1. Field of the Invention
The invention relates to heat transfer apparatuses and, more particularly, to a flat heat pipe with enhanced heat dissipation efficiency.
2. Description of Related Art
Generally, flat heat pipes can efficiently dissipate heat from heat-generating components such as central processing units (CPU). A conventional flat heat pipe includes a hollow cover, a continuous wick structure mounted on an inner surface of the cover and a working medium contained in the wick structure. A vapor chamber is defined between an inner surface of the wick structure. When the cover absorbs heat generated from the heat-generating components, the working medium is vaporized by the heat and enters into the vapor chamber in all directions of the inner surface of the wick structure. Therefore, the vaporized working medium from different directions of the wick structure tends to interfere with each other and forms turbulence. Thus, heat dissipation efficiency and stability performance of the flat heat pipe are badly affected.
What is needed is a flat heat pipe which can overcome the problem of the prior art.
Referring to
The cover 10 is integrally formed by one piece of metal such as copper or brass. The cover 10 includes an elongated front plate 11, an elongated rear plate 13 spaced from and facing the front plate 11 and two convex connecting plates 15 located at lateral sides of the flat heat pipe 1 and interconnecting lateral edges of the front plate 11 and the rear plate 13. Opposite ends of the front plate 11 and the rear plate 13 are pressed toward each other and sealed to form a first end 17 and a second end 19. Inner surface of the front plate 11, the rear plate 13 and the connecting plates 15 cooperatively define a receiving chamber 16 therebetween. One end of the flat heat pipe 1 approaching the first end 17 is an evaporating portion to absorb heat generating from the heat-generating components. The other end approaching the second end 19 is a condensing portion to condense vaporized working medium.
The wick structure 50 is a screen made of wires mesh or a sintered body sintered by metal powder. The wick structure 50 has a substantially form of triangular pyramid, adhered to inner surfaces of the first end 17 and one of the connecting plate 15. The wick structure 50 slantwise extends towards the second end 19 along a longitudinal direction of the cover 10. A volume of the wick structure 30 is equal to a half of a cubage of the receiving chamber 16.
A volume of the wick structure 30 decreases from an end contacting the first end 17 of the cover 10 to the other end contacting the second end 19 of the cover 10. A transverse cross section of the end contacting the first end 17 is oval. The wick structure 30 has a lateral surface 31, two side surfaces 33, an arc-shaped connecting surface 35 and an interface 37. The lateral surface 31 is adhered to and overspreads the inner surface of the first end 17. The side surfaces 33 extend from opposite edges of the lateral surface 31 and are adhered to part of the inner surfaces of the front plate 11 and the rear plate 13, respectively. A surface area of each side surface 33 is equal to a half of that of the inner surface of the front plate 11 or the rear plate 13. A width of each side surface 33 decreases from the first end 17 to the second end 19.
The connecting surface 35 extends from a top edge of the lateral surface 31 and is adhered to whole of the inner surface of the top connecting plate 15 along the longitudinal direction of the cover 10. The interface 37 extends from another edge of the lateral surface 31 and connects ends of the side surfaces 33 near to the bottom connecting plate 15. The interface 37, the connecting surface 35, and the side surfaces 33 intersect the topmost edge of the second end 19. The interface 37 is elongated and is away from the inner surface of the second end 19 and the bottom connecting plate 15. The interface 37, an inner surface of the bottom connecting plate 15 away from the connecting surface 35, and the exposed inner surfaces of the front plate 11 and the rear plates 13 cooperatively define a vapor passage 18 therebetween. A volume of the wick structure 30 is equal to a cubage of the vapor passage 18.
When the evaporating portion of the flat heat pipe 1 absorbs heat generated from the heat-generating components, the absorbed heat makes the working medium in the wick structure 30 be vaporized and enter into the vapor passage 18 only from the interface 37 of the wick structure 30. So the vaporized working medium enters into the vapor passage 18 in a smaller angle range relative to the conventional flat heat pipe. Thus, interference between the vaporized working medium in the vapor passage 18 is decreased relative to the conventional flat heat pipe. A probability of forming turbulence of the vaporized working medium is decreased.
Following table shows heat transfer performance of the flat heat pipe 1 via adjusting a volume proportion of the vapor passage 18 to the receiving chamber 16.
It can be concluded from the above table, the flat heat pipe 1 has a smaller liquid resistance and greater capillary force when the cubage of the vapor passage 18 is equal to a half of that of the receiving chamber 16.
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It is believed that the disclosed embodiment(s) and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Number | Date | Country | Kind |
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201210060491.X | Mar 2012 | CN | national |