Fine-scale temporal control for laser material processing

Information

  • Patent Grant
  • 11331756
  • Patent Number
    11,331,756
  • Date Filed
    Thursday, September 12, 2019
    5 years ago
  • Date Issued
    Tuesday, May 17, 2022
    2 years ago
Abstract
Methods include directing a laser beam to a target along a scan path at a variable scan velocity and adjusting a digital modulation during movement of the laser beam along the scan path and in relation to the variable scan velocity so as to provide a fluence at the target within a predetermined fluence range along the scan path. Some methods include adjusting a width of the laser beam with a zoom beam expander. Apparatus include a laser source situated to emit a laser beam, a 3D scanner situated to receive the laser beam and to direct the laser beam along a scan path in a scanning plane at the target, and a laser source digital modulator coupled to the laser source so as to produce a fluence at the scanning plane along the scan path that is in a predetermined fluence range as the laser beam scan speed changes along the scan path.
Description
FIELD

The disclosure pertains to laser material processing.


BACKGROUND

In recent years, additive manufacturing and 3D printing techniques have grown in popularity as the technology of forming objects with sequential layers has matured and become widely accessible. In particular, it may now be possible for laser-based methods, such as selective laser melting (SLM) and selective laser sintering (SLS), to supplant traditional techniques for manufacturing industrial-grade objects, such as casting and machining. However, numerous obstacles remain. For example, conventional additive manufacturing methods are typically unable to create objects as quickly, or that are as reliable in their finished state, as their traditionally-manufactured counterparts. Furthermore, the created objects often do not have superior precision detail or feature resolution. Accordingly, a need remains for innovation directed to solving the problems and drawbacks associated with conventional additive manufacturing apparatus and methods.


SUMMARY

According to some embodiments, methods comprise directing a laser beam to a target along a scan path at a variable scan velocity, and adjusting a digital modulation during movement of the laser beam along the scan path and in relation to the variable scan velocity so as to provide a fluence at the target within a predetermined fluence range along the scan path.


According to further embodiments, methods comprise directing a laser beam to a target along a scan path which includes adjusting a width of the laser beam with a zoom beam expander so as to provide the laser beam with a variable spot size at the target, receiving the laser beam from the zoom beam expander by a 3D scanning system having a z-axis focus adjust optical system and a galvanometer scanning system, and scanning the laser beam with the variable spot size along the scan path at the target.


According to further embodiments, apparatus comprise a laser source situated to emit a laser beam, a 3D scanner situated to receive the laser beam and to direct the laser beam along a scan path in a scanning plane at the target, and a laser source digital modulator coupled to the laser source so as to produce a fluence at the scanning plane along the scan path that is in a predetermined fluence range as the laser beam scan speed changes along the scan path. In additional examples, apparatus further comprise a zoom beam expander situated to receive the laser beam from the laser source and to change a width of the laser beam received by the 3D scanner so as to change a size of a focused laser spot of the laser beam in the scanning plane.


According to additional embodiments, methods comprise focusing a laser beam at a target within a focus field, scanning the focused laser beam at a variable speed along a scan path, and digitally modulating the laser beam during the scan movement along the scan path so as to adjust a laser beam average power received by the target along the scan path and so as to provide the target with a fluence that is above or below one or more laser process thresholds associated with the target.


According to further examples, methods comprise directing a laser beam to a target along a scan path at a variable scan velocity, and adjusting a collimated width of the laser beam with a zoom beam expander based on the variable scan velocity. In some examples, the collimated width is adjusted so as to provide the laser beam with a variable spot size at the target and a fluence at the target within a predetermined fluence range along the scan path. Some examples can further comprise adjusting a digital modulation of the laser beam based on the variable scan velocity.


In additional embodiments, methods comprise adjusting a width of a laser beam with a zoom beam expander so as to provide the laser beam with a variable spot size at a target, directing the laser beam to the target along a scan path, and a digitally modulating the laser beam in relation to the variable spot size so as to provide a fluence at the target within a predetermined fluence range along the scan path. In further examples, the laser beam is directed to the target along a scan path at a variable scan speed and the digital modulation is adjusted so as to maintain the fluence at the target within the predetermined fluence range along the scan path.


The foregoing and other objects, features, and advantages of the disclosed technology will become more apparent from the following detailed description, which proceeds with reference to the accompanying figures.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows a side view schematic of an additive manufacturing apparatus.



FIG. 2A shows a top view of a laser patterning scan path.



FIGS. 2B-2I show graphs of variables related to a scanned laser beam.



FIG. 3 is a graph of fluence with respect to focus position.



FIG. 4 shows a side view schematic of a laser patterning apparatus.



FIG. 5 shows another side schematic of a laser patterning apparatus.



FIG. 6 is a flowchart of a laser patterning process.



FIG. 7 is a schematic of a laser patterning system.



FIG. 8 is another schematic of a laser patterning system.



FIG. 9 is another schematic of a laser patterning system.





DETAILED DESCRIPTION

As used in this application and in the claims, the singular forms “a,” “an,” and “the” include the plural forms unless the context clearly dictates otherwise. Additionally, the term “includes” means “comprises.” Further, the term “coupled” does not exclude the presence of intermediate elements between the coupled items.


The systems, apparatus, and methods described herein should not be construed as limiting in any way. Instead, the present disclosure is directed toward all novel and non-obvious features and aspects of the various disclosed embodiments, alone and in various combinations and sub-combinations with one another. The disclosed systems, methods, and apparatus are not limited to any specific aspect or feature or combinations thereof, nor do the disclosed systems, methods, and apparatus require that any one or more specific advantages be present or problems be solved. Any theories of operation are to facilitate explanation, but the disclosed systems, methods, and apparatus are not limited to such theories of operation.


Although the operations of some of the disclosed methods are described in a particular, sequential order for convenient presentation, it should be understood that this manner of description encompasses rearrangement, unless a particular ordering is required by specific language set forth below. For example, operations described sequentially may in some cases be rearranged or performed concurrently. Moreover, for the sake of simplicity, the attached figures may not show the various ways in which the disclosed systems, methods, and apparatus can be used in conjunction with other systems, methods, and apparatus. Additionally, the description sometimes uses terms like “produce” and “provide” to describe the disclosed methods. These terms are high-level abstractions of the actual operations that are performed. The actual operations that correspond to these terms will vary depending on the particular implementation and are readily discernible by one of ordinary skill in the art.


In some examples, values, procedures, or apparatus' are referred to as “lowest”, “best”, “minimum,” or the like. It will be appreciated that such descriptions are intended to indicate that a selection among many used functional alternatives can be made, and such selections need not be better, smaller, or otherwise preferable to other selections.


As used herein, laser beams and associated optical radiation refers to electromagnetic radiation at wavelengths of between about 100 nm and 10 μm, and typically between about 500 nm and 2 μm. Examples based on available laser diode sources and optical fibers generally are associated with wavelengths of between about 800 nm and 1700 nm. In some examples, propagating optical radiation is referred to as one or more beams having diameters, asymmetric fast and slow axes, beam cross-sectional areas, and beam divergences that can depend on beam wavelength and the optical systems used for beam shaping. For convenience, optical radiation is referred to as light in some examples, and need not be at visible wavelengths.


Representative embodiments are described with reference to optical fibers, but other types of optical waveguides can be used having square, rectangular, polygonal, oval, elliptical or other cross-sections. Optical fibers are typically formed of silica (glass) that is doped (or undoped) so as to provide predetermined refractive indices or refractive index differences. In some, examples, fibers or other waveguides are made of other materials such as fluorozirconates, fluoroaluminates, fluoride or phosphate glasses, chalcogenide glasses, or crystalline materials such as sapphire, depending on wavelengths of interest. Refractive indices of silica and fluoride glasses are typically about 1.5, but refractive indices of other materials such as chalcogenides can be 3 or more. In still other examples, optical fibers can be formed in part of plastics. In typical examples, a doped waveguide core such as a fiber core provides optical gain in response to pumping, and core and claddings are approximately concentric. In other examples, one or more of the core and claddings are decentered, and in some examples, core and cladding orientation and/or displacement vary along a waveguide length.


In the examples disclosed herein, a waveguide core such as an optical fiber core is doped with a rare earth element such as Nd, Yb, Ho, Er, or other active dopants or combinations thereof. Such actively doped cores can provide optical gain in response to optical or other pumping. As disclosed below, waveguides having such active dopants can be used to form optical amplifiers, or, if provided with suitable optical feedback such as reflective layers, mirrors, Bragg gratings, or other feedback mechanisms, such waveguides can generate laser emissions. Optical pump radiation can be arranged to co-propagate and/or counter-propagate in the waveguide with respect to a propagation direction of an emitted laser beam or an amplified beam.


The term brightness is used herein to refer to optical beam power per unit area per solid angle. In some examples, optical beam power is provided with one or more laser diodes that produce beams whose solid angles are proportional to beam wavelength and beam area. Selection of beam area and beam solid angle can produce pump beams that couple selected pump beam powers into one or more core or cladding layers of double, triple, or other multi-clad optical fibers. The term fluence is used herein to refer energy per unit area. In some embodiments, fluence is delivered to a target in along a scan path so as to heat or otherwise laser process the target in a selected area associated with the scan path. Scan paths can have various shapes, including linear, curved, retraced, segmented, etc. Output beams generated by optical systems are directed along the scan paths and can have various brightnesses and uniformity characteristics along one or more axes transverse to the propagation direction. Typical output beams are continuous-wave with various output powers, including average beam powers greater than or equal to 100 W, 500 W, 1 kW, 3 kW, 6 kW, 10 kW, or 20 kW, depending on the particular application. Continuous-wave output beams are digitally modulated as discussed further herein.



FIG. 1 is an apparatus 100 that includes a laser system 102 emitting and directing a laser processing beam 104 to a target 106 in an additive manufacturing process. The target 106 is generally formed layer by layer from a fine metal powder 108 that is situated in a container 110. Once a layer is laser patterned, a z-stage 112 lowers the container 110 and a new layer of fine metal powder 108 is rolled out with a roller 114 that provides additional fine metal powder 108 from an adjacent reservoir 116. The new layer is then laser patterned, and the process is repeated multiple times with subsequent fine metal powder layers in order to form a three dimensional object.


In FIG. 2A an example of a scan path 200 is shown along which a laser processing beam is scanned in the process of laser patterning a target, such as an additive manufacturing target. At a time t1, the laser processing beam is traveling with scan velocity, e.g., a particular speed and a direction to the right in the plane of FIG. 2A. The scan speed of the laser processing beam begins to slow as the laser processing beam reaches another position at a time t2 closer to a path corner. At a time t3, the laser processing beam slows to become momentarily motionless in order to change direction and move downward in the plane of FIG. 2A. At a time t4, the scan speed of the laser processing beam has increased, and at time t5 the laser processing beam has reached the same speed as at time t1.


Below the scan path 200, FIG. 2B shows a graph 202 of speed, |v(t)|, versus time that corresponds with the times t1-t5 of the scan path 200. As can be seen, a speed of the laser processing beam has an initial scan speed at t1, slows to rest at time t3 where the laser processing beam changes direction, and increases scan speed to a final scan speed at t5 that can be the same or different from the initial scan speed. Below the graph 202, in FIG. 2C, is a graph 204 of a laser processing beam average power PAVG(t) versus time corresponding with the times t1-t5 and the scan path 200, and in FIG. 2D, a graph 206 of fluence E(x) received by a processing target along a scan path, such as the scan path 200. In typical laser process examples, the fluence E(x) should remain within a predetermined range, such as between two thresholds, such as constant thresholds FHIGH, FLOW. In some examples, the thresholds and corresponding predetermined range can vary or be modulated depending on various factors, such as feature size and shape, material-dependent characteristics, such as heating and cooling rates, etc. For example, different targets, or different portions or regions of the same target, can have different material properties. Also, different laser processing effects can be achieved in different process windows, including fluence windows. By maintaining fluence within a corresponding range or ranges, the laser energy can perform the desired change to the target. For example, in a selective laser melting process an excess fluence may damage the target, exacerbating a heat affected zone, and negatively affect various parameters of the finished object, such as tensile strength and reliability. An insufficient fluence can prevent the target material from melting correctly thereby weakening the finished object. By maintaining fluence within a predetermined range during laser processing, the finished object can be fabricated with superior material characteristics.


In some embodiments, in order to maintain fluence E(x) within the predetermined range (e.g., between FHIGH and FLOW), the average power PAVG(t) of the laser processing beam decreases corresponding to beam movement information, such as a decrease in scanning speed |v(t)| of the laser processing beam along the scan path 200. However, for various reasons, a direct continuous decrease in average power PAVG(t) cannot be accomplished or cannot be accomplished in an efficient manner. For example, the laser scanning components, such as mirrors and optics, can move at a speed slower than the laser patterning process demands, resulting in a laser fluence at the target that is above FHIGH or below FLOW. In some instances, the dynamics of a gain medium of a laser source generating the laser processing beam do not respond quickly enough to a desired continuous or discontinuous change to the power level of the laser processing beam.


Below the graph 206, in FIG. 2E, is a graph 208 depicting a modulated power P(t) of the laser processing beam that can produce rapid changes in average power PAVG(t) even with slow scanner dynamics or other laser system deficiencies. The modulated power P(t) alternates between a high power PHIGH and a low power PLOW, and the low power PLOW can be zero or non-zero. The modulated power P(t) includes a variable modulation period TMOD and a variable duty cycle PDUTY that is a percentage of TMOD. In general, as a speed associated with the scanning of a laser processing beam decreases, one or more of the modulation period TMOD and duty cycle PDUTY can change so as to decrease the average power of the laser processing beam and to maintain the fluence received by the target within a predetermined range. In some examples, other information associated with the scan path 200 is used to maintain fluence E(x) within the predetermined range, such as proximity of the scan path 200 to an adjacent portion of the scan path 200 previously scanned (including a retrace), ambient temperature, localized temperature, heating and cooling rates, scan acceleration, scan position, etc. In further examples, a delivered fluence and a peak power of the laser beam delivering the fluence remain within predetermined ranges in accordance with laser process requirements. In particular embodiments, fine features (on the order of microns) are laser processed as laser processing beam scan velocity changes rapidly during the formation of smaller target details. In some embodiments, the modulation period TMOD can be varied so that an average beam power changes based on response dynamics of a gain medium of a laser source generating the beam or other components of the laser source.


In the example shown in graph 208, at the time t1 the power of the laser processing beam is constant at power PHIGH. As the speed |v(t)| of the laser processing beam decreases, the laser processing beam changes from constant power to a modulated power, switching from PHIGH to PLOW and back to PHIGH at a frequency associated with the decrease in scanning speed of the laser processing beam. As the speed |v(t)| of the scanning of the laser processing beam continues to decrease as the time approaches t2 and t3, the power modulation frequency increases, decreasing the period TMOD and the duty cycle THIGH/THIGH+TLOW, wherein THIGH is a duration during which the power PHIGH is applied and TLOW is a duration in which the power PLOW is applied. The decreased duty cycle reduces the average power PAVG for the laser processing beam and provides the laser processing fluence within the predetermined range. Thus, by adjusting a digital modulation of the power of the laser processing beam, the average power of the laser processing beam can be adjusted so that a fluence may be provided at target that remains within a predetermined fluence range corresponding to the target. With additional reference to graph 210 in FIG. 2F, in some embodiments, the laser processing beam can change to or switch between more than two power levels, such as P0, P1, and P2, and digitally modulated to produce rapid changes in average power and associated fluence. In further examples, a decrease in average laser processing beam power can be provided by adjusting a digital modulation of the laser processing beam such that a power level is within a range of peak powers suitable for performing a laser process.


