Number | Date | Country | Kind |
---|---|---|---|
63-113222 | May 1988 | JPX | |
63-155523 | Jun 1988 | JPX | |
63-253539 | Oct 1988 | JPX | |
63-253540 | Oct 1988 | JPX | |
1-58720 | Mar 1989 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
2357706 | Toepperwein | Jun 1942 | |
2783418 | Peter et al. | Feb 1957 | |
2999034 | Heidenhain | Sep 1961 | |
3205469 | Frank et al. | Sep 1965 | |
3211969 | Colaiaco | Oct 1965 | |
3299946 | Reckinghausen | Jan 1967 | |
3651865 | Feldmanis | Mar 1972 | |
3777220 | Tatusko et al. | Dec 1973 | |
3827457 | Vutz et al. | Aug 1974 | |
3881181 | Khajezadeh | Apr 1975 | |
3908188 | Kawamoto | Sep 1975 | |
3912001 | Missman et al. | Oct 1975 | |
3993123 | Chu et al. | Nov 1976 | |
4037270 | Ahmann et al. | Jul 1977 | |
4093971 | Chu et al. | Jun 1978 | |
4109707 | Wilson et al. | Aug 1978 | |
4110549 | Goetzke et al. | Aug 1978 | |
4115836 | Hutchison et al. | Sep 1978 | |
4158875 | Tajima et al. | Jun 1979 | |
4196775 | Groh | Apr 1980 | |
4204246 | Arii et al. | May 1980 | |
4226281 | Chu | Oct 1980 | |
4245273 | Feinberg et al. | Jan 1981 | |
4282924 | Faretra | Aug 1981 | |
4381032 | Cutchaw | Apr 1983 | |
4398208 | Murano et al. | Aug 1983 | |
4439918 | Carroll et al. | Apr 1984 | |
4467522 | Marchisi | Aug 1984 | |
4468717 | Mathias et al. | Aug 1984 | |
4493010 | Morrison et al. | Jan 1985 | |
4498122 | Rainal | Feb 1985 | |
4509096 | Baldwin et al. | Apr 1985 | |
4535385 | August et al. | Aug 1985 | |
4536824 | Barrett et al. | Aug 1985 | |
4546410 | Kaufman | Oct 1985 | |
4574879 | DeGree et al. | Mar 1986 | |
4588023 | Munekawa | May 1986 | |
4602125 | West et al. | Jul 1986 | |
4602678 | Fick | Jul 1986 | |
4628990 | Hagihara et al. | Dec 1986 | |
4641176 | Keryhuel et al. | Feb 1987 | |
4644385 | Nakanishi et al. | Feb 1987 | |
4666545 | DeGree et al. | May 1987 | |
4680673 | Tauerdet | Jul 1987 | |
4685211 | Hagihara et al. | Aug 1987 | |
4686606 | Yamada et al. | Aug 1987 | |
4689659 | Watanabe | Aug 1987 | |
4712158 | Kikuchi et al. | Dec 1987 | |
4721996 | Tustaniwskyj et al. | Jan 1988 | |
4724611 | Hagihara | Feb 1988 | |
4727554 | Watanabe | Feb 1988 | |
4729424 | Mizuno et al. | Mar 1988 | |
4744007 | Watari et al. | May 1988 | |
4748495 | Kucharek | May 1988 | |
4750086 | Mittal | Jun 1988 | |
4768352 | Maruyama | Sep 1988 | |
4781244 | Kuramitsu et al. | Nov 1988 | |
4783721 | Yamamoto et al. | Nov 1988 | |
4791983 | Nicol et al. | Dec 1988 | |
4794981 | Mizuno | Jan 1989 | |
4809134 | Tustaniwskyj et al. | Feb 1989 | |
4884167 | Mine et al. | Nov 1989 | |
4942497 | Mine et al. | Jul 1990 | |
4945980 | Umezawa | Aug 1990 | |
4975766 | Umezawa | Dec 1990 |
Number | Date | Country |
---|---|---|
2583921 | Dec 1986 | FRX |
55-86130 | Jun 1980 | JPX |
56-70655 | Jun 1981 | JPX |
57-106062 | Jul 1982 | JPX |
0130450 | Jul 1984 | JPX |
59-130450 | Jul 1984 | JPX |
60-160150 | Aug 1985 | JPX |
0257156 | Dec 1985 | JPX |
60-257156 | Dec 1985 | JPX |
