment device, to thereby contract and extend the piezoelectric actuator, whereby an inclination of the holding surface of the chuck table mounted on the table base in a rotatable manner is capable of being adjusted.
Preferably, the processing unit includes a rotatable grinding wheel on which a plurality of grindstones are arranged in an annular pattern. The processing apparatus further includes a motor that rotates a rotary shaft of the chuck table around the holding surface, and an encoder that detects a rotational angle of the rotary shaft. The control unit controls a voltage supplied to the piezoelectric actuator according to the rotational angle detected by the encoder, to thereby change the inclination of the holding surface of the chuck table according to the rotational angle and to grind the workpiece by the grindstones.
Since the fine adjustment device of the present invention has high responsiveness due to an elastic structure composed of a plurality of slits formed in the intermediate section of the support member, it is possible to modify the inclination of the holding surface of the chuck table and to modify the height position of the holding surface in a short time as compared to the existing adjustment shafts. In addition, since the fine adjustment device uses the piezoelectric actuator, it is possible to extremely minutely adjust the distance between the table base and the base. Further, since the fine adjustment device has the compression spring mechanism, the whole length thereof can be shortened, and a reduction in size of the processing apparatus can be realized.
The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claims with reference to the attached drawings showing a preferred embodiment of the invention.
A processing apparatus 1 depicted in
On a side surface on a −Y direction side of the column 11, a processing feeding mechanism 4 that supports the processing unit 3 in the manner of being liftable upward and downward is disposed. The processing unit 3 is, for example, a grinding unit that includes a spindle 32 having a rotational axis 35 in a Z-axis direction, a housing 31 supporting the spindle 32 in a rotatable manner, a spindle motor 30 rotationally driving the spindle 32 around an axis in the Z-axis direction, a mount 33 connected to a lower end of the spindle 32, and a grinding wheel 34 detachably mounted to a lower surface of the mount 33.
The grinding wheel 34 includes a wheel base 341, and a plurality of substantially rectangular parallelepiped grindstones 340 arranged in an annular pattern on a lower surface of the wheel base 341. The grindstones 340 are processing tools that process the workpiece 14. Lower surfaces 342 of the grindstones 340 are grinding surfaces making contact with the workpiece 14.
With the spindle 32 rotated by use of the spindle motor 30, the mount 33 connected to the spindle 32 and the grinding wheel 34 mounted to the lower surface of the mount 33 are rotated as one body.
The processing feeding mechanism 4 includes a ball screw 40 having a rotational axis 45 in the Z-axis direction, a pair of guide rails 42 disposed in parallel to the ball screw 40, a Z-axis motor 42 that rotates the ball screw 40 around the rotational axis 45, a lifting plate 43 having a nut inside in screw engagement with the ball screw 40 and having side portions in sliding contact with the guide rails 41, and a holder 44 connected to the lifting plate 43 and supporting the processing unit 3.
When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 is rotated around the rotational axis 45, the lifting plate 43 is moved in the manner of being lifted upward and downward in the Z-axis direction while guided by the guide rails 41 attendant on this, and the processing unit 3 held by the holder 44 is moved in the Z-axis direction.
A scale 470 is disposed on a side surface on the −Y direction side of the guide rail 41, and a reading section 471 is disposed on a side surface on a +X direction side of the lifting plate 43. The reading section 471 has, for example, an optical recognition mechanism or the like for reading the graduation value formed on the scale 470, and can recognize the graduation of the scale 470 and can recognize the height position of the processing unit 3.
A holding unit 2 is disposed on the base 10. The holding unit 2 includes a chuck table 20 that holds the workpiece 14. The chuck table 20 includes a disk-shaped suction section 21 and a frame body 22 that supports the suction section 21. An upper surface of the suction section 21 is a holding surface 210 on which to hold the workpiece 14, and an upper surface 220 of the frame body 22 is formed flush with the holding surface 210.
In addition, the holding unit 2 includes a motor 260 that rotates the chuck table 20 around a center 2100 of the holding surface 210, and an encoder 261 that detects a rotational angle of the chuck table 20. While detecting the rotational angle of the chuck table 20 by use of the encoder 261, the chuck table 20 can be rotated by use of the motor 260.
At a position adjacent to the chuck table 20, a thickness measuring unit 18 for measuring a thickness of the workpiece 14 is disposed. The thickness measuring unit 18 has, for example, contact-type height gauges or the like, and the height gauges are brought into contact with an upper surface 140 of the workpiece 14 and the upper surface 220 of the frame body 22 to measure the difference between the heights of the upper surfaces, whereby the thickness of the workpiece 14 can be measured.
In addition, in the periphery of the chuck table 20, a cover 27 is disposed. The cover 27 is connected to a bellows 28 in such a manner as to be contractable and extendable. When the chuck table 20 is horizontally moved in the Y-axis direction, the cover 27 is moved in the Y-axis direction as one body with the chuck table 20, whereby the bellows 28 is contracted or extended.
In the inside of the base 10, an internal base 100 is disposed. A horizontal moving mechanism 5 for moving the chuck table 20 in a horizontal direction is disposed on the internal base 100. The horizontal moving mechanism 5 includes a ball screw 50 having a rotational axis 55 in the Y-axis direction, a Y-axis motor 52 for rotating the ball screw 50 around the rotational axis 55, a pair of guide rails 51 disposed in parallel to the ball screw 50, and a base 53 having a nut at a bottom portion in screw engagement of the ball screw 50 and moved in the Y-axis direction along the guide rails 51. With the ball screw 50 rotated by use of the Y-axis motor 52, the base 53 is moved horizontally in the Y-axis direction while guided by the guide rails 51.
The chuck table 20 is rotatably supported on a table base 23. The table base 23 is formed in an annular shape as depicted in
The chuck table 20 is supported by, for example, three fine adjustment devices 7. Each fine adjustment device 7 includes a support member 70 extending in the Z-axis direction as depicted in
The upper sections 700 are formed with screw holes 701 for screw engagement with set screws 29. For example, as depicted in
As depicted in
As depicted in
As illustrated in
As depicted in
The fine adjustment device 7 includes a contraction-extension structure section 8 that includes the plurality of slits 73 formed in the support member 70 and a compression spring mechanism 80.
The compression spring mechanism 80 includes two through-holes 74 formed on the +Y direction side and the −Y direction side of the accommodating chamber 72 in the inside of the support member 70.
In addition, the compression spring mechanism 80 includes bolts 82 for engagement with the through-holes 74. The bolt 82 includes a shaft section 820 extending in the Z-axis direction, and a flange section 822 formed at a lower end of the shaft section 820. The shaft section 820 is formed in such a size as to be able to go into the upper section 740 and the middle section 742 of the through-hole 74, while the flange section 822 is formed in such a size as to be able to go into the lower section 744 of the through-hole 74.
A male screw 821 corresponding to the female screw 741 is formed at a tip of the shaft section 820. In the compression spring mechanism 80, the male screw 821 of the shaft section 820 is screw engaged with the female screw 741 of the through-hole 74, whereby the shaft section 820 is fastened to the upper section 740 of the through-hole 74.
A coned disk spring 81 contractable and extendable in the Z-axis direction is accommodated in the lower section 744 of the through-hole 74. The coned disk spring 81 is supported by the flange section 822 in a state of being penetrated by the shaft section 820.
In the fine adjustment device 7, when a voltage is supplied to the piezoelectric actuator 71 depicted in
When the upper section 700 and an upper portion of the intermediate section 702 of the support member 70 are pushed upward in the +Z direction by the piezoelectric actuator 71, the shaft section 820 fastened to the upper section 740 of the through-hole 74 depicted in
By such an operation, the intermediate section 702 of the support member 70 extends in the Z-axis direction while the upper section 700 of the support member 70 depicted in
In addition, the supply of the voltage to the piezoelectric actuator 71 is stopped, whereby the piezoelectric actuator 71 is contracted in the Z-axis direction and returns to its original length, and the accommodating chamber 72 returns to its original length, resulting in that the height positions of the upper section 700 and the intermediate section 702 of the support member 70 return to the original height positions.
By supplying the voltage to the piezoelectric actuator 71 to extend the piezoelectric actuator 71 and stopping the supply of the voltage to the piezoelectric actuator 71 to contract the piezoelectric actuator 71, the distance 6 between the table base 23 and the base 53 can be modified.
For example, by use of one fine adjustment device 7 of the three fine adjustment devices 7 depicted in
In addition, when, for example, by use of the three fine adjustment devices 7, the distances 6 between the table base 23 at three sites where the fine adjustment devices 7 are disposed and the base 53 are modified by the same amount, the height of the holding surface 210 of the chuck table 20 can be modified.
The processing apparatus 1 includes a control unit 19 that controls various mechanisms of the processing apparatus 1 as depicted in
In grinding the workpiece 14 by use of the processing apparatus 1, first, the workpiece 14 depicted in
Next, in a state in which the workpiece 14 is held under suction on the holding surface 210, the chuck table 20 is moved in the +Y direction by use of the horizontal moving mechanism 5, and the workpiece 14 is positioned under the processing unit 3. In this instance, the horizontal positional relation of the grindstones 340 and the workpiece 14 is adjusted such that the lower surfaces 342 of the grindstones 340 pass the center of the workpiece 14.
In addition, the chuck table 20 is preliminarily rotated around the center 2100 by use of the motor 260 to rotate the workpiece 14 held on the holding surface 210, and the grindstones 340 are preliminarily rotated around the rotational axis 35 by use of the spindle motor 30.
In a state in which the workpiece 14 held by the holding surface 210 is rotated and the grindstones 340 are rotated around the rotational axis 35, the processing unit 3 is lowered in the −Z direction by use of the processing feeding mechanism 4. As a result, the lower surfaces 342 of the grindstones 340 are brought into contact with the upper surface 140 of the workpiece 14.
In a state in which the lower surfaces 342 of the grindstones 340 are in contact with the upper surface 140 of the workpiece 14, the grindstones 340 are further lowered in the −Z direction, whereby the workpiece 14 is ground. During grinding of the workpiece 14, the thickness of the workpiece 14 is measured by use of the thickness measuring unit 18.
When grinding is conducted by use of the processing apparatus 1, a workpiece 15 having a partially different thickness as depicted in
To grind such a workpiece 15 to correct to a uniform thickness, first, while measuring the thickness of the workpiece 15 by use of the thickness measuring unit 18 depicted in
Then, the lower surfaces 342 of the grindstones 340 being rotated are brought into contact with the workpiece 15 held on the holding surface 210 as depicted in
Here, under the control of the control unit 19, a voltage is supplied to the piezoelectric actuators 71 of the three fine adjustment devices 7, the piezoelectric actuators 71 supporting the chuck table 20, whereby the holding surface 210 is raised in the +Z direction. As a result, the height of the holding surface 210 is raised as compared to a state in which the lower surfaces 342 of the grindstones 340 are in contact with the large fan-shaped part 152 of the workpiece 15, so that the small fan-shaped part 151 of the workpiece 15 is ground much as compared to the state in which the lower surfaces 342 of the grindstones 340 are in contact with the large fan-shaped part 152.
When the chuck table 20 is further rotated and the lower surfaces 342 of the grindstones 340 again make contact with the large fan-shaped part 152 of the workpiece 15 as depicted in
Thus, by controlling the voltage supplied to the piezoelectric actuators 71 according to the rotational angle of the chuck table 20 to thereby modify the height of the holding surface 210, when the lower surfaces 342 of the grindstones 340 are in contact with the small fan-shaped part 151, much grinding is conducted as compared to a state in which the lower surfaces 342 of the grindstones 340 are in contact with the large fan-shaped part 152, whereby the workpiece 15 can be corrected to a uniform thickness.
Note that the inclination of the holding surface 210 may be modified such that the small fan-shaped part 151 of the workpiece 15 is more largely ground, instead of raising the whole part of the holding surface 210 in the +Z direction by use of the fine adjustment devices 7 described above. Specifically, in a state in which the lower surfaces 342 of the grindstones 340 are in contact with the small fan-shaped part 151, that part of the holding surface 210 at which the small fan-shaped part 151 of the workpiece 15 is held may be raised in the +Z direction, by use of one or two of the three fine adjustment devices 7, whereby also the small fan-shaped part 151 of the workpiece 15 is ground much largely as compared to a state in which the lower surfaces 342 of the grindstones 340 are in contact with the large fan-shaped part 152, and the workpiece 15 can be corrected to a uniform thickness.
In addition, also in a workpiece 16 having a first part 161 and a second part 162 smaller in thickness than the first part 161 as depicted in
Note that, since the workpiece 16 depicted in
Since the fine adjustment device 7 has a high responsiveness due to the elastic structure composed of the plurality of slits 73 formed in the support member 70 depicted in
Note that, while the processing apparatus 1 has been described as the grinding apparatus in the above embodiment, the processing apparatus 1 in the present application is not limited to the grinding apparatus, and is applicable also to a polishing apparatus that polishes a wafer by rotating a polishing pad.
The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claims and all changes and modifications as fall within the equivalence of the scope of the claims are therefore to be embraced by the invention.
Number | Date | Country | Kind |
---|---|---|---|
2020-169686 | Oct 2020 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
7218032 | Kim | May 2007 | B2 |
20170153186 | Jeanne | Jun 2017 | A1 |
20200246939 | Kashiwagi | Aug 2020 | A1 |
Number | Date | Country |
---|---|---|
H07122524 | May 1995 | JP |
2002001653 | Jan 2002 | JP |
2008264913 | Nov 2008 | JP |
Entry |
---|
Fuubaa et al., JP H07122524 A, May 12, 1995, translation (Year: 1995). |
Number | Date | Country | |
---|---|---|---|
20220105603 A1 | Apr 2022 | US |