As discussed above, predetermined fluence ranges can vary according to laser processing factors, and examples herein can produce modulated optical beam powers that maintain fluence within variable fluence ranges. FIG. 2G shows a graph 212 of fluence ESTEP with a targeted fluence that varies step-wise from a first fluence F1 with thresholds F1-HIGH, F1-LOW to a second fluence F2 with thresholds F2-HIGH, F2-LOW. In some examples, with a constant scan velocity for a laser processing beam, such as with a straight scan path, a digitally modulated beam with a fixed period and duty cycle can provide the first fluence F1 and an unmodulated beam can provide the second fluence F2. Digital modulation of the power can allow for more a rapid transition between the first and second fluences F1, F2. In FIG. 2H, a graph 214 shows a predetermined fluence range FMOD that varies according to a sinusoid between respective upper and lower fluence boundaries FHIGH, FLOW. The fluence EACTUAL delivered to a target can be maintained within the fluence range FMOD through a digital modulation of the optical power of the laser processing beam. In some laser processing examples, the frequency of the fluence modulation can be relatively fast, including 1 kHz, 10 kHz, 100 kHz, or greater. In different examples, high frequency fluence oscillation is dependent on or independent from a fluence oscillation phase.


In some examples, an analog modulation can be applied to change the average power of the laser processing beam in conjunction with the digital modulation. However, the analog modulation typically has a slower response time for achieving a desired reduction in average power for maintaining fluence within the predetermined range. To increase process efficiency, and to robustly maintain fluence within a predetermined fluence range irrespective of various system variables such as scanner dynamics, a digital modulation is typically used or a hybrid digital and analog modulation is used to adjust the average power of the laser processing beam and provide more rapid response to preserve fluence within a predetermined range. For example, referring to FIG. 2I, a graph 216 shows a digitally modulated signal PMOD that includes plurality of modulation portions with power maximums that decrease to a minimum power PLOW1 according to an analog command signal PANALOG. The actual average output power commanded and produced for the laser processing beam can include trace a path PAVG that can include a more rapid change in average beam power and a lower minimum power PLOW2.



FIG. 3. is a graph of fluence F(z) of a laser processing beam with respect to a focus position Z associated a scanner coupled to the laser processing beam. In general, the fluence F(z) is a maximum at a fluence FMAX where the laser processing beam is brought into a best focus position ZBEST in the direction of propagation of the laser processing beam. As the focus distance of the laser processing beam increases or decreases from ZBEST, effectively defocusing the laser processing beam, the fluence associated with the new focus position decreases as the laser processing beam expands and defocuses. During laser processing it is generally desirable for the fluence F(z) of the laser processing beam to remain within fluence boundaries FHIGH and FLOW by constraining or controlling defocus between focus positions ZLOW and ZHIGH, for example, so that the laser process can produce the corresponding change in the target. While the fluence boundaries can be variable, in typical examples the fluence boundaries are fixed. In some embodiments, a 3D scanner is used to scan the laser processing beam at the target with a flatter focal field curvature than an Fθ lens or other scanning optic over a large pattern processing area. Thus, the fluence delivered by the laser processing beam that is scanned at the target is more likely to stay or more easily maintained within the fluence boundaries FHIGH, FLOW.


In FIG. 4, an apparatus 400 includes a laser source 402 situated to emit a laser processing beam 404. A laser controller 406 is coupled to the laser source 402 in order to control the power, including a modulated power, of the laser processing beam 404. A 3D scanner 408 is situated to receive the laser processing beam 404 and to direct the laser processing beam to a target 410. With the 3D scanner 408, the laser processing beam 404 is generally brought to focus in a focal plane 412 that is parallel to and aligned with a flat surface of the target 410. However, in some examples, the 3D scanner 408 allows the focal position to vary so as to provide a non-flat focal field that can correspond to a non-uniform target surface. In typical examples, the 3D scanner 408 includes an XY galvanometer scan mirror set and a Z-position focus group that changes the focus position of the of the beam at the focal plane 412 based on the position of the galvo scan mirrors. The apparatus 400 also includes a zoom beam expander 414 situated to receive the laser processing beam 404 with a collimated input diameter D0 and adjust beam width so that the laser processing beam exiting the zoom beam expander 414 has a same or different collimated diameter D1 along one or more directions transverse to the propagation path of the laser processing beam. The laser processing beam 404 with the collimated diameter D1 is received by the 3D scanner 408 and is scanned and focused at the target 410 with a spot size W1. The zoom beam expander 414 can also adjust the laser processing beam 404 so as to have a collimated diameter D2 that is smaller than the collimated diameter D1. The smaller collimated diameter D2 is received by the 3D scanner and scanned and focused at the target with a spot size W2 that is larger than spot size W1 due to the smaller collimated diameter D2.


The zoom beam expander 414 can be constructed in various ways. In typical examples (and as shown in FIG. 4), the zoom beam expander 414 includes a set of entrance group optics 416 that are fixed and situated to receive the laser processing beam 404 from the laser source 402. A set of exit group optics 418 is situated to receive an expanding beam from the entrance group optics 416 and through movement along an optical axis of one or more optics of the exit group optics 418, increase or decrease the diameter of the laser processing beam 404 emitted from the zoom beam expander 414. To provide the controlled movement for changing the collimated diameter of the laser processing beam 404, the zoom beam expander 414 is coupled to the laser controller 406. By controllably expanding the diameter of the laser processing beam 404 that is optically coupled into the 3D scanner 408, a controlled variation in spot size can be provided at the target for various effects.


In typical examples, different spot sizes produced with the zoom beam expander 414 are used to laser process features at the target 410 of varying size and shape. In some examples, the laser processing beam 404 is scanned with a variable scan velocity along a scan path at the target 410 so that the target receives a fluence in a predetermined fluence range by varying the spot size in relation to the variable scan velocity. In further examples, larger features are laser processed with the laser processing beam 404 with a larger spot size, e.g., with the spot size W2 and a constant laser processing beam power, and smaller features are laser processed with the laser processing beam 404 with a smaller spot size, e.g., with the smaller spot size W1 and a typically smaller digitally modulated laser processing beam power. By digitally modulating the laser processing beam power, the laser process can avoid or make optional an analog modulation of the beam power and the fluence delivered to the target can be maintained within a predetermined fluence range for the laser process as changes in spot size occur.



FIG. 5 shows another apparatus 500 that includes a laser source 502 controlled by a laser controller 504 and situated to produce a collimated laser beam 506. A zoom beam expander 508 is situated to receive and to change the diameter of the collimated laser beam 506 to produce an expanded beam 507. A 3D scanner 510 is situated to receive the expanded beam 507 from the zoom beam expander 508 and to focus the expanded beam 507 to a spot in various positions, S1-S3, at a target 512. The 3D scanner 510 typically includes variable position focusing optics 514 that receive and focus the expanded beam 507 and a pair of galvo-controlled scan mirrors 516 that receive the focused beam and direct the focused beam to a particular position (typically in a focal plane) aligned with the target 512, e.g., to predetermined X-Y coordinates. The position of the laser beam spot at the target 512 can vary across a scan field associated with the 3D scanner 510. In a scanner that uses a fixed focusing optic, such as an Fθ lens, a field curvature 518 associated with the focal position of the Fθ lens is typically curved. Thus, for a laser beam focused at a position SN toward a periphery of the scan field, such as positions S1 and S3, defocus typically occurs. Such defocus can reduce the fluence received by the target 512 so that the fluence is outside of a predetermined range and uneven heating and uneven processing across the scan field can occur. The variable position focusing optics 514 (which can include one or more lenses, mirrors, diffractive optical elements, etc.) of the 3D scanner 510 allows a change in a focus position of the spot in relation to an X-Y position of the spot in the field of the 3D scanner 510. Thus, small adjustments can be made to the focus position of the spot so that field curvature associated with 3D scanner is flatter than other systems. The 3D scanner 510 is coupled to the laser controller 504 so as to receive a scanning and focusing signal that corresponds to pattern data for scanning and focusing the collimated laser beam 506 at the target. The pattern data can be stored in the laser controller 504 or can be received from an external source.


In FIG. 6, a method 600 of laser processing a target includes, at 602, providing a scan path for a laser beam, and at 604, selecting a spot size for the laser beam at the target. For example, a laser beam scan path can be provided to a laser controller with a laser pattern file that includes data related to the position of the laser beam that is to be scanned across the target. The laser beam scan path can also be provided to the laser controller in real time so that receipt of a scan path signal by the laser controller or laser scanner occurs simultaneous with or in close temporal relation to the scanning of the laser beam at the target. At 606, an average power of the laser beam is determined based on the laser beam scan path and the laser beam spot size and a laser beam fluence range associated with laser processing of the target. The power of the laser beam is digitally modulated at 608 through digital modulation of one or more laser pump sources coupled to an active medium that produces the laser beam. The digitally modulated laser beam corresponds to the determined average power at 606, which can change significantly based on the scan path and spot size. At 610, the laser beam is directed along the scan path provided at 602. In further examples, an average power is determined for a scan path and the spot size of the laser beam is varied to correspond to the determined average power. In further examples, both digital modulation and a variable spot size are used to provide an average power to correspond to a predetermined fluence range.


In FIG. 7, a laser system 700 is situated to laser pattern a target 702 with precision control of fluence at the target 702. The laser system 700 includes a laser controller 704 coupled to a pump driver 706, such as a voltage controlled AC/DC power supply or a voltage regulator coupled to a power supply, and laser scanner 708. The pump driver 706 drives pump diodes 710 based on one or more of a voltage and current. The pump diodes 710 are coupled to a laser gain medium, such as an active fiber 712, which uses the energy from the pump diodes 710 to generate a laser system beam 714. The laser system beam 714 is received by a zoom beam expander 716 that can change the collimated width of the laser system beam 714 exiting the zoom beam expander 716 in order to change the size of a focused spot of the laser system beam 714 in the same plane at the target 702 along one or more axes transverse to a propagation direction of the laser system beam 714. The laser scanner 708 receives the laser system beam 714 from the zoom beam expander 716 with a selected collimated beam width and directs the laser system beam 716 to the target 702 in order to process a pattern and deposit along a scan path 715 a laser fluence within a predetermined range associated with a laser process.


In some examples, the laser controller 704 is coupled to a gate signal 718 that provides the controller 704 with first state and second state conditions for the laser system beam 714 and that can be associated with the pattern formed on the target 702. For example, the gate signal 718 can correspond to a laser patterning data file 720 that provides on and off conditions so that as the laser system beam 714 is scanned, various features can be isolated or spaced apart from other features on the target 702 and complex features can be formed. The laser controller 704 includes a gate control 722 that communicates a gate control signal to the pump driver 706 so that the pump diodes 710 are energized to pump the active fiber 712 so as to correspond to the on and off associated with the gate signal. The laser patterning data file 720 can also provide various vector data, such as scan position data, for the laser system beam 714 to be scanned at the target 702. The laser controller 704 is coupled to the laser scanner 708, though in other examples the laser patterning data file 720 can be coupled directly to the laser scanner 708. Various connections can be wired or wireless, and file data can be stored in volatile or non-volatile memory. In further examples, the gate commands of the gate signal are stored in a memory of the laser controller 704.


In order to maintain laser fluence delivered to the target 702 within a predetermined range, the laser controller 704 includes fluence setpoint 724 coupled to a modulation period control 726, a duty-cycle modulation control 728, and an analog modulation frequency control 730, that are also coupled to the pump driver 706. The modulation period control 726 is situated to adjust a digital modulation period of the pump diodes 710. For example, the optical power output of the pump diodes can increase from a slower frequency and corresponding period to a faster frequency (e.g., from 10 kHz to 100 kHz, 200 kHz, or faster) and corresponding period or from a continuous on-state (e.g., 0 kHz) so that a power associated with the laser system beam 714 alternates or alternates more rapidly between two or more power levels (e.g., 10 kHz alternating between 10 W and 500 W).


The duty cycle control 728 is situated to adjust a power duty cycle of the pump diodes 710. Duty cycles can range from greater than 90% to less than 10% and can vary in relation to the modulation period. Selected duty cycles are typically large enough so that a suitable amount of laser processing beam energy may be generated in relation to the rise and fall times of the laser processing beam of a selected modulation period so as to maintain laser processing beam average power at a desired level. In some examples, a fixed modulation period is selected and a duty cycle is varied from 100% to less than 10% so as to produce a corresponding reduction in laser processing beam average power. In further examples, a modulation period decreases and a duty cycle decreases to correspond to a reduction in laser processing beam average power so that fine details associated with changes in scan velocity can be formed with the laser processing beam.


The modulation period control 726 and the duty cycle control 728 can produce a modulation change based on the fluence setpoint 724 in order to decrease or vary an average power of the laser system beam 714 at the target. In some embodiments, the decrease in average power can be associated with a decrease in the size of the spot of the laser system beam 714 at the target 702 or a change in beam scan velocity, such as a decrease in scan speed or change in scan direction, of the laser system beam 714 being scanned with respect to the target 702. The power of the laser system beam 714 can be detected by a power detector 732 coupled to one or more system components, such as the active fiber 712, with a corresponding signal of the detected power being coupled to the controller 704. The detected power of the laser system beam 714 can be used for general monitoring, emergency cutoff, etc., and also to assist in determining whether laser fluence remains within, above, or below one or more thresholds, boundaries, tolerances, etc., during laser processing. For example, the detected power can be compared with an average power calculated based on a particular digital modulation settings and the modulation period control 726 and duty cycle control 728 can scale or adjust modulation period and duty cycle to produce the laser system beam 714 with an average power that corresponds with the fluence setpoint 724. For example, the laser system 700 can be coupled to different types of laser scanners, pump diodes, active fibers, etc., each which could affect dynamics of the laser system 700 and the extent to which digital modulation adjustment affects fluence deposition.


In some examples, a digital modulation period and duty cycle that are adjusted based on the fluence setpoint 724 can be defined by the gate signal 718 prior to the coupling of the gate signal 718 to the laser controller 704. In further embodiments, the pattern file 720 can be coupled to the controller 704 and the gate signal 722 need not be externally provided. In additional embodiments, the analog modulation control 730 also is used to assist in maintaining laser fluence at the target 702 by combining it with the modulation period control 726 and the duty cycle control 728. Typically, the analog modulation of the output power of the laser system beam 714 alone responds too slowly to maintain the delivered laser fluence at the target 702 within the predetermined range associated with the fluence setpoint 724 or the fluence requirements of the laser process. Typically, this inability can be associated with dynamics of the electronics of the controller 704 or the pump diodes 710 and active fiber 712. However, dynamics of the zoom beam expander 716 and the laser scanner 708 can also vary. Thus, by using the modulation period control 726 and the duty cycle control 728 to digitally modulate the pump diodes 710, laser fluence delivered to the target 702 can be maintained within a predetermined range even with slow or inconsistent dynamics between various components of the laser system 700. In some examples, the combined effect on laser fluence from the modulation period control 726, duty cycle control 328, and the analog modulation control 730 can advantageously maintain fluence at desired levels.


In further examples, the modulation period control 726 can also adjust modulation period based on the pattern file 720 or other data associated with the laser scan path 715. In patterns associated with the target 702 where fine features are produced, such as multiple features in proximity to each other, the total heat load can affect laser process fluence thresholds for adjacent or retraced features. Modulation period control 726 and duty cycle control 728 can adjust power of the laser system beam 714 based on a delivered heat load to the target 702, a predicted or measured temperature associated with one or more portions of the target 702, or the dwell time of the laser system beam 714 in one or more areas of the target 702, etc. For example, the laser system beam 714 can be digitally modulated through a first scan movement change relative to the target 702 (e.g., a first turn of the laser system beam 714) in the laser scan path 715 and can be digitally modulated to reduce an average power of the laser system 714 to a greater extent during a second turn in proximity to the first turn.


In FIG. 8, a laser system 800 includes a controller 802 situated to receive an analog signal at an analog input 804, a gate signal at a gate input 806, and a fluence modulation signal at a fluence modulation input 808. The controller 802 typically uses the gate signal to modulate or vary power provided by a power supply 810 to laser pump diodes 812, typically by varying drive currents supplied to the laser pump diodes 812. The laser pump diodes 812 are optically coupled to a doped fiber 814, or other laser gain medium that generates a laser system beam 816. The power of the laser system beam 816 can increase and/or decrease corresponding to the modulation of the gate signal, for example, so as to decrease between processing non-contiguous portions of a selective laser melting (SLM) target 818. A rise-fall circuit 820 is coupled to the controller 802 and the pump diodes 812 to control a rise time and a fall time of a pump current provided to the pump diodes 812 by the power supply 810. By controlling the rise time and fall time of the pump current, associated rise times, fall times, overshoots, and undershoots of one or more pump beams 822 generated by the pump diodes 812 can be selected. In some examples, suitable response times for the pump beams 822 can be balanced against pump diode reliability. The laser system beam 816 generated by the doped fiber 814 is also coupled to a zoom beam expander 824 situated to change the spot size of the laser system beam 814 that is focused through a laser scanner 826 into the same plane at the SLM target 818. Rise times are typically defined as the duration required for a parameter, such as laser beam power, to rise from a selected portion of a steady state value to another selected portion of the steady state value, e.g., 2% and 98%, 5% and 95%, 10% and 90%, 1% and 95%, etc. Fall times can be similarly defined as a duration for a fall from a steady state value. Initial values or steady state fall values can be zero or non-zero. Overshoots and undershoots can be defined as a percentage of a steady state value.