61-171157 | Aug 1986 | JPX |
61-226946 | Oct 1986 | JPX |
0226946 | Oct 1986 | JPX |
0276242 | Dec 1986 | JPX |
61-276242 | Dec 1986 | JPX |
63-81959 | Apr 1988 | JPX |
63-226049 | Sep 1988 | JPX |
0226049 | Sep 1988 | JPX |
63-308943 | Dec 1988 | JPX |
572951 | Sep 1977 | SUX |
Entry |
---|
Microelectronics, Scientific American, published 1977 by W. H. Freeman and Company, San Francisco, Cover page, pp. 51, 166. |
Assembly Techniques, pp. 404-420, understood to be from the book Integrated Circuit Engineering, publishing date not known. |
IEEE Transactions On Components, Hybrids and Manufacturing Technol., vol. CHMT-2, No. 3, Sep. 1979, "Bumped Tape Automated Bonding (BTAB) Practical Application Guidelines", Kanz et al., pp. 301-308. |
IEEE Transactions on Components, Hybrids, and Manufacturing Tech., vol. CHMT-3, No. 1, Mar. 1980, "IBM Multichip Multilayer Ceramic Modules for LSI Chips--Design for Performance and Density", Clark et al., pp. 89-93. |
IBM J. Res. Develop., vol. 26, No. 1, pp. 55-66 (Jan. 1982), "A Conduction-Cooled Module for High-Performance LSI Devices", Oktay et al. |
Electronics, "Supercomputers Demand Innovation In Packaging and Cooling", Lyman, pp. 136-144, Sep. 22, 1982. |
IBM Technical Disclosure Bulletin, "Counter-Flow Cooling System", Chu, vol. 8, No. 11, Apr. 1966, p. 1692. |
IBM Technical Disclosure Bulletin, vol. 18, No. 12, pp. 3982-3983, "Heat-Pipe Cooled Stacked Electronic Wafer Package", Kerjilian et al., May 1976. |
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, "Method of Effective Cooling of a High Power Silicon Chip", Doo et al., pp. 1436-1437. |
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, "Three-Dimensional MLC Substrate Integrated Circuit Support Package", Aichelmann et al., pp. 4349 and 4350. |
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, "Conduction-Cooling Module", Hwang et al., pp. 4334-4335. |
IBM Technical Disclosure Bulletin, vol. 21, No. 6, (Nov. 1978), "Compliant Cold Plate Cooling Scheme", Antonetti et al., p. 2433. |
IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, "Solid Encapsulated Module", Chu et al., pp. 2435-2436. |
Forward and Introduction of IEEE International Conference On Computer Design: VLSI In Computers; ICCD '83 Session: The New IBM 4381, 3 pages (Nov. 1, 1983). |
IEEE International Conference On Computer Design: VLSI In Computer ICCD '83 Session: The New IBM 4381, "New Internal and External Cooling Enhancements For the Air-Cooled IBM 4381 Module", Oktay et al., 4 pages (Nov. 1, 1983). |
IEEE International Conference On Computer Design: VLSI In Computer ICCD '83 Session: The New IBM 4381, "Electrical Design and Analysis of the Air-Cooled Module (ACM) in IBM System/4381", Cherensky et al., 6 pages (Nov. 1, 1983). |
IEEE International Conference On Computer Design: VLSI In Computer ICCD '83 Session: The New IBM 4381, "Hermetic Tin/Lead Solder Sealing For the Air-Cooled IBM 4381 Module", Brady et al., 4 pages (Nov. 1, 1983). |