International Tin Research Institute; Data Sheet DS 11; Zinc Stannates. |
International Tin Research Institute; Data Sheet DS 12; Smoke Suppression Using Zinc Stannates. |
Technical Information; Thermoguard.TM. FR; Flame Retardant; ATOChem North America, Inc. |
Exolit.RTM. Flame Retardant; Hoechst Celanese; Specialty Chemicals Group Polymer Additives. |
AMGARD.RTM. CPC; Albright & Wilson Americans a Tenneco Company. |
AMGARD; AMGARD MC; Albright & Wilson; Flame Retardants. |
Organo-phosphines from Cyanamid. |
Flame Retardant Chemicals; Great Lakes Chemical Corporation. |
Occidental Chemical Corporation; Detergent & Specialty Products Division Dechlorane Plus.TM.. |
OxyChem; Electrochemicals & Specialty Products; Dechlorane Plus.RTM. C.sub.18 H.sub.12 Cl.sub.12. |
Dech Plus Digest; Occidental Chemical Corporation; Summer 1991; vol. 4, No. 1. |
Ethyl Chemicals Group; Bromine Chemicals Division; Saytex 120; Flame Retardants. |
Firebrake.RTM. ZB Zinc Borate; The Unique Multifunctional Additive by Kevin K. Shen. |
Flame Retardant Chemicals; Great Lakes DE-71.TM.; Great Lake Chemical Corporation; Sep. 2, 1980. |
Great Lakes Chemical Flame Retardants; Effective flame retardant performance for a variety of polymer systems. |
GE Silicones; SFR 100 Silicone Fluid Compounding Guide. |
GE Silicones; SFR 100 Silicone Fluid. |
Flame-Retardant Polyolefins Don't Need Halogen; by Prakash Pawar; GE Silicones. |
Antimony Oxide from Asarco; Uniform High Quality; Low Impurity Levels. |
Dr. John K. Bard; Silicon-Carbon Resins to Boost PWB Use. |
Dr. John K. Bard & Dr. Richard L. Brady; A New Moisture Resistant Liquid Encapsulant; 42nd ECTC Conference Proc., Mau 1992. |
J. K. Bard, R. L. Brady, and J. M. Schwark; Processing and Properties of Silicon-Carbon Liquid Encapsulants. |
Dr. John K. Bard & Dr. Julia S. Burnier; New Low Dielectric Constant, (I) Moisture Resistant Resin Technology For High Speed/High Frequency Circuit Board Applications. |
(II) Dr. John K. Bard & Dr. Julia S. Burnier; New Low Dielectric Constant, Moisture Resistant Resin Technology For High Speed/High Frequency Circuit Board Applications. |
Polyclad Laminates, Inc.; PCL-511 Laminates and Prepregs For High Speed Digital Applications. |
Organosilicon Composition Containing Hydrocarbon Elastomer; Research Disclosure-Oct. 1991/799-800. |
Liquid Encapsulants, Flip Chip Encapsulants and Die Attach Adhesives; Research Disclosure-Mar. 1992/184-187. |
Platinum(II) Complexes As Catalysts For Silicon-Carbon Resin Systems; Research Disclosure-May 1992/355-357. |
Transfer Molding Compounds For Encapsulation; Research Disclosure-Sep. 1992/707-709. |
Underwriter Laboratory's "Standard for Test for Flammability of Plastic Materials for Parts in Devices and Appliances, UL94", Jun. 16, 1988 for UL94-80, Third Edition. |
"Phosphorus Based Catalyst Retards for Silicon Carbon Resin Systems", Research Disclosure 326103 (Jun. 1991). |
"Organosilicon Compositions Containing Hydrocarbon Elastomers", Research Disclosure 33082 (Oct. 1991). |
"Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electric Insulating Materials", ASTM Designation: D 150-87. |