The fluence modulation signal can also be used to modulate, vary, or control the laser system beam power to the same or different power levels associated with the gate signal. The fluence modulation signal can be used to digitally modulate the pump currents of the pump diodes 812 so that an average power of the laser system beam 816 is varied corresponding to a variable velocity of the laser system beam 816 being scanned by the laser scanner 826 at the SLM target 818. For example, a decrease in digital modulation period or a reduction in duty-cycle for the same period can cause a rapid reduction in average power of the laser system beam 816. The variable velocity of the laser system beam 816 scanning along the scan path, or the change in spot size of the laser system beam 816 with the beam expander 824, can produce an undesirable fluence variation at the SLM target 818 that can adversely affect the suitability of the finished product, and the fluence modulation signal can be used to compensate for the fluence variation. The fluence modulation signal can also be used to digitally modulate the pump currents to adjust a power of the laser system beam 816 to correspond to different spot sizes produced by the zoom beam expander 824. In some embodiments, the fluence modulation signal and the gate signal can be provided through a common input. In further embodiments, the fluence modulation signal can be used to modulate or vary the spot size of the laser system beam 814 with the zoom beam expander 824 so as to adjust the average power of the laser system beam 814. For example, the spot size can be varied to different sizes that correspond to the variation of the scan velocity of the laser system beam 816. Also, the spot size can be modulated so as to alternate between two or more different sizes, with different modulation periods and duty cycles, so as to alter the average power of the laser system beam 816.



FIG. 9 shows a laser pump control system 900 that controls the optical outputs 901A, 901B of one or more pump diodes 902A, 902B (typically several) situated in series in one or more pump modules 904. The optical outputs 901A, 901B can be used to directly produce a laser system processing beam in a laser system, such as in so-called direct-diode laser systems, or to pump other gain media to produce a laser system processing beam (e.g., fiber lasers, solid state lasers, disk lasers, etc.). An AC/DC power supply 906 provides a current to the pump diodes 902A, 902B in order to produce the optical outputs 901A, 901B. An FPGA 908, or other similar controller device (e.g., PLC, PLD, CPLD, PAL, ASIC, etc.), is situated to produce a digital output 909 to a DAC 910 that corresponds to a desired pump current for the pump diodes 902A, 902B so as to generate the corresponding pump diode optical outputs 901A, 901B. The DAC 910 converts the digital output from the FPGA into a DAC output 911A having a corresponding voltage and that is received by the AC/DC power supply 906 to generate the pump current.


A plurality of additional DAC outputs, 911B-911D, are coupled to a signal multiplexer 912 situated to select the rise time and fall time of the pump current received by the pump diodes 902A, 902B. The signal multiplexer 912 is coupled to an RC circuit capacitor C and one or more current control circuits 914 situated to control the pump current that generates the optical outputs 901A, 901B from the pump diodes 902A, 902B. For example, a resistor RB coupled to DAC output 911B can be associated with a longer pump current rise time for the pump diodes 902A, 902B, a resistor RC can be associated with a shorter pump current rise time, and resistor RD can be associated with a suitable pump current fall time. Rise times and fall times are typically asymmetric in the pump diodes 902A, 902B so that having different selectable resistance values associated with rise and fall and produce an improved response, such as a shorter rise time and fall time with a constrained overshoot or undershoot. In some examples, adjustable resistors are used, such as digipots, so as to allow a tunable resistance value that can also vary with a digital modulation and produce improved rise time, fall time, overshoot, and undershoot optical response characteristics. A serial bus 916 can communicate a digital modulation command from the FPGA 908 to the multiplexer 912 so as to switch between different rise times and fall times and to digitally modulate the pump current.


The current control circuits 914 can include one or more FETs 915 coupled to current sensing resistors 917, and one or more operational amplifiers 919 that provide control feedback and receive current setpoints from the FPGA 908. Including a plurality of the current control circuits 914 in parallel can spread and dissipate heat across the respective FETs 915 of the current control circuits 917 so as to improve current control precision and reliability. In typical examples, the pump diode 902A has a different forward voltage than the pump diode 902B. Thus, the voltage drop across a FET will vary between pump diode series. The AC/DC power supply 906 can be situated to maintain a suitable FET voltage that corresponds to a constant or consistent heat dissipation. The associated electronic efficiency and reliability of the current control circuits 914 is improved as heat dissipation across the FETs 915 is partitioned and limited. Furthermore, the current control response characteristics of the current control circuits 917 that contribute to the overall response time of the optical outputs 901A, 901B of the pump diodes 902A, 902B are improved, allowing shorter rise times and fall times associated with the resistors RB, RC, RD, and higher digital modulation frequencies. The apportioning of current with the parallel current control circuits 914 also allows selection of current sensor resistor values for the current sensing resistors 917 that are more accurate, further improving response characteristics of the current control circuits 914 and optical outputs 901A, 901B. With fast sample rates from the DAC 910, and with the improved response characteristics of the current control circuits 914, laser diode current can be switched or varied rapidly. In some examples, rise times and fall times for the optical outputs 901A, 901B of less than or equal to 50 μs, 20 μs, 10 μs, 5 μs, or 2.5 μs are achieved, including with short modulations periods, such as less than 100 μs, 50 μs, 20 μs, 10 μs, or 5 μs.


In some embodiments, the FPGA 908 receives an analog signal from an analog input 918 from an external source that has been passed through a signal conditioner and ADC (not shown) The external source, such as an automated system, computer, computer memory or data file, manual control, graphical user interface input, etc., is configured to provide the analog signal based on a desired a laser system power level. The laser system can then be pumped by the optical outputs 901A, 901B in order to achieve the desired laser system power level. The FPGA 908 can also receive a gate signal from a gate input 920 that can be associated with the analog signal and the external source providing the analog signal. The gate signal is typically digital and can be configured to provide on and off commands for the pump diodes 902A, 902B so as to turn a corresponding laser system beam on and off. The gate signal and analog signal can also be used to produce an arbitrary waveform for the optical outputs 901A, 901B. In typical examples, the analog signal and the gate signal are coordinated so that a laser system beam is scanned across a target to selectively heat and process material of the target at different power levels and at different locations of the target. A pulse profile from a pulse profile signal input 922 can also be coupled to the FPGA 908 so as to provide an external source to select various features of the laser system beam generated from the pump diodes 902A, 902B. The pulse profile information can be stored in a memory locally or remotely or provided as a signal from an external source. For example, different rise times and fall times can be selected for the pump currents, along with laser system beam repetition rates, power levels, etc.


A fluence modulation signal is received from a fluence modulation input 924 that is also coupled to the FPGA 908 and which can also be coordinated with the analog signal, gate signal, and pulse profile, or it can be separate. The fluence modulation signal can be provided to correct for a fluence deviation associated with the laser system beam being delivered to the target. For example, the analog input may have a limited bandwidth, for example, due to the increased noise typically associated with high frequency analog signals, or the bandwidth may be unsuitable in relation to the dynamics of other laser system components, such as a scanner, or the laser process being performed. The fluence modulation signal can be used to compensate for the bandwidth-limited analog signal or corresponding bandwidth-limited laser system performance by digitally modulating the pump currents in order to achieve a desired fluence at the target during laser processing with the laser system beam produced with the optical outputs 901A, 901B. For example, when a scanning speed decreases, the fluence modulation signal can be received by the FPGA 908 and the FPGA 908 can direct the multiplexer 912 over the serial bus 916 to modulate so as to produce the desired fluence correction at the target.


Having described and illustrated the principles of the disclosed technology with reference to the illustrated embodiments, it will be recognized that the illustrated embodiments can be modified in arrangement and detail without departing from such principles. For instance, elements of the illustrated embodiments can be implemented in software or hardware. Also, the technologies from any example can be combined with the technologies described in any one or more of the other examples. It will be appreciated that some procedures and functions such as those described with reference to the illustrated examples can be implemented in a single hardware or software module, or separate modules can be provided. The particular arrangements above are provided for convenient illustration, and other arrangements can be used.


In view of the many possible embodiments to which the principles of the disclosed technology may be applied, it should be recognized that the illustrated embodiments are only representative examples and should not be taken as limiting the scope of the disclosure. Alternatives specifically addressed in these sections are merely exemplary and do not constitute all possible alternatives to the embodiments described herein. For instance, various components of systems described herein may be combined in function and use. We therefore claim all that comes within the scope and spirit of the appended claims.

Claims
  • 1. An apparatus, comprising: a continuous-wave laser source situated to emit a laser beam;a 3D scanner situated to receive the laser beam and to direct the laser beam along a scan path in a scanning plane at a target; anda laser source digital modulator coupled to the continuous-wave laser source and configured to adjust a digital modulation of the laser beam between a first digital modulation power level and a second digital modulation power level during movement of the laser beam along the scan path and in relation to a variable scan velocity to provide a fluence at the scanning plane along the scan path that is in a predetermined fluence range along the scan path.
  • 2. The apparatus of claim 1, further comprising a zoom beam expander situated to receive the laser beam from the continuous-wave laser source and to change a width of the laser beam received by the 3D scanner to change a size of a focused laser spot of the laser beam in the scanning plane.
  • 3. The apparatus of claim 1, wherein the laser source digital modulator is configured to digitally modulate the laser beam between two or more power levels based on a digital modulation signal with a modulation rise time of the laser beam of less than or equal to 50 μs and a modulation fall time of the laser beam of less than or equal to 50 μs.
  • 4. The apparatus of claim 1, further comprising an analog modulator coupled to the continuous-wave laser source and configured to modulate the laser beam between two or more power levels based on an analog signal.
  • 5. The apparatus of claim 1, wherein the digital modulation includes a change in duty cycle, a change in modulation period, or a change in duty cycle and modulation period.
  • 6. An apparatus, comprising: a laser source configured to produce a continuous-wave laser beam;focusing optics configured to focus the continuous-wave laser beam at a target within a focus field;a scanner coupled to the focusing optics and configured to scan the focused laser beam at a variable speed along a scan path; anda digital modulator coupled to the laser source and configured to digitally modulate the laser beam between a first digital modulation power level and a second digital modulation power level during the scanning along the scan path to adjust a laser beam average power received by the target along the scan path and to provide the target with a predetermined fluence in relation to one or more laser process thresholds associated with the target.
  • 7. An apparatus, comprising: a laser system configured to direct a continuous-wave laser beam to a target along a scan path at a variable scan velocity, wherein the laser system includes a digital modulator configured to adjust a digital modulation of continuous-wave laser beam power between a first digital modulation power level and a second digital modulation power level during movement of the continuous-wave laser beam along the scan path and in relation to the variable scan velocity to provide a fluence at the target within a predetermined fluence range along the scan path.
  • 8. The apparatus of claim 7, wherein the digital modulator is configured to provide the digital modulation such that a rise time of the continuous-wave laser beam power is less than or equal to 50 μs and a fall time of the continuous-wave laser beam power is less than or equal to 50 μs.
  • 9. The apparatus of claim 7, wherein the digital modulator is configured to adjust the digital modulation to decrease a laser beam average power according to a decrease in scan speed and to increase a laser beam average power according to an increase in scan speed.
  • 10. The apparatus of claim 7, wherein the predetermined fluence range includes upper and lower material processing fluence thresholds associated with the target.
  • 11. The apparatus of claim 8, wherein the laser system is configured to laser pattern a feature at the target along the scan path.
  • 12. The apparatus of claim 7, wherein the digital modulator is configured to adjust at least one of a duty cycle or modulation period of the digital modulation.
  • 13. The apparatus of claim 7, wherein the digital modulator is configured to adjust the digital modulation of continuous-wave laser beam power to alternate between the first digital modulation power level having substantially zero continuous-wave laser beam power and the second modulation power level having a predetermined laser beam power that is greater than zero.
  • 14. The apparatus of claim 7, wherein the laser system includes an analog modulator configured to adjust an analog modulation of the continuous-wave laser beam based on the variable scan velocity.
  • 15. The apparatus of claim 7, wherein the laser system includes a controller configured to determine a laser beam digital modulation change that corresponds to at least one change in scan velocity associated with the variable scan velocity and the predetermined fluence range.
  • 16. The apparatus of claim 7, wherein the predetermined fluence range varies along the scan path.
  • 17. The apparatus of claim 7, wherein the digital modulator is configured to adjust the digital modulation during a constant speed portion of the scan path so that the laser beam power changes to correspond to a variation of the predetermined fluence range.
  • 18. An apparatus, comprising: a laser system situated to direct a continuous-wave laser beam to a target along a scan path at a variable scan velocity, wherein the laser system includes a zoom beam expander situated to adjust a width of the laser beam to provide the laser beam with a variable spot size at the target, a 3D scanning system having a z-axis focus adjust optical system and a galvanometer scanning system wherein the 3D scanning system is situated to receive the laser beam from the zoom beam expander and to scan the laser beam with the variable spot size along the scan path at the target, and a controller configured to adjust a digital modulation of the continuous-wave laser beam during movement of the continuous-wave laser beam along the scan path and in relation to the variable scan velocity to provide a fluence at the target within a predetermined fluence range along the scan path.
  • 19. The apparatus of claim 18, wherein the laser system is configured to provide the fluence within the predetermined fluence range by varying the variable spot size and adjusting the digital modulation.
  • 20. The apparatus of claim 18, wherein the laser system is configured to adjust the width of the laser beam based on features of different width at a common plane at the target.
  • 21. The apparatus of claim 18, wherein the target includes a metal powder, and the laser system is configured to selectively melt the metal powder with the laser beam to form a 3D object.
  • 22. The apparatus of claim 18, wherein the laser system includes focusing optics situated to receive the laser beam from the 3D scanning system with a laser beam width in a range of width adjustment provided by the zoom beam expander and to focus the laser beam at the target.
CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No. 15/357,484, filed Nov. 21, 2016, which claims the benefit of U.S. Provisional Patent Application No. 62/292,108, filed Feb. 5, 2016, and U.S. Provisional Patent Application No. 62/258,774, filed Nov. 23, 2015, all of which are incorporated by reference herein in their entirety.

