of an individual bump connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16of an individual bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor element mounting package and optical semicond...
- Patent number 12,317,657
- Issue date May 27, 2025
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,823
- Issue date May 27, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 12,315,845
- Issue date May 27, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,300,772
- Issue date May 13, 2025
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with die to die bridge solution and methods of forming t...
- Patent number 12,300,619
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including outer conductive plate
- Patent number 12,300,625
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,589
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Gwangjae Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174535
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...
- Publication number 20250174567
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...
- Publication number 20250174575
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250174576
- Publication date May 29, 2025
- MEDIATEK INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS
- Publication number 20250174590
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED VOLTAGE REGULATOR
- Publication number 20250174597
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS
- Publication number 20250174598
- Publication date May 29, 2025
- SK HYNIX INC.
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174516
- Publication date May 29, 2025
- Fuji Electric Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250176104
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT
- Publication number 20250174525
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250176107
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250174583
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250174589
- Publication date May 29, 2025
- Innolux Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS STACKED IN A V...
- Publication number 20250174601
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
- Publication number 20250174604
- Publication date May 29, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...
- Publication number 20250174510
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174540
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167085
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167104
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package

Optical semiconductor element mounting package and optical semicond...

Semiconductor device

Package substrate, electronic device package and method for manufac...

Package structure and manufacturing method thereof

Antenna and device configurations

Electronic device having a substrate-to-substrate interconnection s...

Package assembly including lid with additional stress mitigating fe...

Wiring board, semiconductor device, and method of manufacturing wir...

Methods of manufacturing a fan-out panel level semiconductor package

Interconnection structure of a semiconductor chip having pads of di...

Display device and method for manufacturing the same

Semiconductor die with tapered sidewall in package

Packaging architecture for disaggregated integrated voltage regulators

Electronic component module, sub-module, and method for manufacturi...

Semiconductor package

Structures to increase substrate routing density and methods of for...

Semiconductor package

Molded product for semiconductor strip and method of manufacturing...

Electronic package

Multi-chip package having stress relief structure

Semiconductor package structure

Light-emitting device, manufacturing method thereof and display mod...

Interposer with die to die bridge solution and methods of forming t...

Electronic device

Semiconductor package including outer conductive plate

Semiconductor package

Aligning bumps in fan-out packaging process

Semiconductor package

Devices with conductive or magnetic nanowires for localized heating...

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...

ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS

Semiconductor Die Connection System and Method

EMBEDDED INTEGRATED VOLTAGE REGULATOR

STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS STACKED IN A V...

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE