of an individual bump connector

Industry

CPC
H01L2224/16

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16of an individual bump connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device each having non-photosensitiv...
- Patent number 12,341,088
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bonding wire in a hole in the substrate
- Patent number 12,341,123
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 12,341,142
- Issue date Jun 24, 2025
- INNOLUX CORPORATION
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate and electronic device including the same
- Patent number 12,341,252
- Issue date Jun 24, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
- Patent number 12,341,129
- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel including electrically connected...
- Patent number 12,342,620
- Issue date Jun 24, 2025
- BOE Technology Group Co., Ltd.
- Xue Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, its manufacturing method, and electronic circu...
- Patent number 12,336,203
- Issue date Jun 17, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,334,446
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,334,455
- Issue date Jun 17, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,425
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective use of different advanced interface bus with electronic c...
- Patent number 12,334,449
- Issue date Jun 17, 2025
- Altera Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,452
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,334,625
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate with dummy via an...
- Patent number 12,334,451
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,334,477
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,334,444
- Issue date Jun 17, 2025
- Mediatek Inc.
- Po-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,456
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,336,359
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-plane inductors in IC packages
- Patent number 12,336,197
- Issue date Jun 17, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...
- Publication number 20250208299
- Publication date Jun 26, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT PACKAGE APPARATUS AND RELATED METHODS
- Publication number 20250208204
- Publication date Jun 26, 2025
- Intel Corporation
- Joshua Dean Freier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE
- Publication number 20250210435
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Akira FUJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250210473
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...
- Publication number 20250210484
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...
- Publication number 20250210485
- Publication date Jun 26, 2025
- AUO Corporation
- Shih-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR 3D INTEGRATION
- Publication number 20250210528
- Publication date Jun 26, 2025
- Meta Platforms Technologies, LLC
- Rajendra D Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210556
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20250210562
- Publication date Jun 26, 2025
- Google LLC
- Erik Anthony Lucero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210502
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE
- Publication number 20250210268
- Publication date Jun 26, 2025
- Intel Corporation
- Srinivasan RAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20250210544
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE
- Publication number 20250210561
- Publication date Jun 26, 2025
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210566
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210589
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES
- Publication number 20250210593
- Publication date Jun 26, 2025
- Powertech Technology Inc.
- HUNG HSIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE PART SYSTEM ON CHIP MEMORY STACKING
- Publication number 20250210606
- Publication date Jun 26, 2025
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250210433
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210434
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sang Ho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210494
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JUNWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF
- Publication number 20250206941
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Weina XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
- Publication number 20250210451
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Cooling for Heterogenous Packages
- Publication number 20250210456
- Publication date Jun 26, 2025
- Intel Corporation
- Eduardo De Mesa
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump to package substrate solder joint

Wiring board and semiconductor device each having non-photosensitiv...

Semiconductor device having a bonding wire in a hole in the substrate

Through-substrate underfill formation for an integrated circuit ass...

Electronic device and manufacturing method of electronic device

Antenna substrate and electronic device including the same

Substrateless double-sided embedded multi-die interconnect bridge

Array substrate and display panel including electrically connected...

Thin film capacitor, its manufacturing method, and electronic circu...

Semiconductor package and method

Semiconductor package with integrated capacitors

Package with tilted interface between device die and encapsulating...

Electronic package and manufacturing method thereof

Selective use of different advanced interface bus with electronic c...

Electronic package and manufacturing method thereof

Antenna apparatus and method

Semiconductor package including package substrate with dummy via an...

Forming recesses in molding compound of wafer to reduce stress

Semiconductor packages

Semiconductor package structure and method for forming the same

Electronic package and manufacturing method thereof

Semiconductor structure having copper pillar within solder bump and...

Chip packaging structure and related inner lead bonding method

Micro light-emitting diode

Display device

In-plane inductors in IC packages

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Architecture for computing system package

Logic drive based on chip scale package comprising standardized com...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...

DOUBLE-SIDED INTEGRATED CIRCUIT PACKAGE APPARATUS AND RELATED METHODS

SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

LEAD FRAME AND SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...

COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

SYSTEMS AND METHODS FOR 3D INTEGRATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD

PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

BONDED STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES

SYSTEMS AND METHODS FOR THREE PART SYSTEM ON CHIP MEMORY STACKING

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...

RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...

Active Cooling for Heterogenous Packages