US Referenced Citations (450)
Number Name Date Kind
3388461 Lins Jun 1968 A
4138190 Bryngdahl Feb 1979 A
4252403 Salisbury Feb 1981 A
4266851 Salisbury May 1981 A
4315666 Hicks, Jr. Feb 1982 A
4475027 Pressley Oct 1984 A
4475789 Kahn Oct 1984 A
4713518 Yamazaki et al. Dec 1987 A
4863538 Deckard Sep 1989 A
4953947 Bhagavatula Sep 1990 A
4998797 van den Bergh et al. Mar 1991 A
5008555 Mundy Apr 1991 A
5082349 Cordova-Plaza et al. Jan 1992 A
5129014 Bloomberg Jul 1992 A
5153773 Muraki et al. Oct 1992 A
5252991 Storlie et al. Oct 1993 A
5319195 Jones et al. Jun 1994 A
5427733 Benda et al. Jun 1995 A
5463497 Muraki et al. Oct 1995 A
5475415 Noethen Dec 1995 A
5475704 Lomashevich Dec 1995 A
5509597 Laferriere Apr 1996 A
5523543 Hunter, Jr. et al. Jun 1996 A
5530221 Benda et al. Jun 1996 A
5566196 Scifres Oct 1996 A
5642198 Long Jun 1997 A
5684642 Zumoto et al. Nov 1997 A
5719386 Hsieh et al. Feb 1998 A
5745284 Goldberg et al. Apr 1998 A
5748824 Smith May 1998 A
5761234 Craig et al. Jun 1998 A
5818630 Fermann et al. Oct 1998 A
5832415 Wilkening et al. Nov 1998 A
5837962 Overbeck Nov 1998 A
5841465 Fukunaga et al. Nov 1998 A
5864430 Dickey et al. Jan 1999 A
5903696 Krivoshlykov May 1999 A
5909306 Goldberg et al. Jun 1999 A
5932119 Kaplan et al. Aug 1999 A
5986807 Fork Nov 1999 A
5999548 Mori et al. Dec 1999 A
6072184 Okino et al. Jun 2000 A
6132104 Bliss et al. Oct 2000 A
6180912 Tatah Jan 2001 B1
6192171 Goodman et al. Feb 2001 B1
6265710 Walter Jul 2001 B1
6275630 Yang et al. Aug 2001 B1
6310995 Saini et al. Oct 2001 B1
6330382 Harshbarger et al. Dec 2001 B1
RE37585 Mourou et al. Mar 2002 E
6353203 Hokodate et al. Mar 2002 B1
6360042 Long Mar 2002 B1
6362004 Noblett Mar 2002 B1
6426840 Partanen et al. Jul 2002 B1
6433301 Dunsky et al. Aug 2002 B1
6434177 Jurgensen Aug 2002 B1
6434302 Fidric et al. Aug 2002 B1
6477301 Anthon et al. Nov 2002 B1
6483973 Mazzarese et al. Nov 2002 B1
6490376 Au et al. Dec 2002 B1
6496301 Koplow et al. Dec 2002 B1
6542665 Reed et al. Apr 2003 B2
6556340 Wysocki et al. Apr 2003 B1
6569382 Edman et al. May 2003 B1
6577314 Yoshida et al. Jun 2003 B1
6600149 Schulz et al. Jul 2003 B2
6639177 Ehrmann et al. Oct 2003 B2
6671293 Kopp et al. Dec 2003 B2
6711918 Kliner et al. Mar 2004 B1
6724528 Koplow et al. Apr 2004 B2
6772611 Kliner et al. Aug 2004 B2
6777645 Ehrmann et al. Aug 2004 B2
6779364 Tankala et al. Aug 2004 B2
6801550 Snell et al. Oct 2004 B1
6819815 Corbalis et al. Nov 2004 B1
6825974 Kliner et al. Nov 2004 B2
6839163 Jakobson et al. Jan 2005 B1
6882786 Kliner et al. Apr 2005 B1
6895154 Johnson et al. May 2005 B2
6917742 Po Jul 2005 B2
6941053 Lauzon et al. Sep 2005 B2
6963062 Cyr et al. Nov 2005 B2
6989508 Ehrmann et al. Jan 2006 B2
7068900 Croteau et al. Jun 2006 B2
7079566 Kido et al. Jul 2006 B2
7099533 Chenard Aug 2006 B1
7099535 Bhagavatula et al. Aug 2006 B2
7116887 Farroni et al. Oct 2006 B2
7146073 Wan Dec 2006 B2
7148447 Ehrmann et al. Dec 2006 B2
7151787 Kulp et al. Dec 2006 B2
7151788 Imakado et al. Dec 2006 B2
7157661 Amako Jan 2007 B2
7170913 Araujo et al. Jan 2007 B2
7174078 Libori et al. Feb 2007 B2
7184630 Kwon et al. Feb 2007 B2
7193771 Smith et al. Mar 2007 B1
7235150 Bischel et al. Jun 2007 B2
7257293 Fini et al. Aug 2007 B1
7317857 Manyam et al. Jan 2008 B2
7318450 Nobili Jan 2008 B2
7349123 Clarke et al. Mar 2008 B2
7359604 Po Apr 2008 B2
7373070 Wetter et al. May 2008 B2
7382389 Cordingley et al. Jun 2008 B2
7394476 Cordingley et al. Jul 2008 B2
7421175 Varnham Sep 2008 B2
7437041 Po Oct 2008 B2
7463805 Li et al. Dec 2008 B2
7526166 Bookbinder et al. Apr 2009 B2
7527977 Fruetel et al. May 2009 B1
7537395 Savage-Leuchs May 2009 B2
7592568 Varnham et al. Sep 2009 B2
7593435 Gapontsev et al. Sep 2009 B2
7622710 Gluckstad Nov 2009 B2
7628865 Singh Dec 2009 B2
7748913 Oba Jul 2010 B2
7764854 Fini Jul 2010 B2
7781778 Moon et al. Aug 2010 B2
7783149 Fini Aug 2010 B2
7835608 Minelly et al. Nov 2010 B2
7839901 Meleshkevich et al. Nov 2010 B2
7876495 Minelly Jan 2011 B1
7880961 Feve et al. Feb 2011 B1
7920767 Fini Apr 2011 B2
7924500 Minelly Apr 2011 B1
7925125 Cyr et al. Apr 2011 B2
7955905 Cordingley et al. Jun 2011 B2
7955906 Cordingley et al. Jun 2011 B2
8027555 Kliner et al. Sep 2011 B1
8071912 Costin, Sr. et al. Dec 2011 B2
8217304 Cordingley et al. Jul 2012 B2
8237788 Cooper et al. Aug 2012 B2
8243764 Tucker et al. Aug 2012 B2
8251475 Murray et al. Aug 2012 B2
8269108 Kunishi et al. Sep 2012 B2
8270441 Rogers et al. Sep 2012 B2
8270445 Morasse et al. Sep 2012 B2
8278591 Chouf et al. Oct 2012 B2
8288679 Unrath Oct 2012 B2
8288683 Jennings et al. Oct 2012 B2
8310009 Saran et al. Nov 2012 B2
8317413 Fisher et al. Nov 2012 B2
8357620 Takagi Jan 2013 B2
8362391 Partlo et al. Jan 2013 B2
8395084 Tanaka Mar 2013 B2
8404998 Unrath et al. Mar 2013 B2
8411710 Tamaoki Apr 2013 B2
8414264 Bolms et al. Apr 2013 B2
8415613 Heyn et al. Apr 2013 B2
8433161 Langseth et al. Apr 2013 B2
8442303 Cheng et al. May 2013 B2
8472099 Fujino et al. Jun 2013 B2
8509577 Liu Aug 2013 B2
8526110 Honea et al. Sep 2013 B1
8537871 Saracco Sep 2013 B2
8542145 Galati Sep 2013 B2
8542971 Chatigny Sep 2013 B2
8593725 Kliner et al. Nov 2013 B2
8711471 Liu et al. Apr 2014 B2
8728591 Inada et al. May 2014 B2
8755649 Yilmaz et al. Jun 2014 B2
8755660 Minelly Jun 2014 B1
8774237 Maryashin et al. Jul 2014 B2
8781269 Huber et al. Jul 2014 B2
8809734 Cordingley et al. Aug 2014 B2
8835804 Farmer et al. Sep 2014 B2
8861910 Yun Oct 2014 B2
8873134 Price et al. Oct 2014 B2
8947768 Kliner et al. Feb 2015 B2
8948218 Gapontsev et al. Feb 2015 B2
8953914 Genier Feb 2015 B2
8958144 Rataj et al. Feb 2015 B2
9014220 Minelly et al. Apr 2015 B2
9099838 Baker Aug 2015 B2
9136663 Taya Sep 2015 B2
9140873 Minelly Sep 2015 B2
9158066 Fini et al. Oct 2015 B2
9170359 Van Bommel et al. Oct 2015 B2
9200887 Potsaid et al. Dec 2015 B2
9207395 Fini et al. Dec 2015 B2
9217825 Ye et al. Dec 2015 B2
9250390 Muendel et al. Feb 2016 B2
9310560 Chann et al. Apr 2016 B2
9322989 Fini et al. Apr 2016 B2
9325151 Fini et al. Apr 2016 B1
9339890 Woods et al. May 2016 B2
9366887 Tayebati et al. Jun 2016 B2
9397466 McComb et al. Jul 2016 B2
9431786 Savage-Leuchs Aug 2016 B2
9442252 Genier Sep 2016 B2
9482821 Huber et al. Nov 2016 B2
9496683 Kanskar Nov 2016 B1
9507084 Fini et al. Dec 2016 B2
9537042 Dittli et al. Jan 2017 B2
9547121 Hou et al. Jan 2017 B2
9634462 Kliner et al. Apr 2017 B2
9837783 Kliner et al. Dec 2017 B2
10048661 Arthur et al. Aug 2018 B2
10112262 Cheverton et al. Oct 2018 B2
10207489 Dave et al. Feb 2019 B2
10646963 Victor et al. May 2020 B2
10656427 Rivera et al. May 2020 B2
10656440 Kliner et al. May 2020 B2
10663767 Kliner et al. May 2020 B2
10670872 Karlsen et al. Jun 2020 B2
10705348 Martinsen et al. Jul 2020 B2
10730785 Brown et al. Aug 2020 B2
10751834 Koponen et al. Aug 2020 B2
10971885 Kliner et al. Apr 2021 B2
20010045149 Dunsky et al. Nov 2001 A1
20010050364 Tanaka et al. Dec 2001 A1
20020097963 Ukechi et al. Jul 2002 A1
20020146202 Reed et al. Oct 2002 A1
20020147394 Ellingsen Oct 2002 A1
20020158052 Ehrmann et al. Oct 2002 A1
20020159685 Cormack Oct 2002 A1
20020168139 Clarkson et al. Nov 2002 A1
20020176676 Johnson et al. Nov 2002 A1
20030031407 Weisberg et al. Feb 2003 A1
20030032204 Walt et al. Feb 2003 A1
20030043384 Hill Mar 2003 A1
20030059184 Tankala et al. Mar 2003 A1
20030095578 Kopp et al. May 2003 A1
20030118305 Reed et al. Jun 2003 A1
20030174387 Eggleton et al. Sep 2003 A1
20030213998 Hsu et al. Nov 2003 A1
20030219208 Kwon et al. Nov 2003 A1
20040013379 Johnson et al. Jan 2004 A1
20040031779 Cahill et al. Feb 2004 A1
20040086245 Farroni et al. May 2004 A1
20040105087 Gogolla Jun 2004 A1
20040112634 Tanaka et al. Jun 2004 A1
20040126059 Bhagavatula et al. Jul 2004 A1
20040207936 Yamamoto et al. Oct 2004 A1
20040208464 Po Oct 2004 A1
20040247222 Park Dec 2004 A1
20050002607 Neuhaus et al. Jan 2005 A1
20050017156 Ehrmann Jan 2005 A1
20050027288 Oyagi et al. Feb 2005 A1
20050041697 Seifert et al. Feb 2005 A1
20050105854 Dong et al. May 2005 A1
20050168847 Sasaki Aug 2005 A1
20050185892 Kwon et al. Aug 2005 A1
20050191017 Croteau et al. Sep 2005 A1
20050233557 Tanaka et al. Oct 2005 A1
20050259944 Anderson et al. Nov 2005 A1
20050265678 Manyam et al. Dec 2005 A1
20050271340 Weisberg et al. Dec 2005 A1
20060013532 Wan Jan 2006 A1
20060024001 Kobayashi Feb 2006 A1
20060054606 Amako Mar 2006 A1
20060067632 Broeng et al. Mar 2006 A1
20060215976 Singh et al. Sep 2006 A1
20060219673 Varnham et al. Oct 2006 A1
20060275705 Dorogy et al. Dec 2006 A1
20060291788 Po Dec 2006 A1
20070026676 Li et al. Feb 2007 A1
20070041083 Di Teodoro et al. Feb 2007 A1
20070047940 Matsumoto et al. Mar 2007 A1
20070075060 Shedlov et al. Apr 2007 A1
20070104436 Li et al. May 2007 A1
20070104438 Varnham May 2007 A1
20070147751 Fini Jun 2007 A1
20070178674 Imai et al. Aug 2007 A1
20070195850 Schluter et al. Aug 2007 A1
20070206900 Po Sep 2007 A1
20070215820 Cordingley et al. Sep 2007 A1
20070251543 Singh Nov 2007 A1
20070280597 Nakai et al. Dec 2007 A1
20080037604 Savage-Leuchs Feb 2008 A1
20080141724 Fuflyigin Jun 2008 A1
20080154249 Cao Jun 2008 A1
20080181567 Bookbinder et al. Jul 2008 A1
20080231939 Gluckstad Sep 2008 A1
20080246024 Touwslager et al. Oct 2008 A1
20080251504 Lu et al. Oct 2008 A1
20090034059 Fini Feb 2009 A1
20090052849 Lee et al. Feb 2009 A1
20090059353 Fini Mar 2009 A1
20090080472 Yao et al. Mar 2009 A1
20090080835 Frith Mar 2009 A1
20090122377 Wagner May 2009 A1
20090127477 Tanaka et al. May 2009 A1
20090129237 Chen et al. May 2009 A1
20090152247 Jennings et al. Jun 2009 A1
20090154512 Simons et al. Jun 2009 A1
20090175301 Li et al. Jul 2009 A1
20090202191 Ramachandran Aug 2009 A1
20090257621 Silver Oct 2009 A1
20090274833 Li Nov 2009 A1
20090297108 Ushiwata et al. Dec 2009 A1
20090297140 Heismann et al. Dec 2009 A1
20090314752 Manens et al. Dec 2009 A1
20090324233 Samartsev et al. Dec 2009 A1
20100025387 Arai et al. Feb 2010 A1
20100067013 Howieson et al. Mar 2010 A1
20100067555 Austin et al. Mar 2010 A1
20100067860 Ikeda et al. Mar 2010 A1
20100116794 Taido et al. May 2010 A1
20100129029 Westbrook May 2010 A1
20100150186 Mizuuchi Jun 2010 A1
20100150201 Shin et al. Jun 2010 A1
20100163537 Furuta et al. Jul 2010 A1
20100187409 Cristiani et al. Jul 2010 A1
20100225974 Sandstrom Sep 2010 A1
20100230665 Verschuren et al. Sep 2010 A1
20100251437 Heyn et al. Sep 2010 A1
20100252543 Manens et al. Oct 2010 A1
20100303419 Benjamin et al. Dec 2010 A1
20100326969 Tsukamoto et al. Dec 2010 A1
20110032602 Rothenberg Feb 2011 A1
20110058250 Liu et al. Mar 2011 A1
20110080476 Dinauer et al. Apr 2011 A1
20110091155 Yilmaz et al. Apr 2011 A1
20110127697 Milne Jun 2011 A1
20110133365 Ushimaru et al. Jun 2011 A1
20110134512 Ahn et al. Jun 2011 A1
20110163077 Partlo et al. Jul 2011 A1
20110187025 Costin, Sr. Aug 2011 A1
20110243161 Tucker et al. Oct 2011 A1
20110248005 Briand et al. Oct 2011 A1
20110249940 Sasaoka et al. Oct 2011 A1
20110253668 Winoto et al. Oct 2011 A1
20110278277 Stork Genannt Wersborg Nov 2011 A1
20110279826 Miura et al. Nov 2011 A1
20110297229 Gu et al. Dec 2011 A1
20110305249 Gapontsev et al. Dec 2011 A1
20110305256 Chann Dec 2011 A1
20110316029 Maruyama et al. Dec 2011 A1
20120002919 Liu Jan 2012 A1
20120009511 Dmitriev Jan 2012 A1
20120051084 Yalin et al. Mar 2012 A1
20120051692 Seo Mar 2012 A1
20120082410 Peng et al. Apr 2012 A1
20120093461 Ramachandran Apr 2012 A1
20120127097 Gaynor et al. May 2012 A1
20120128294 Voss et al. May 2012 A1
20120145685 Ream et al. Jun 2012 A1
20120148823 Chu Jun 2012 A1
20120156458 Chu Jun 2012 A1
20120168411 Farmer et al. Jul 2012 A1
20120219026 Saracco et al. Aug 2012 A1
20120262781 Price et al. Oct 2012 A1
20120267345 Clark et al. Oct 2012 A1
20120295071 Sato Nov 2012 A1
20120301733 Eckert et al. Nov 2012 A1
20120301737 Labelle et al. Nov 2012 A1
20120321262 Goell et al. Dec 2012 A1
20120329974 Inada et al. Dec 2012 A1
20130005139 Krasnov et al. Jan 2013 A1
20130022754 Bennett et al. Jan 2013 A1
20130023086 Chikama et al. Jan 2013 A1
20130027648 Moriwaki Jan 2013 A1
20130028276 Minelly et al. Jan 2013 A1
20130038923 Jespersen et al. Feb 2013 A1
20130044768 Ter-Mikirtychev Feb 2013 A1
20130087694 Creeden et al. Apr 2013 A1
20130095260 Bovatsek et al. Apr 2013 A1
20130134637 Wiesner et al. May 2013 A1
20130146569 Woods et al. Jun 2013 A1
20130148925 Muendel et al. Jun 2013 A1
20130186871 Suzuki et al. Jul 2013 A1
20130223792 Huber et al. Aug 2013 A1
20130228442 Mohaptatra et al. Sep 2013 A1
20130251324 Fini et al. Sep 2013 A1
20130272657 Salokatve Oct 2013 A1
20130294728 Rockwell Nov 2013 A1
20130299468 Unrath Nov 2013 A1
20130301300 Duerksen et al. Nov 2013 A1
20130308661 Nishimura et al. Nov 2013 A1
20130343703 Genier Dec 2013 A1
20140044143 Clarkson et al. Feb 2014 A1
20140086526 Starodubov et al. Mar 2014 A1
20140104618 Potsaid et al. Apr 2014 A1
20140155873 Bor Jun 2014 A1
20140177038 Rrataj et al. Jun 2014 A1
20140178023 Oh et al. Jun 2014 A1
20140205236 Noguchi et al. Jul 2014 A1
20140233900 Hugonnot et al. Aug 2014 A1
20140241385 Fomin et al. Aug 2014 A1
20140259589 Xu et al. Sep 2014 A1
20140263209 Burris et al. Sep 2014 A1
20140268310 Ye et al. Sep 2014 A1
20140313513 Liao Oct 2014 A1
20140319381 Gross Oct 2014 A1
20140332254 Pellerite et al. Nov 2014 A1
20140333931 Lu et al. Nov 2014 A1
20140334788 Fini et al. Nov 2014 A1
20150049987 Grasso et al. Feb 2015 A1
20150086159 Salokatve et al. Mar 2015 A1
20150096963 Bruck et al. Apr 2015 A1
20150104139 Brunet et al. Apr 2015 A1
20150125114 Genier May 2015 A1
20150125115 Genier May 2015 A1
20150138630 Honea et al. May 2015 A1
20150165556 Jones et al. Jun 2015 A1
