Claims
- 1. Fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unsaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, said epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule.
- 2. Fine particles of high heat resistant polymer in accordance with claim 1, wherein said epoxide (A-1) having one monocyclic hydrocarbon group is an epoxide comprising one benzene ring, one cyclohexane ring, one cyclohexene ring, or one cyclohexadiene ring.
- 3. Fine particles of high heat resistant polymer in accordance with claim 1, which are obtained by emulsion polymerization or seeded-polymerization of 20 through 100% by weight of said epoxy ester (C) and 80% or less by weight of said reactive monomer (D).
- 4. Fine particles of high heat resistant polymer in accordance with claim 1, wherein said unsaturated monobasic acid (B) is acrylic acid or methacrylic acid.
- 5. Fine particles of high heat resistant polymer in accordance with claim 1, which are obtained by emulsion polymerization or seeded polymerization of said epoxy ester (C) and said reactive monomer (D) in water or an alcoholic medium, and which have a particle size ranging from 0.01 to 10 .mu.m and a ration Dw/Dn of a weight-average particle size Dw to a number-average particle size Dn being not greater than 5.
- 6. Fine particles of high heat resistant polymer in accordance with claim 1, which are obtained through emulsion polymerization or seeded polymerization of said epoxy ester (C) and said reactive monomer (D), and which have a particle size ranging from 0.01 to 3 .mu.m and a ratio Dw/Dn of a weight-average particle size Dw to a number-average particle size Dn being not greater than 2.
- 7. A polymer emulsion prepared by dispersing, in water, fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unstaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, said epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule.
- 8. A polymer emulsion in accordance with claim 7, wherein said epoxide (A-1) having one monocyclic hydrocarbon group is an epoxide comprising one benzene ring, one cyclohexane ring, one cyclohexene ring, or one cyclohexadiene ring.
- 9. A polymer emulsion in accordance with claim 7, wherein said fine particles of high heat resistant polymer are obtained by emulsion polymerization or seeded polymerization of 20 through 100 % by weight of said epoxy ester (C) and 80% or less by weight of said reactive monomer (D).
- 10. A polymer emulsion in accordance with claim 7, wherein said unsaturated monobasic acid (B) is acrylic acid or methacrylic acid.
- 11. A polymer emulsion in accordance with claim 7, wherein said fine particles of high heat resistant polymer are obtained by emulsion polymerization or seeded polymerization of said epoxy ester (C) and said reactive monomer (D) in water or an alcoholic medium and have a particle size ranging from 0.01 to 10 .mu.m and a ratio Dw/Dn of a weight-average particle size Dw to a number-average particle size Dn being not greater than 5.
- 12. A polymer emulsion in accordance with claim 7, wherein said fine particles of high heat resistant polymer are obtained through emulsion polymerization or seeded polymerization of said epoxy ester (C) and said reactive monomer (D) and have a particle size ranging from 0.01 to 3 .mu.m and a ratio Dw/Dn of a weight-average particle size Dw to a number-average particle size Dn being not greater than 2.
Priority Claims (3)
Number |
Date |
Country |
Kind |
6-233375 |
Sep 1994 |
JPX |
|
7-017163 |
Feb 1995 |
JPX |
|
7-199955 |
Aug 1995 |
JPX |
|
Parent Case Info
This application is a Continuation-in-Part of now abandoned application Ser. No. 08/535,473, filed Sep. 27, 1995.
US Referenced Citations (13)
Foreign Referenced Citations (10)
Number |
Date |
Country |
0 065 020 |
Nov 1982 |
EPX |
0 220 637 |
May 1987 |
EPX |
0 240 984 |
Oct 1987 |
EPX |
0 346 486 |
Dec 1989 |
EPX |
0 406 453 |
Jan 1991 |
EPX |
0 421 086 |
Apr 1991 |
EPX |
0 554 215 |
Aug 1993 |
EPX |
7-258 359 |
Mar 1994 |
JPX |
7-133328 |
May 1995 |
JPX |
WO9404583 |
Mar 1994 |
WOX |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
535473 |
Sep 1995 |
|