Claims
- 1. A method of limiting mechanical abrasion, comprising:polishing a surface with a pad having a first member defining a first polishing surface and comprising a first material; and limiting abrasion of the surface with a surface abrasion impeding second member, the second member defining a second polishing surface and comprising a second material; wherein the first and second members are comprised of a common matrix material wherein a portion of the first polishing surface extends beyond the second polishing surface.
- 2. The method of claim 1, wherein the matrix material is substantially nonabrasive.
- 3. The method of claim 1, wherein the first member is more abrasive than the second member.
- 4. The method of claim 3, wherein the second material is substantially nonabrasive.
- 5. The method of claim 3, wherein the first member is more abrasive than the second member due to selective chemical treatment of the matrix material.
- 6. The method of claim 1, further comprising removing an amount of the second material such that at least a portion of the first polishing surface extends beyond the second polishing surface.
- 7. The method of claim 6, wherein the second member is removed either mechanically or chemically.
- 8. The method of claim 1, further comprising providing a liquid on the surface during the polishing.
- 9. A method of limiting mechanical abrasion, comprising:polishing a surface with a pad having a first member defining a first polishing surface and comprising a first material; and limiting abrasion of the surface with a surface abrasion impeding second member, the second member defining a second polishing surface and comprising a second material; wherein the first and second members are comprised of a common matrix material, and wherein the matrix material is substantially nonabrasive wherein a portion of the first polishing surface extends beyond the second polishing surface.
- 10. The method of claim 9, wherein the first member is more abrasive than the second member.
- 11. The method of claim 10, wherein the first member is substantially nonabrasive.
- 12. The method of claim 10, wherein the first member is more abrasive than the second member due to selective chemical treatment of the matrix material.
- 13. The method of claim 9, further comprising removing an amount of the second material such that at least a portion of the first polishing surface extends beyond the second polishing surface.
- 14. A method of limiting mechanical abrasion, comprising:polishing a surface with a pad having a first member defining a first polishing surface and comprising a first material; and limiting abrasion of the surface with a surface abrasion impeding second member, the second member defining a second polishing surface and comprising a second material; wherein the first and second members are comprised of a common matrix material, and wherein the second member is substantially nonabrasive wherein a portion of the first polishing surface extends beyond the second polishing surface.
- 15. The method of claim 14, wherein the first member is more abrasive than the second member due to selective chemical treatment of the matrix material.
- 16. The method of claim 14, wherein the matrix material is substantially nonabrasive.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a division of application Ser. No. 09/593,045, filed Jun. 12, 2000, U.S. Pat. No. 6,254,460 which is a division of application Ser. No. 09/187,307, filed Nov. 4, 1998, U.S. Pat. No. 6,409,586 which is a continuation of application Ser. No. 08/917,018, filed Aug. 22, 1997, now U.S. Pat. No. 5,919,082.
US Referenced Citations (22)
Continuations (1)
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Number |
Date |
Country |
Parent |
08/917018 |
Aug 1997 |
US |
Child |
09/187307 |
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US |