20150217402 Hesse et al. Aug 2015 A1
20150241632 Chann et al. Aug 2015 A1
20150283613 Backlund et al. Oct 2015 A1
20150293300 Fini et al. Oct 2015 A1
20150293306 Huber et al. Oct 2015 A1
20150314612 Balasini et al. Nov 2015 A1
20150316716 Fini et al. Nov 2015 A1
20150325977 Gu et al. Nov 2015 A1
20150331205 Tayebati et al. Nov 2015 A1
20150349481 Kliner Dec 2015 A1
20150352664 Errico et al. Dec 2015 A1
20150372445 Harter Dec 2015 A1
20150378184 Tayebati et al. Dec 2015 A1
20160013607 McComb et al. Jan 2016 A1
20160052162 Colin et al. Feb 2016 A1
20160097903 Li et al. Apr 2016 A1
20160104995 Savage-Leuchs Apr 2016 A1
20160111851 Kliner et al. Apr 2016 A1
20160114431 Cheverton et al. Apr 2016 A1
20160116679 Muendel et al. Apr 2016 A1
20160158889 Carter et al. Jun 2016 A1
20160175935 Ladewig et al. Jun 2016 A1
20160179064 Arthur et al. Jun 2016 A1
20160187646 Ehrmann Jun 2016 A1
20160196072 Smith Jul 2016 A1
20160207111 Robrecht et al. Jul 2016 A1
20160218476 Kliner et al. Jul 2016 A1
20160285227 Farrow et al. Sep 2016 A1
20160294150 Johnson Oct 2016 A1
20160320565 Brown et al. Nov 2016 A1
20160320685 Tayebati et al. Nov 2016 A1
20160369332 Rothberg et al. Dec 2016 A1
20170003461 Tayebati et al. Jan 2017 A1
20170036299 Goya et al. Feb 2017 A1
20170090119 Logan et al. Mar 2017 A1
20170090462 Dave et al. Mar 2017 A1
20170110845 Hou et al. Apr 2017 A1
20170120537 DeMuth et al. May 2017 A1
20170162999 Saracco et al. Jun 2017 A1
20170271837 Hemenway et al. Sep 2017 A1
20170293084 Zhou et al. Oct 2017 A1
20170336580 Tayebati et al. Nov 2017 A1
20170363810 Holland et al. Dec 2017 A1
20180059343 Kliner Mar 2018 A1
20180154484 Hall Jun 2018 A1
20180203185 Farrow et al. Jul 2018 A1
20190217422 Kramer et al. Jul 2019 A1
20190250398 Small et al. Aug 2019 A1
20190258091 Kliner et al. Aug 2019 A1
20190270161 Allenberg-Rabe et al. Sep 2019 A1
20200251237 Gross Aug 2020 A1
20200263978 Pieger et al. Aug 2020 A1
20200333640 Kliner et al. Oct 2020 A1
Foreign Referenced Citations (131)
Number Date Country
12235 Aug 2009 BY
2292974 Jun 2000 CA
2637535 Aug 2007 CA
1212056 Mar 1999 CN
1445600 Oct 2003 CN
1217030 Aug 2005 CN
1926460 Mar 2007 CN
1966224 May 2007 CN
101836309 Oct 2007 CN
101071926 Nov 2007 CN
101133351 Feb 2008 CN
101143405 Mar 2008 CN
101303269 Nov 2008 CN
101314196 Dec 2008 CN
101403822 Apr 2009 CN
101733561 Jun 2010 CN
101821081 Sep 2010 CN
101836309 Sep 2010 CN
201783759 Apr 2011 CN
102084282 Jun 2011 CN
102176104 Sep 2011 CN
102207618 Oct 2011 CN
102289072 Dec 2011 CN
102301200 Dec 2011 CN
102441740 May 2012 CN
102448623 May 2012 CN
102481664 May 2012 CN
102640026 Aug 2012 CN
103173760 Jun 2013 CN
103521920 Jan 2014 CN
104169763 Nov 2014 CN
104475970 Apr 2015 CN
104704821 Jun 2015 CN
104759623 Jul 2015 CN
104979748 Oct 2015 CN
104999670 Oct 2015 CN
105163894 Dec 2015 CN
105290610 Feb 2016 CN
105365215 Mar 2016 CN
105383060 Mar 2016 CN
105682900 Jun 2016 CN
105965015 Sep 2016 CN
106163703 Nov 2016 CN
106163774 Nov 2016 CN
106180712 Dec 2016 CN
106312567 Jan 2017 CN
206010148 Mar 2017 CN
106660123 May 2017 CN
4200587 Apr 1993 DE
4437284 Apr 1996 DE
203 20 269 Apr 2004 DE
10321102 Dec 2004 DE
60312826 Jan 2008 DE
102013205029 Sep 2014 DE
102013215362 Feb 2015 DE
102013017792 Apr 2015 DE
202016004237 Aug 2016 DE
102015103127 Sep 2016 DE
0048855 May 1982 EP
0366856 May 1990 EP
0731743 Sep 1996 EP
1238745 Sep 2002 EP
1340583 Sep 2003 EP
1800700 Jun 2007 EP
1974848 Oct 2008 EP
1266259 May 2011 EP
2587564 May 2013 EP
2642246 Sep 2013 EP
2886226 Jun 2015 EP
60046892 Mar 1985 JP
H02220314 Sep 1990 JP
H06-297168 Oct 1994 JP
10282450 Oct 1998 JP
H11780 Jan 1999 JP
H11-231138 Aug 1999 JP
H11-287922 Oct 1999 JP
H11-344636 Dec 1999 JP
2003-129862 May 2003 JP
2003200286 Jul 2003 JP
2004291031 Oct 2004 JP
2005-070608 Mar 2005 JP
2005-203430 Jul 2005 JP
2006-45584 Feb 2006 JP
2006-098085 Apr 2006 JP
2006-106227 Apr 2006 JP
2006-285234 Oct 2006 JP
2007-518566 Jul 2007 JP
4112355 Jul 2008 JP
2008-281395 Nov 2008 JP
2009-142866 Jul 2009 JP
2009-193070 Aug 2009 JP
2009-248157 Oct 2009 JP
2012-059920 Mar 2012 JP
2012-528011 Nov 2012 JP
2015-500571 Jan 2015 JP
2015-196265 Nov 2015 JP
2016-201558 Dec 2016 JP
10-2011-0109957 Oct 2011 KR
2008742 Feb 1994 RU
2021881 Oct 1994 RU
2365476 Aug 2009 RU
2528287 Sep 2014 RU
504425 Oct 2002 TW
553430 Sep 2003 TW
200633062 Sep 2006 TW
I271904 Jan 2007 TW
200707466 Feb 2007 TW
201307949 Feb 2013 TW
WO 1995011100 Apr 1995 WO
WO 1995011101 Apr 1995 WO
WO 0174529 Oct 2001 WO
WO 2004027477 Apr 2004 WO
WO 2005053895 Jun 2005 WO
WO 2008053915 May 2008 WO
WO 2010029243 Mar 2010 WO
WO 2011124671 Oct 2011 WO
WO 2012088361 Jun 2012 WO
WO 2012102655 Aug 2012 WO
WO 2012165389 Dec 2012 WO
WO 2013086227 Jun 2013 WO
WO 2013090236 Jun 2013 WO
WO 2014074947 May 2014 WO
WO 2014154901 Oct 2014 WO
WO 2014179345 Nov 2014 WO
WO 2015146591 Oct 2015 WO
WO 2015189883 Dec 2015 WO
WO 2016059938 Apr 2016 WO
WO 2016085334 Jun 2016 WO
WO 2016156824 Oct 2016 WO
WO 2017008022 Jan 2017 WO
WO 2017136831 Aug 2017 WO
Non-Patent Literature Citations (341)
Entry
3-Axis Laser Scanning Systems, downloaded from http://www.camtech.com/index.php?option=com_content&view=article&id=131&Itemid=181, 4 pages, Dec. 31, 2014.
Adelman et al., “Measurement of Relative State-to-State Rate Constants for the Reaction D+H2(v, j)→HD(v′, j′)+H,” J. Chem. Phys., 97:7323-7341 (Nov. 15, 1992).
Advisory Action from U.S. Appl. No. 15/607,410, dated Sep. 24, 2018, 6 pages.
Affine Transformation—from Wolfram MathWorld, http://mathworld.wolfram.com/AffineTransformation.html, downloaded Feb. 21, 2014, 2 pages.
Alfano et al., “Photodissociation and Recombination Dynamics of I2− in Solution,” Ultrafast Phenomena VIII, (Springer-Verlag, New York), pp. 653-655 (Jan. 1993).
AlMangour et al., “Scanning strategies for texture and anisotropy tailoring during selective laser melting of TiC/316L stainless steel nanocomposites,” Journal of Alloys and Compounds, 728:424-435 (Aug. 5, 2017).
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,399, dated May 25, 2018, 3 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,399, dated Jul. 27, 2018, 9 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,410, dated May 25, 2018, 3 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,410, dated Jul. 24, 2018, 9 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,411, dated Jan. 17, 2018, 2 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,411, dated Sep. 12, 2018, 17 pages.
Applicant-Initiated Interview Summary from U.S. Appl. No. 15/607,399, dated Dec. 26, 2018, 7 pages.
“ARM,” Coherent, available at: http://www.corelase.fi/products/arm/, 6 pages, retrieved May 26, 2017.
Ayoola, “Study of Fundamental Laser Material Interaction Parameters in Solid and Powder Melting,” Ph.D. Thesis, Cranfield University, 192 pages (May 2016).
Bai et al., “Effect of Bimodal Powder Mixture on Powder Packing Density and Sintered Density in Binder Jetting of Metals,” 26th Annual International Solid Freeform Fabrication Symposium, 14 pages (Aug. 10-12, 2015).
Bergmann et al., “Effects of diode laser superposition on pulsed laser welding of aluminum,” Physics Procedia, 41:180-189 (2013).
Bernasconi et al., “Kinetics of Ionization of Nitromethane and Phenylnitromethane by Amines and Carboxylate Ions in Me2SO-Water Mixtures. Evidence of Ammonium Ion-Nitronate Ion Hydrogen Bonded Complex Formation in Me2SO-Rich Solvent Mixtures,” J. Org. Chem., 53:3342-3351 (Jul. 1988).
Bertoli et al., “On the limitations of Volumetric Energy Density as a design parameter for Selective Laser Melting,” Materials and Design, 113:331-340 (Oct. 19, 2016).
Blake et al., “The H+D2 Reaction: HD(v=1, J) and HD(v=2, J) Distributions at a Collision Energy of 1.3 eV,” Chem. Phys. Lett., 153:365-370 (Dec. 23, 1988).
Brown et al., “Fundamentals of Laser-Material Interaction and Application to Multiscale Surface Modification,” Chapter 4, Laser Precision Microfabrication, pp. 91-120 (2010).
Burger et al., “Implementation of a spatial light modulator for intracavity beam shaping,” J. Opt., 17:1-7, (2015).
“Canunda, Application Note,” CAILabs, available at: www.cailabs.com, 16 pages (Jun. 10, 2015).
“Canunda, Application Note: Flexible high-power laser beam shaping,” CAILabs, available at: www.cailabs.com, 22 pages, date unknown (cited by the Examiner in a related U.S. Appl. No. 15/607,399).
Caprio, “Investigation of emission modes in the SLM of AISI 316L: modelling and process diagnosis,” Ph.D. Thesis, Polytechnic University of Milan, 3 pages (Apr. 28, 2017).—Abstract only.
Chen et al., “An Algorithm for correction of Distortion of Laser marking Systems,” IEEE International Conference on Control and Automation, Guangzhou, China, 5 pages (May 30-Jun. 1, 2007).
Chen et al., “Improving additive manufacturing processability of hard-to-process overhanging structure by selective laser melting,” Journal of Materials Processing Tech., 250:99-108 (Jul. 1, 2017).
Chung, “Solution-Processed Flexible Transparent Conductors Composed of Silver Nanowire Networks Embedded in Indium Tin Oxide Nanoparticle Matrices,” Nano Research, 10 pages (Sep. 24, 2012).
Cloots et al., “Investigations on the microstructure and crack formation of IN738LC samples processed by selective laser melting using Gaussian and doughnut profiles,” Materials and Design, 89:770-784 (2016).
Daniel et al., “Novel technique for mode selection in a large-mode-area fiber laser,” Conference on Lasers and Electro-Optics 2010, OSA Technical Digest (CD) (Optical Society of America), paper CWC5, 2 pages (Jan. 2010).
Daniel et al., “Novel technique for mode selection in a multimode fiber laser,” Optics Express, 19:12434-12439 (Jun. 20, 2011).
DebRoy et al., “Additive manufacturing of metallic components—Process, structure and properties,” Progress in Materials Science, 92:112-224 (2018).
Dehoff et al., “Site specific control of crystallographic grain orientation through electron beam additive manufacturing,” Materials Science and Technology, 31:931-938 (2015).
Demir et al., “From pulsed to continuous wave emission in SLM with contemporary fiber laser sources: effect of temporal and spatial pulse overlap in part quality,” Int. J. Adv. Manuf. Technol., 91:2701-2714 (Jan. 10, 2017).
Dezfoli et al., “Determination and controlling of grain structure of metals after laser incidence: Theoretical approach,” Scientific Reports, 7:1-11 (Jan. 30, 2017).
Di Teodoro et al., “Diffraction-Limited, 300-kW Peak-Power Pulses from a Coiled Multimode Fiber Amplifier,” Optics Letters, 27:518-520 (May 2002).
Di Teodoro et al., “Diffraction-limited, 300-kW-peak-power Pulses from a Yb-doped Fiber Amplifier,” Conference on Lasers and Electro-Optics, OSA Technical Digest (Optical Society of America, Washington, DC), p. 592-593 (May 22-24, 2002).
Di Teodoro et al., “High-peak-power pulsed fiber sources,” Proc. of SPIE, 5448:561-571 (Sep. 20, 2004).
Duocastella et al., “Bessel and annular beams for materials processing,” Laser Photonics Rev. 6, pp. 607-621 (2012).
“Efficient and Simple Precision, Laser Processing Head PDT-B,” HIGHYAG, 6 pages, (Jan. 2010).
Eichenholz, “Photonic-crystal fibers have many uses,” Optoelectronics World, 4 pages (Aug. 2004).
“ENSIS Series,” Amada America, Inc., available at: http://www.amada.com/america/ensis-3015-aj, 2 pages, retrieved May 26, 2017.
European Search Report for related Application No. 18173438.5, 3 pages, dated Oct. 5, 2018.
Examiner-Initiated Interview Summary from U.S. Appl. No. 15/607,410, dated Jan. 31, 2019, 2 pages.
“EX-F Series,” MC Machinery Systems, Inc., available at: https://www.mcmachinery.com/products-and-solutions/ex-f-series/, 2 pages, retrieved May 26, 2017.
Extended European Search Report for related Application No. 18173438.5, 3 pages, dated Oct. 15, 2018 (with English translation).
Faidel et al., “Improvement of selective laser melting by beam shaping and minimized thermally induced effects in optical systems,” 9th International Conference on Photonic Technologies LANE 2016, pp. 1-4 (2016).
Farrow et al., “Bend-Loss Filtered, Large-Mode-Area Fiber Amplifiers: Experiments and Modeling,” Proceedings of the Solid State and Diode Laser Technology Review (Directed Energy Professional Society), P-9, 5 pages (2006).
Farrow et al., “Compact Fiber Lasers for Efficient High-Power Generation,” Proc. of SPIE, 6287:62870C-1-62870C-6 (Sep. 1, 2006).
Farrow et al., “Design of Refractive-Index and Rare-Earth-Dopant Distributions for Large-Mode-Area Fibers Used in Coiled High-Power Amplifiers,” Proc. of SPIE, 6453:64531C-1-64531C-11 (Feb. 22, 2007).
Farrow et al., “High-Peak-Power (>1.2 MW) Pulsed Fiber Amplifier,” Proc. of the SPIE, 6102:61020L-1-61020L-11 (Mar. 2006).
Farrow et al., “Numerical Modeling of Self-Focusing Beams in Fiber Amplifiers,” Proc. of the SPIE, 6453:645309-1-645309-9 (2007).
Farrow et al., “Peak-Power Limits on Fiber Amplifiers Imposed by Self-Focusing,” Optics Lett., 31:3423-3425 (Dec. 1, 2006).
Fève et al., “Four-wave mixing in nanosecond pulsed fiber amplifiers,” Optics Express, 15:4647-4662 (Apr. 16, 2007).
Fève et al., “Limiting Effects of Four-Wave Mixing in High-Power Pulsed Fiber Amplifiers,” Proc. of the SPIE, 6453:64531P-1-64531P-11 (Feb. 22, 2007).
Fey, “3D Printing and International Security,” PRIF Report No. 144, 47 pages (2017).
Final Office action from U.S. Appl. No. 15/607,411, dated Feb. 1, 2018, 27 pages.
Final Office action from U.S. Appl. No. 15/607,399, dated May 3, 2018, 31 pages.
Final Office action from U.S. Appl. No. 15/607,410, dated May 11, 2018, 29 pages.
Fini, “Bend-compensated design of large-mode-area fibers,” Optics Letters, 31:1963-1965 (Jul. 1, 2006).
Fini, “Large mode area fibers with asymmetric bend compensation,” Optics Express, 19:21866-21873 (Oct. 24, 2011).
Fini et al., “Bend-compensated large-mode-area fibers: achieving robust single-modedness with transformation optics,” Optics Express, 21:19173-19179 (Aug. 12, 2013).
First Office Action from Chinese Application No. 201410455972.X, dated Jan. 26, 2016, 21 pages (with English translation).
First Office Action from Chinese Application No. 201480019324.8, dated Apr. 5, 2017, 20 pages (with English translation).
First Office Action for related Chinese Application No. 201610051671.X, dated Jun. 4, 2018, 25 pages (with English translation).
First Office Action for related Chinese Application No. 201680068424.9, dated Jan. 29, 2019, 10 pages (with English translation).
Florentin et al., “Shaping the light amplified in a multimode fiber,” Official Journal of the CIOMP, Light: Science & Applications, 6:1-9 (Feb. 24, 2017).
Fox et al., “Effect of low-earth orbit space on radiation-induced absorption in rare-earth-doped optical fibers,” J. Non-Cryst. Solids, 378:79-88 (Oct. 15, 2013).
Fox et al., “Gamma Radiation Effects in Yb-Doped Optical Fiber,” Proc. of the SPIE, 6453:645328-1-645328-9 (Feb. 23, 2007).
Fox et al., “Gamma-Radiation-Induced Photodarkening in Unpumped Optical Fibers Doped with Rare-Earth Constituents,” IEEE Trans. on Nuclear Science, 57:1618-1625 (Jun. 2010).
Fox et al., “Investigation of radiation-induced photodarkening in passive erbium-, ytterbium-, and Yb/Er co-doped optical fibers,” Proc. of the SPIE, 6713:67130R-1-67130R-9 (Sep. 26, 2007).
Fox et al., “Radiation damage effects in doped fiber materials,” Proc. of the SPIE, 6873:68731F-1-68731F-9 (Feb. 22, 2008).
Fox et al., “Spectrally Resolved Transmission Loss in Gamma Irradiated Yb-Doped Optical Fibers,” IEEE J. Quant. Electron., 44:581-586 (Jun. 2008).
Fox et al., “Temperature and Dose-Rate Effects in Gamma Irradiated Rare-Earth Doped Fibers,” Proc. of SPIE, 7095:70950B-1-70950B-8 (Aug. 26, 2008).
Francis, “The Effects of Laser and Electron Beam Spot Size in Additive Manufacturing Processes,” Ph.D. Thesis, Carnegie Mellon University, 191 pages (May 2017).
Fuchs et al., “Beam shaping concepts with aspheric surfaces,” Proc. of SPIE, 9581:95810L-1-95810L-7 (Aug. 25, 2015).
Fuse, “Beam Shaping for Advanced Laser Materials Processing,” Laser Technik Journal, pp. 19-22 (Feb. 2015).
Garcia et al., “Fast adaptive laser shaping based on multiple laser incoherent combining,” Proc. of SPIE, 10097:1009705-1-1009705-15 (Feb. 22, 2017).
Gardner, “Precision Photolithography on Flexible Substrates,” http://azorescorp.com/downloads/Articles/AZORESFlexSubstrate.pdf (prior to Jan. 30, 2013).
Ghasemi et al., “Beam shaping design for coupling high power diode laser stack to fiber,” Applied Optics, 50:2927-2930 (Jun. 20, 2011).
Ghatak et al., “Design of Waveguide Refractive Index Profile to Obtain Flat Model Field,” SPIE, 3666:40-44 (Apr. 1999).
Ghouse et al., “The influence of laser parameters and scanning strategies on the mechanical properties of a stochastic porous material,” Materials and Design, 131:498-508 (2017).
Giannini et al., “Anticipating, measuring, and minimizing MEMS mirror scan error to improve laser scanning microscopy's speed and accuracy,” PLOS One, 14 pages (Oct. 3, 2017).
Gissibl et al., “Sub-micrometre accurate free-form optics by three-dimensional printing on single-mode fibres,” Nature Communications, 7:1-9 (Jun. 24, 2016).
Gockel et al., “Integrated melt pool and microstructure control for Ti-6Al-4V thin wall additive manufacturing,” Materials Science and Technology, 31:912-916 (Nov. 3, 2014).
Goers et al., “Development of a Compact Gas Imaging Sensor Employing cw Fiber-Amp-Pumped PPLN OPO,” Conference on Lasers and Electro-Optics, OSA Technical Digest (Optical Society of America, Washington, DC), p. 521 (May 11, 2001).
Goldberg et al., “Deep UV Generation by Frequency Tripling and Quadrupling of a High-Power Modelocked Semiconductor Laser,” Proceedings of the Quantum Electronics and Laser Science Conference, QPD18-2 (Baltimore) 2 pages (May 1995).
Goldberg et al., “Deep UV Generation by Frequency Quadrupling of a High-Power GaAlAs Semiconductor Laser,” Optics Lett., 20:1145-1147 (May 15, 1995).
Goldberg et al., “High Efficiency 3 W Side-Pumped Yb Fiber Amplifier and Laser,” Conference on Lasers and Electro-Optics, OSA Technical Digest (Optical Society of America, Washington, DC), p. 11-12 (May 24, 1999).
Goldberg et al., “Highly Efficient 4-W Yb-Doped Fiber Amplifier Pumped by a Broad-Stripe Laser Diode,” Optics Lett., 24:673-675 (May 15, 1999).
Goldberg et al., “High-Power Superfluorescent Source with a Side-Pumped Yb-Doped Double-Cladding Fiber,” Optics Letters, 23:1037-1039 (Jul. 1, 1998).
Goldberg et al., “Tunable UV Generation at 286 nm by Frequency Tripling of a High-Power Modelocked Semiconductor Laser,” Optics Lett., 20:1640-1642 (Aug. 1, 1995).
Golub, “Laser Beam Splitting by Diffractive Optics,” Optics and Photonics News, 6 pages (Feb. 2004).
Grigoriyants et al., “Tekhnologicheskie protsessy lazernoy obrabotki,” Moscow, izdatelstvo MGTU im. N.E. Baumana, p. 334 (2006).
Gunenthiram et al., “Analysis of laser-melt pool-powder bed interaction during the selective laser melting of a stainless steel,” Journal of Laser Applications, 29:022303-1-022303-8 (May 2017).
Gupta, “A Review on Layer Formation Studies in Selective Laser Melting of Steel Powders and Thin Wall Parts Using Pulse Shaping,” International Journal of Manufacturing and Material Processing, 3:9-15 (2017).
Hafner et al., “Tailored laser beam shaping for efficient and accurate microstructuring,” Applied Physics A, 124:111-1-111-9 (Jan. 10, 2018).
Han et al., “Reshaping collimated laser beams with Gaussian profile to uniform profiles,” Applied Optics, 22:3644-3647 (Nov. 15, 1983).
Han et al., “Selective laser melting of advanced Al—Al2O3, nanocomposites: Simulation, microstructure and mechanical properties,” Materials Science & Engineering A, 698:162-173, (May 17, 2017).
Hansen et al., “Beam shaping to control of weldpool size in width and depth,” Physics Procedia, 56:467-476 (2014).
Hauschild, “Application Specific Beam Profiles—New Surface and Thin-Film Refinement Processes using Beam Shaping Technologies,” Proc. of SPIE, 10085:100850J-1-100850J-9 (Feb. 22, 2017).
Headrick et al., “Application of laser photofragmentation-resonance enhanced multiphoton ionization to ion mobility spectrometry,” Applied Optics, 49:2204-2214 (Apr. 10, 2010).
Hebert, “Viewpoint: metallurgical aspects of powder bed metal additive manufacturing,” J. Mater. Sci., 51:1165-1175 (Nov. 18, 2015).
Heck, “Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering,” Nanophotonics, 6:93-107 (2017).
Heider et al., “Process Stabilization at welding Copper by Laser Power Modulation,” Physics Procedia, 12:81-87 (2011).
Hemenway et al., “Advances in high-brightness fiber-coupled laser modules for pumping multi-kW CW fiber lasers,” Proceedings of SPIE, 10086:1008605-1-1008605-7 (Feb. 22, 2017).
Hemenway et al., “High-brightness, fiber-coupled pump modules in fiber laser applications,” Proc. of SPIE, 8961:89611V-1-89611V-12 (Mar. 7, 2014).
Hengesbach et al., “Brightness and average power as driver for advancements in diode lasers and their applications,” Proc. SPIE, 9348, 18 pages (2015).
Hoops et al., “Detection of mercuric chloride by photofragment emission using a frequency-converted fiber amplifier,” Applied Optics, 46:4008-4014 (Jul. 1, 2007).
Hotoleanu et al., “High Order Modes Suppression in Large Mode Area Active Fibers by Controlling the Radial Distribution of the Rare Earth Dopant,” Proc. of the SPIE, 6102:61021T-1-61021T-8 (Feb. 23, 2006).
“How to Select a Beamsplitter,” IDEX—Optics & Photonics Marketplace, available at: https://www.cvilaseroptics.com/file/general/beamSplitters.pdf, 5 pages (Jan. 8, 2014).
Huang et al., “3D printing optical engine for controlling material microstructure,” Physics Procedia, 83:847-853 (2016).
Huang et al., “All-fiber mode-group-selective photonic lantern using graded-index multimode fibers,” Optics Express, 23:224-234 (Jan. 6, 2015).
Huang et al., “Double-cutting beam shaping technique for high-power diode laser area light source,” Optical Engineering, 52:106108-1-106108-6 (Oct. 2013).
Injeyan et al., “Introduction to Optical Fiber Lasers,” High-Power Laser Handbook, pp. 436-439 (2011).
International Preliminary Report on Patentability from International Application No. PCT/US2017/034848, dated Apr. 2, 2019, 9 pages.
International Search Report and Written Opinion for International Application No. PCT/US2013/060470, 7 pages, dated Jan. 16, 2014.
International Search Report and Written Opinion for International Application No. PCT/US2014/017841, 5 pages, dated Jun. 5, 2014.
International Search Report and Written Opinion for International Application No. PCT/US2014/017836, 6 pages, dated Jun. 10, 2014.
International Search Report and Written Opinion for related International Application No. PCT/US2016/041526, 6 pages, dated Oct. 20, 2016.
International Search Report and Written Opinion for related International Application No. PCT/US2016/053807, 6 pages, dated Jan. 19, 2017.
International Search Report and Written Opinion for International Application No. PCT/US2016/063086, 6 pages, dated Mar. 23, 2017.
International Search Report and Written Opinion for International Application No. PCT/US2017/014182, 9 pages, dated Mar. 31, 2017.
International Search Report and Written Opinion from International Application No. PCT/US2017/034848, dated Nov. 28, 2017, 15 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/015768, dated Jun. 11, 2018, 15 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/016305, dated Jun. 11, 2018, 10 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/016288, dated Jun. 11, 2018, 10 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024145, dated Jun. 21, 2018, 5 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/015710, dated Jun. 25, 2018, 17 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024548, dated Jun. 28, 2018, 6 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/015895, dated Jul. 10, 2018, 10 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024510, dated Jul. 12, 2018, 6 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/024944, dated Jul. 12, 2018, 8 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024974, dated Jul. 12, 2018, 6 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024908, dated Jul. 19, 2018, 8 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/022629, dated Jul. 26, 2018, 11 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/023944, dated Aug. 2, 2018, 7 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/026110, 12 pages, dated Aug. 8, 2018.
International Search Report and Written Opinion from International Application No. PCT/US2018/023012, dated Aug. 9, 2018, 7 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/023963, dated Aug. 9, 2018, 7 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/024899, dated Aug. 9, 2018, 7 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/024955, dated Aug. 9, 2018, 8 pages.
International Search Report and Written Opinion for International Application No. PCT/US2018/024953, dated Aug. 16, 2018, 8 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024954, dated Aug. 23, 2018, 7 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024958, dated Aug. 23, 2018, 6 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024227, dated Aug. 30, 2018, 7 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024904, dated Aug. 30, 2018, 5 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024971, dated Aug. 30, 2018, 8 pages.
International Search Report and Written Opinion from International Application No. PCT/US2018/024907, dated Sep. 27, 2018, 6 pages.
Ishiguro et al., “High Efficiency 4-kW Fiber Laser Cutting Machine,” Rev. Laser Eng., 39:680-684 (May 21, 2011).
Jain et al., “Multi-element fiber technology for space-division multiplexing applications,” Optics Express, 22:3787-3796 (Feb. 11, 2014).
Java—Transform a triangle to another triangle—Stack Overflow, http://stackoverflow.com/questions/1114257/transform-a-triangle-to-another-triangle?1q=1, downloaded Feb. 21, 2014, 3 pages.
Ji et al., “Meta-q-plate for complex beam shaping,” Scientific Reports, 6:1-7 (May 6, 2016).
Jin et al., “Mode Coupling Effects in Ring-Core Fibers for Space-Division Multiplexing Systems,” Journal of Lightwave Technology, 34:3365-3372 (Jul. 15, 2016).
Johnson et al., “Experimental and Theoretical Study of Inhomogeneous Electron Transfer in Betaine: Comparisons of Measured and Predicted Spectral Dynamics,” Chem. Phys., 176:555-574 (Oct. 15, 1993).
Johnson et al., “Ultrafast Experiments on the Role of Vibrational Modes in Electron Transfer,” Pure and Applied Chem., 64:1219-1224 (May 1992).
Kaden et al., “Selective laser melting of copper using ultrashort laser pulses,” Lasers in Manufacturing Conference 2017, pp. 1-5 (2017).
Kaden et al., “Selective laser melting of copper using ultrashort laser pulses,” Applied Physics A, 123:596-1-596-6 (Aug. 24, 2017).
Keicher et al., “Advanced 3D Printing of Metals and Electronics using Computational Fluid Dynamics,” Solid Freeform Fabrication Symposium, 32 pages (Aug. 2015).
King et al., “Observation of keyhole-mode laser melting in laser powder-bed fusion additive manufacturing,” Journal of Materials Processing Technology, 214:2915-2925 (2014).
Klerks et al., “Flexible beam shaping system for the next generation of process development in laser micromachining,” 9th International Conference on Photonic Technologies LANE 2016, pp. 1-8 (2016).
Kliner, “Novel, High-Brightness, Fibre Laser Platform for kW Materials Processing Applications,” 2015 European Conference on Lasers and Electro-Optics—European Quantum Electronics Conference (Optical Society of America, 2015), paper CJ_11_2, 1 page (Jun. 21-25, 2015).
Kliner et al., “4-kW fiber laser for metal cutting and welding,” Proc. of SPIE, 7914:791418-791418-8 (Feb. 22, 2011).
Kliner et al., “Comparison of Experimental and Theoretical Absolute Rates for Intervalence Electron Transfer,” J. Am. Chem. Soc., 114:8323-8325 (Oct. 7, 1992).
Kliner et al., “Comparison of Experimental and Theoretical Integral Cross Sections for D+H2(v=1, j=1)→HD(v′=1, j′)+H,” J. Chem. Phys., 95:1648-1662 (Aug. 1, 1991).
Kliner et al., “D+H2(v=1, J=1): Rovibronic State to Rovibronic State Reaction Dynamics,” J. Chem. Phys., 92:2107-2109 (Feb. 1, 1990).
Kliner et al., “Effect of Indistinguishable Nuclei on Product Rotational Distributions: H+HI→H2+I reactiona),” J. Chem. Phys., 90:4625-4327 (Apr. 15, 1989).
Kliner et al., “Efficient second, third, fourth, and fifth harmonic generation of a Yb-doped fiber amplifier,” Optics Communications, 210:393-398 (Sep. 15, 2002).
Kliner et al., “Efficient UV and Visible Generation Using a Pulsed Yb-Doped Fiber Amplifier,” Conference on Lasers and Electro-Optics, OSA Technical Digest (Optical Society of America, Washington, DC), p. CPDC10-1-CPDC10-3 (May 19-22, 2002).
Kliner et al., “Efficient visible and UV generation by frequency conversion of a mode-filtered fiber amplifier,” Proc. of SPIE, 4974:230-235 (Jul. 3, 2003).
Kliner et al., “Fiber laser allows processing of highly reflective materials,” Industrial Laser Solutions, 31:1-9 (Mar. 16, 2016).
Kliner et al., “High-Power Fiber Lasers,” Photonics & Imaging Technology, pp. 2-5 (Mar. 2017).
Kliner et al., “Laboratory Investigation of the Catalytic Reduction Technique for Detection of Atmospheric NOy,” J. Geophys. Res., 102:10759-10776 (May 20, 1997).
Kliner et al., “Laser Reflections: How fiber laser users are successfully processing highly reflective metals,” Shop Floor Lasers, available at: http://www.shopfloorlasers.com/laser-cutting/fiber/354-laser-reflections, 9 pages (Jan./Feb. 2017).
Kliner et al., “Measurements of Ground-State OH Rotational Energy-Transfer Rates,” J. Chem. Phys., 110:412-422 (Jan. 1, 1999).
Kliner et al., “Mode-Filtered Fiber Amplifier,” Sandia National Laboratories—Brochure, 44 pages (Sep. 13, 2007).
Kliner et al., “Narrow-Band, Tunable, Semiconductor-Laser-Based Source for Deep-UV Absorption Spectroscopy,” Optics Lett., 22:1418-1420 (Sep. 15, 1997).
Kliner et al., “Overview of Sandia's fiber laser program,” Proceedings of SPIE—The International Society for Optical Engineering, 6952:695202-1-695202-12 (Apr. 14, 2008).
Kliner et al., “Photodissociation and Vibrational Relaxation of I2− in Ethanol,” J. Chem. Phys., 98:5375-5389 (Apr. 1, 1993).
Kliner et al., “Photodissociation Dynamics of I2− in Solution,” Ultrafast Reaction Dynamics and Solvent Effects, (American Institute of Physics, New York), pp. 16-35 (Feb. 1994).
Kliner et al., “Polarization-Maintaining Amplifier Employing Double-Clad, Bow-Tie Fiber,” Optics Lett., 26:184-186 (Feb. 15, 2001).
Kliner et al., “Power Scaling of Diffraction-Limited Fiber Sources,” Proc. of SPIE, 5647:550-556 (Feb. 21, 2005).
Kliner et al., “Power Scaling of Rare-Earth-Doped Fiber Sources,” Proc. of SPIE, 5653:257-261 (Jan. 12, 2005).
Kliner et al., “Product Internal-State Distribution for the Reaction H+HI→H2+I,” J. Chem. Phys., 95:1663-1670 (Aug. 1, 1991).
Kliner et al., “The D+H2 Reaction: Comparison of Experiment with Quantum-Mechanical and Quasiclassical Calculations,” Chem. Phys. Lett., 166:107-111 (Feb. 16, 1990).
Kliner et al., “The H+para−H2 reaction: Influence of dynamical resonances on H2(v′=1, j′=1 and 3) Integral Cross Sections,” J. Chem. Phys., 94:1069-1080 (Jan. 15, 1991).
Koplow et al., A New Method for Side Pumping of Double-Clad Fiber Sources, J. Quantum Electronics, 39:529-540 (Apr. 4, 2003).
Koplow et al., “Compact 1-W Yb-Doped Double-Cladding Fiber Amplifier Using V-Groove Side-Pumping,” IEEE Photonics Technol. Lett., 10:793-795 (Jun. 1998).
Koplow et al., “Development of a Narrowband, Tunable, Frequency-Quadrupled Diode Laser for UV Absorption Spectroscopy,” Appl. Optics, 37:3954-3960 (Jun. 20, 1998).
Koplow et al., “Diode-Bar Side-Pumping of Double-Clad Fibers,” Proc. of SPIE, 5709:284-300 (Apr. 22, 2005).
Koplow et al., “High Power PM Fiber Amplifier and Broadband Source,” Optical Fiber Communication Conference, OSA Technical Digest (Optical Society of America, Washington, DC), p. 12-13 (Mar. 7-10, 2000).
Koplow et al., “Polarization-Maintaining, Double-Clad Fiber Amplifier Employing Externally Applied Stress-Induced Birefringence,” Optics Lett., 25:387-389 (Mar. 15, 2000).
Koplow et al., “Single-mode operation of a coiled multimode fiber amplifier,” Optics Letters, 25:442-444 (Apr. 1, 2000).
Koplow et al., Use of Bend Loss to Obtain Single-Transverse-Mode Operation of a Multimode Fiber Amplifier, Conference on Lasers and Electro-Optics, OSA Technical Digest (Optical Society of America, Washington, DC), p. 286-287 (May 7-12, 2000).
Koplow et al., “UV Generation by Frequency Quadrupling of a Yb-Doped Fiber Amplifier,” IEEE Photonics Technol. Lett., 10:75-77 (Jan. 1998).
Koponen et al., “Photodarkening Measurements in Large-Mode-Area Fibers,” Proc. of SPIE, 6453:64531E-1-64531E-12 (Feb. 2007).
Kotlyar et al., “Asymmetric Bessel-Gauss beams,” J. Opt. Soc. Am. A, 31:1977-1983 (Sep. 2014).
Kruth et al., “On-line monitoring and process control in selective laser melting and laser cutting,” Proceedings of the 5th Lane Conference, laser Assisted Net Shape Engineering, vol. 1, 14 pages, (Sep. 1, 2007).
Kulp et al., “The application of quasi-phase-matched parametric light sources to practical infrared chemical sensing systems,” Appl. Phys. B, 75:317-327 (Jun. 6, 2002).
Kummer et al., “Method to quantify accuracy of position feedback signals of a three-dimensional two-photon laser-scanning microscope,” Biomedical Optics Express, 6(10):3678-3693 (Sep. 1, 2015).
“Laser cutting machines,” TRUMPF, available at: http://www.us.trumpf.com/en/products/machine-tools/products/2d-laser-cutting/innovative-technology/brightline.html, 9 pages, retrieved May 26, 2017.
“Lasers & Fibers,” NKT Photonics, available at: https://www.nktphotonics.com/lasers-fibers/technology/photonic-crystal-fibers/, 4 pages, retrieved Feb. 13, 2018.
Laskin et al., “Applying of refractive spatial beam shapers with scanning optics,” ICALEO, Paper M604, pp. 941-947 (2011).
Lee et al., “FEM Simulations to Study the Effects of Laser Power and Scan Speed on Molten Pool Size in Additive Manufacturing,” International Journal of Mechanical and Mechatronics Engineering, 11:1291-1295 (2017).
Li et al., “High-quality near-field beam achieved in a high-power laser based on SLM adaptive beam-shaping system,” Optics Express, 23:681-689 (Jan. 12, 2015).
Li et al., “Melt-pool motion, temperature variation and dendritic morphology of Inconel 718 during pulsed-and continuous-wave laser additive manufacturing: A comparative study,” Materials and Design, 119:351-360 (Jan. 23, 2017).
Litvin et al., “Beam shaping laser with controllable gain,” Appl. Phys. B, 123:174-1-174-5 (May 24, 2017).
Liu et al., “Femtosecond laser additive manufacturing of YSZ,” Appl. Phys. A, 123:293-1-293-8 (Apr. 1, 2017).
Longhi et al., “Self-focusing and nonlinear periodic beams in parabolic index optical fibres,” J. Opt. B: Quantum Semiclass. Opt., 6:S303-S308 (May 2004).
Maechling et al., “Sum Frequency Spectra in the C—H Stretch Region of Adsorbates on Iron,” Appl. Spectrosc., 47:167-172 (Feb. 1, 1993).
Malinauskas et al., “Ultrafast laser processing of materials: from science to industry,” Official Journal of the CIOMP, Light: Science & Applications, 5:1-14 (2016).
Masoomi et al., “Quality part production via multi-laser additive manufacturing,” Manufacturing Letters, 13:15-20 (May 27, 2017).
Matthews et al., “Diode-based additive manufacturing of metals using an optically-addressable light valve,” Optics Express, 25:11788-11800 (May 15, 2017).
McComb et al., “Pulsed Yb:fiber system capable of >250 kW peak power with tunable pulses in the 50 ps to 1.5 ns range,” Proc. of SPIE, 8601:86012T-1-86012T-11 (Mar. 22, 2013).
Meier et al., “Thermophysical Phenomena in Metal Additive Manufacturing by Selective Laser Melting: Fundamentals, Modeling, Simulation and Experimentation,” available at: http://arxiv.org/pdf/1709.09510v1, pp. 1-59 (Sep. 4, 2017).
Moore et al., “Diode-bar side pumping of double-clad fibers,” Proc. of SPIE, 6453:64530K-1-64530K-9 (Feb. 20, 2007).
Morales-Delgado et al., “Three-dimensional microfabrication through a multimode optical fiber,” available at: http://arxiv.org, 20 pages (2016).
Morales-Delgado et al., “Three-dimensional microfabrication through a multimode optical fiber,” Optics Express, 25:7031-7045 (Mar. 20, 2017).
Mumtaz et al., “Selective Laser Melting of thin wall parts using pulse shaping,” Journal of Materials Processing Technology, 210:279-287 (2010).
Naidoo et al., “Improving the laser brightness of a commercial laser system,” Proc. of SPIE, 10036:100360V-1-100360V-8 (Feb. 3, 2017).
Neuhauser et al., “State-to-State Rates for the D+H2(v=1, j=1)→HD(v′, j′)+H Reaction: Predictions and Measurements,” Science, 257:519-522 (Jul. 24, 1992).
Ngcobo et al., “A digital laser for on-demand laser modes,” Nature Communications, 4:1-6 (Aug. 2, 2013).
Ngcobo et al., “The digital laser,” available at: http://arxiv.org, pp. 1-9 (2013).
Notice of Preliminary Rejection from the Korean Intellectual Property Office for related Application No. 10-2015-7025813, dated Jun. 26, 2018, 18 pages.
Notice of Reasons for Rejection for JP Application No. 2018-527718, 15 pages, dated Dec. 13, 2018 (with English translation).
Notice of Reasons for Rejection for JP Application No. 2018-527718, 16 pages, dated Jun. 14, 2019 (with English translation).
Office Action (no English translation) for related Chinese Application No. 201480022179.9, 5 pages, dated Mar. 30, 2017.
Office Action (w/ English translation) for related Chinese Application No. 201380075745.8, 21 pages, dated Jun. 2, 2017.
Office Action (with English translation) for related Korea Application No. 10-2014-0120247, dated Apr. 14, 2017, 11 pages.
Office Action (w/ English translation) for related Korea Application No. 10-2014-0120247, dated Oct. 18, 2017, 6 pages.
Office action from U.S. Appl. No. 15/074,838, dated May 19, 2017, 12 pages.
Office action from U.S. Appl. No. 15/607,399, dated Sep. 20, 2017, 25 pages.
Office action from U.S. Appl. No. 15/607,411, dated Sep. 26, 2017, 15 pages.
Office action from U.S. Appl. No. 15/607,410, dated Oct. 3, 2017, 32 pages.
Office action from U.S. Appl. No. 15/607,411, dated Jun. 12, 2018, 19 pages.
Office action from U.S. Appl. No. 15/607,399, dated Sep. 14, 2018, 19 pages.
Office action from U.S. Appl. No. 15/938,959, dated Jul. 18, 2018, 6 pages.
Office action from U.S. Appl. No. 15/939,064, dated Jul. 27, 2018, 7 pages.
Office action from U.S. Appl. No. 15/939,064, dated Oct. 5, 2018, 22 pages.
Office action from U.S. Appl. No. 15/938,959, dated Oct. 5, 2018, 22 pages.
Official Letter and Search Report from the Taiwan Intellectual Property Office for related Application No. 102139285, 21 pages, dated Jun. 13, 2016 (w/ Eng. trans.).
Official Letter and Search Report from the Taiwan Intellectual Property Office for related Application No. 103106020, 21 pages, dated Apr. 20, 2016 (w/ Eng. trans.).
Official Letter and Search Report from the Taiwan Intellectual Property Office for related Application No. 102139285, 8 pages, dated Nov. 21, 2016 (w/ Eng. trans.).
Official Action (w/ English translation) for related Taiwan application No. 103130968 dated Jun. 7, 2017, 5 pages.
Official Letter and Search Report from Taiwan Application No. 103130968, dated Dec. 20, 2016, 16 pages (with English translation).
Official Letter and Search Report from Taiwan Application No. 103106020, dated Jun. 6, 2017, 7 pages (w/ English translation).
Okunkova et al., “Development of laser beam modulation assets for the process productivity improvement of selective laser melting,” Procedia IUTAM, 23:177-186 (2017).
Okunkova et al., “Experimental approbation of selective laser melting of powders by the use of non-Gaussian power density distributions,” Physics Procedia, 56:48-57 (2014). (2017).
Okunkova et al., “Study of laser beam modulation influence on structure of materials produced by additive manufacturing,” Adv. Mater. Lett., 7:111-115 (2016).
Olsen, “Laser metal cutting with tailored beam patterns,” available at: https://www.industrial-lasers.com/articles/print/volume-26/issue-5/features/laser-metal-cutting-with-tailored-beam-pattems.html, 8 pages (Sep. 1, 2011).
PCI-6110, Multifunction I/O Device, http.//www.ni.com/en-us-support/model.pci-6110.html, downloaded Dec. 15, 2017, 1 page.
Pinkerton, “Lasers in Additive Manufacturing,” Optics & Laser Technology, 78:25-32 (2016).
Prashanth et al., “Is the energy density a reliable parameter for materials synthesis by selective laser melting?” Mater. Res. Lett., 5:386-390 (2017).
Price et al., “High-brightness fiber-coupled pump laser development,” Proc. of SPIE, 7583:758308-1-758308-7 (Feb. 2010).
Product Brochure entitled “3-Axis and High Power Scanning” by Cambridge Technology, 4 pages, downloaded Dec. 21, 2013.
Product Brochure supplement entitled “Theory of Operation” by Cambridge Technology, 2 pages, downloaded Dec. 21, 2013.
Purtonen, et al., “Monitoring and Adaptive Control of Laser Processes,” Physics Procedia, Elsevier, Amsterdam, NL, 56(9):1218-1231 (Sep. 9, 2014).
Putsch et al., “Active optical system for advanced 3D surface structuring by laser remelting,” Proc. of SPIE, 9356:93560U-1-93560U-10 (Mar. 9, 2015).
Putsch et al., “Active optical system for laser structuring of 3D surfaces by remelting,” Proc. of SPIE, 8843:88430D-1-88430D-8 (Sep. 28, 2013).
Putsch et al., “Integrated optical design for highly dynamic laser beam shaping with membrane deformable mirrors,” Proc. of SPIE, 10090:1009010-1-1009010-8 (Feb. 20, 2017).
Raghavan et al., “Localized melt-scan strategy for site specific control of grain size and primary dendrite arm spacing in electron beam additive manufacturing,” Acta Materialia, 140:375-387 (Aug. 30, 2017).
Rashid et al., “Effect of scan strategy on density and metallurgical properties of 17-4PH parts printed by Selective Laser Melting (SLM),” Journal of Materials Processing Tech., 249:502-511 (Jun. 19, 2017).
Rinnen et al., “Construction of a Shuttered Time-of-Flight Mass Spectrometer for Selective Ion Detection,” Rev. Sci. Instrum., 60:717-719 (Apr. 1989).
Rinnen et al., “Effect of Indistinguishable Nuclei on Product Rotational Distributions: D+DI→D2+I,” Chem. Phys. Lett., 169:365-371 (Jun. 15, 1990).
Rinnen et al. “Quantitative Determination of HD Internal State Distributions via (2+1) REMPI,” Isr. J. Chem., 29:369-382 (Mar. 7, 1989).
Rinnen et al., “Quantitative determination of H2, HD, and D2 internal state distributions via (2+1) resonance-enhanced multiphoton ionization,” J. Chem. Phys., 95:214-225 (Jul. 1, 1991).
Rinnen et al., “The H+D2 Reaction: “Prompt” HD Distributions at High Collision Energies,” Chem. Phys. Lett., 153:371-375 (Dec. 23, 1988).
Rinnen et al., “The H+D2 Reaction: Quantum State Distributions at Collision Energies of 1.3 and 0.55 eV,” J. Chem. Phys., 91:7514-7529 (Dec. 15, 1989).
Roehling et al., “Modulating laser intensity profile ellipticity for microstructural control during metal additive manufacturing,” Acta Materialia, 128:197-206 (2017).
Romero et al., “Lossless laser beam shaping,” J. Opt. Soc. Am. A, 13:751-760 (Apr. 1996).
Rosales-Guzman et al., “Multiplexing 200 modes on a single digital hologram,” available at: http://arxiv.org/pdf/1706.06129v1, pp. 1-14 (Jun. 19, 2017).
Russell, “Photonic-Crystal Fibers,” IEEE JLT, 24:4729-4749 (Dec. 2006).
Saint-Pierre et al., “Fast uniform micro structuring of DLC surfaces using multiple ultrashort laser spots through spatial beam shaping,” Physics Procedia, 83:1178-1183 (2016).
Saleh et al., “Chapter 9.4 Holey and Photonic-Crystal Fibers,” Fundamentals of Photonics, Second Edition, pp. 359-362 (2007).
Sames et al., “The metallurgy and processing science of metal additive manufacturing,” International Materials Reviews, pp. 1-46 (2016).
Sanchez-Rubio et al., “Wavelength Beam Combining for Power and Brightness Scaling of Laser Systems,” Lincoln Laboratory Journal, 20:52-66 (2014).
Saracco et al., Compact, 17 W average power, 100 kW peak power, nanosecond fiber laser system, Proc. of SPIE, 8601:86012U-1-86012U-13 (Mar. 22, 2013).
Sateesh et al., “Effect of Process Parameters on Surface Roughness of Laser Processsed Inconel Superalloy,” International Journal of Scientific & Engineering Research, 5:232-236 (Aug. 2014).
Schrader et al., “Fiber-Based Laser with Tunable Repetition Rate, Fixed Pulse Duration, and Multiple Wavelength Output,” Proc. of the SPIE, 6453:64530D-1-64530D-9 (Feb. 20, 2007).
Schrader et al., “High-Power Fiber Amplifier with Widely Tunable Repetition Rate, Fixed Pulse Duration, and Multiple Output Wavelengths,” Optics Express, 14:11528-11538 (Nov. 27, 2006).
Schrader et al., “Power scaling of fiber-based amplifiers seeded with microchip lasers,” Proc. of the SPIE, 6871:68710T-1-68710T-11 (Feb. 2008).
Schulze et al., “Mode Coupling in Few-Mode Fibers Induced by Mechanical Stress,” Journal of Lightwave Technology, 33:4488-4496 (Nov. 1, 2015).
Search Report from the Taiwan Intellectual Property Office for related Application No. 102139285, dated Sep. 1, 2015 (w/ Eng. trans.).
Search Report from the Taiwan Intellectual Property Office for related Application No. 102139285, 9 pages, dated Sep. 4, 2017 (with English translation).
Second Office Action from Chinese Application No. 201410455972.X, dated Nov. 22, 2016, 22 pages (with English translation).
Second Office Action from Chinese Application No. 201480019324.8, dated Nov. 16, 2017, 21 pages (with English translation).
Second Office Action from Chinese Application No. 201380075745.8, dated Feb. 26, 2018, 6 pages (with English translation).
Second Office Action from Chinese Application No. 201680068424.9, dated Jul. 1, 2019, 6 pages (with English translation).
SeGall et al., “Simultaneous laser mode conversion and beam combining using multiplexed volume phase elements,” Advanced Solid-State Lasers Congress Technical Digest, Optical Society of America, paper AW2A.9, 3 pages (Oct. 27-Nov. 1, 2013).
Sheehan et al., “Faserlaser zur Bearbeitung hochreflektierender Materialien (Fiber laser processing of highly reflective materials),” Laser, 3:92-94 (Jun. 2017).
Sheehan et al. “High-brightness fiber laser advances remote laser processing,” Industrial Laser Solutions, 31:1-9 (Nov. 2, 2016).
Shusteff et al., “One-step volumetric additive manufacturing of complex polymer structures,” Sci. Adv., 3:1-7 (Dec. 8, 2017).
Smith et al., “Tailoring the thermal conductivity of the powder bed in Electron Beam Melting (EBM) Additive Manufacturing,” Scientific Reports, 7:1-8 (Sep. 5, 2017).
Spears et al., “In-process sensing in selective laser melting (SLM) additive manufacturing,” Integrating Materials and Manufacturing Innovation, 5:2-25 (2016).
Sun et al., “Optical Surface Transformation: Changing the optical surface by homogeneous optic-null medium at will,” Scientific Reports, 5:16032-1-16032-20 (Oct. 30, 2015).
Sundqvist et al., “Analytical heat conduction modelling for shaped laser beams,” Journal of Materials Processing Tech., 247:48-54 (Apr. 18, 2017).
Supplementary European Search Report for Application No. EP 17741945.4, 5 pages, dated Nov. 16, 2018.
Thiel et al., “Reliable Beam Positioning for Metal-based Additive Manufacturing by Means of Focal Shift Reduction,” Lasers in Manufacturing Conference 2015, 8 pages (2015).
Third Office Action from Chinese Application No. 201480019324.8, dated Apr. 13, 2018, 8 pages (with English translation).
Tofail et al., “Additive manufacturing: scientific and technological challenges, market uptake and opportunities,” Materials Today, pp. 1-16 (2017).
Tominaga et al., “Femtosecond Experiments and Absolute Rate Calculations on Intervalence Electron Transfer in Mixed-Valence Compounds,” J. Chem. Phys., 98:1228-1243 (Jan. 15, 1993).
Tominaga et al., “Ultrafast Studies of Intervalence Charge Transfer,” Ultrafast Phenomena VIII, (Springer-Verlag, New York), pp. 582-584 (1993).
Trapp et al., “In situ absorptivity measurements of metallic powders during laser powder-bed fusion additive manufacturing,” Applied Materials Today, 9:341-349 (2017).
“Triple Clad Ytterbium-Doped Polarization Maintaining Fibers,” nuFERN Driven to Light Specifications, 1 page (Jan. 2006).
Ulmanen, “The Effect of High Power Adjustable Ring Mode Fiber Laser for Material Cutting,” M.S. Thesis, Tampere University of Technology, 114 pages (May 2017).
Van Newkirk et al., “Bending sensor combining multicore fiber with a mode-selective photonic lantern,” Optics Letters, 40:5188-5191 (Nov. 15, 2015).
Valdez et al., “Induced porosity in Super Alloy 718 through the laser additive manufacturing process: Microstructure and mechanical properties,” Journal of Alloys and Compounds, 725:757-764 (Jul. 22, 2017).
Varshney et al., “Design of a flat field fiber with very small dispersion slope,” Optical Fiber Technology, 9(3):189-198 (Oct. 2003).
Wang et al., “Mechanisms and characteristics of spatter generation in SLM processing and its effect on the properties,” Materials & Design, 117(5):121-130 (Mar. 5, 2017).
Wang et al., “Selective laser melting of W—Ni—Cu composite powder: Densification, microstructure evolution and nano-crystalline formation,” International Journal of Refractory Metals & Hard Materials, 70:9-18 (Sep. 9, 2017).
Website describing 3-Axis Laser Scanning Systems at http://www.camtech.com/index.php?option=com_content&view=article&id=131&Itemid=181, 4 pages, accessed Dec. 31, 2014.
Wetter et al., “High power cladding light strippers,” Proc. of SPIE, 6873:687327-1-687327-8 (Jan. 21, 2008).
Wilson-Heid et al., “Quantitative relationship between anisotropic strain to failure and grain morphology in additively manufactured Ti-6Al-4V,” Materials Science & Engineering A, 706:287-294 (Sep. 6, 2017).
Wischeropp et al., “Simulation of the effect of different laser beam intensity profiles on heat distribution in selective laser melting,” Laser in Manufacturing Conference 2015, 10 pages (2015).
Xiao et al., “Effects of laser modes on Nb segregation and Laves phase formation during laser additive manufacturing of nickel-based superalloy,” Materials Letters, 188:260-262 (Nov. 1, 2016).
Xiao et al., “Fiber coupler for mode selection and high-efficiency pump coupling,” Optics Letters, 38:1170-1172 (Apr. 1, 2013).
Xie et al., “Correction of the image distortion for laser galvanometric scanning system,” Optics & Laser Technology, 37:305-311 (Jun. 2005).
Xu et al, “The Influence of Exposure Time on Energy Consumption and Mechanical Properties of SLM-fabricated Parts,” 2017 Annual International Solid Freeform Fabrication Symposium, 7 pages (2017)—Abstract only.
Yan et al., “Formation mechanism and process optimization of nano Al2O3—ZrO2 eutectic ceramic via laser engineered net shaping (LENS),” Ceramics International, 43:1-6 (2017).
Yaney et al., “Distributed-Feedback Dye Laser for Picosecond UV and Visible Spectroscopy,” Rev. Sci. Instrum, 71:1296-1305 (Mar. 2000).
Ye et al., “Mold-free fs laser shock micro forming and its plastic deformation mechanism,” Optics and Lasers in Engineering, 67:74-82 (2015).
Yu, “Laser Diode Beam Spatial Combining,” Ph.D. Thesis, Politecnico di Torino, 106 pages (Jun. 6, 2017).
Yu et al., “1.2-kW single-mode fiber laser based on 100-W high-brightness pump diodes,” Proc. of SPIE, 8237:82370G-1-82370G-7 (Feb. 16, 2012).
Yu et al., “Development of a 300 W 105/0.15 fiber pigtailed diode module for additive manufacturing applications,” Proc. of SPIE, 10086:100860A-1-100860A-5 (Feb. 22, 2017).
Yu et al., “Laser material processing based on non-conventional beam focusing strategies,” 9th International Conference on Photonic Technologies LANE 2016, pp. 1-10 (2016).
Yusuf et al., “Influence of energy density on metallurgy and properties in metal additive manufacturing,” Materials Science and Technology, 33:1269-1289 (Feb. 15, 2017).
Zavala-Arredondo et al., “Diode area melting single-layer parametric analysis of 316L stainless steel powder,” Int. J. Adv. Manuf. Technol., 94:2563-2576 (Sep. 14, 2017).
Zavala-Arredondo et al., “Laser diode area melting for high speed additive manufacturing of metallic components,” Materials and Design, 117:305-315 (Jan. 3, 2017).
Zhirnov et al., “Laser beam profiling: experimental study of its influence on single-track formation by selective laser melting,” Mechanics & Industry, 16:709-1-709-6 (2015).
Zhu et al., “Effect of processing parameters on microstructure of laser solid forming Inconel 718 superalloy,” Optics and Laser Technology, 98:409-415 (Sep. 5, 2017).
Zou et al., “Adaptive laser shock micro-forming for MEMS device applications,” Optics Express, 25:3875-3883 (Feb. 20, 2017).
Uden et al., “Ultra-high-density spatial division multiplexing with a few-mode multicore fibre,” Nature Photonics, 8(11):865-870 (Nov. 2014).
Villatoro et al., “Photonic Crystal Fiber Interferometric Vector Bending Sensor,” Optics Letters, 40(13):3113-3116 (Jul. 1, 2015).
Yoda et al., “Beam Quality Factor of Higher Order Modes in a Step-Index Fiber,” Journal of Lightwave Technology, 24(3):1350-1355 (Mar. 2006).
“Business Unit Laser Ablation and Cutting: Laser Beam Fusion Cutting with Dynamic Beam Shaping,” Fraunhofer IWS Annual Report 2015, pp. 86-87 (2015).
Dorrington et al., “A simple microcontroller based digital lock-in amplifier for the detection of low level optical signals,” Proceedings of the First IEEE International Workshop on Electronic Design, Test and Applications (DELTA '02), 3 pages (2002).
Goppold et al., “Dynamic Beam Shaping Improves Laser Cutting of Thick Steel Plates,” Industrial Photonics, 4:18-19 (Jul. 2017).
Herwig et al., “Possibilities of power modulation and dynamic beam shaping,” Fraunhofer IWS presentation, 6 pages, retrieved on Mar. 16, 2018.
Chen et al., “An On-Machine Error Calibration Method for a Laser Micromachining Tool,” Precision Engineering, 47:239-248 (Jan. 31, 2017).
Chiumenti et al., “Numerical Simulation and Experimental Calibration of Additive Manufacturing by Blown Powder Technology,” Rapid Prototyping Journal, 23(2), 27 pages (Mar. 20, 2017).
Willis et al., “Printed Optics: 3D Printing of Embedded Optical Elements for Interactive Devices,” UIST 12: Proceedings of the 25th annual ACM symposium on user interface software and technology, 10 pages (Oct. 31, 2012).
Related Publications (1)
Number Date Country
20200001400 A1 Jan 2020 US
Provisional Applications (2)
Number Date Country
62292108 Feb 2016 US
62258774 Nov 2015 US
Continuations (1)
Number Date Country
Parent 15357484 Nov 2016 US
Child 16569403 US