Patent Application
20090015168
The invention relates to a flat lighting device and a method for the production thereof.
Optoelectronic modules are known, in which a plurality of lighting elements are arranged on a substrate. In this case, there is a problem in that the lighting elements can only be operated with a relatively low current of about 10 to 50 mA because of heating. The quantity of light emitted by the lighting elements is therefore small.
An optoelectronic module emerges from DE 100 33 502 A1, in which light-emitting semiconductor components are fastened to a substrate which is a good conductor of heat. The underneath of the substrate is fastened to a metallic carrier body, which has a high heat capacity and good heat conductivity. The component fastening between the semiconductor components and the substrate, as well as the substrate fastening between the substrate and the carrier body, is implemented with good heat conductivity. The substrate may consist of silicon, which is a lighter and relatively economically available material and has excellent heat conductivity. The entire module is covered by a glass body, which has a recess exposing the substrate surface, in which recess the semiconductor components are arranged.
The object of the present invention is to disclose a lighting device, which has a relatively high efficiency and a long service life and, in addition, is constructed relatively simply, and a method for the production thereof.
This object is achieved by a lighting device with the features of claim 1 and by a method with the features of claim 31.
The substantial advantage of the present lighting device, which preferably has the form of a wall covering of light or a panel of light, consists in that it is particularly simply constructed and can be handled and installed like a large-area wall covering or like individual panels. The method for producing the lighting device according to the invention is also relatively simple and economical to carry out. This is to be attributed to the special structure of the lighting device according to the invention.
As the individual lighting elements or light-emitting diodes, are arranged in such a way that excellent heat transmission or dissipation takes place into the metallic carrier sheet being used as a carrier, the individual lighting elements can be operated, depending on their number, with an operating voltage of, for example, 20 V. The operating voltage is therefore in the range of small voltages according to the VDE standards. The outlay for insulation is therefore advantageously kept small.
The hard-rolled aluminium sheets being used as a carrier sheet are particularly simply and advantageously provided in a flat manner with an insulating layer, in particular with an outer layer of varnish, as an insulator, and printed by the gravure printing method in several layers with a conductive dye, preferably a silver conductive dye, to produce the various conductor paths and the connection contact faces, and also with a further conductive dye, preferably a graphite conductive dye, to produce the series resistors. This method is also particularly simple to carry out and economical. In this case, both the conductor paths being used for current supply and current removal and for current distribution in the face of the lighting device, and also the connection faces for the light-emitting components are printed on in the silver conductive dye by a gravure printing operation. As, the resistor faces of the series resistors, consisting of graphite conductive dye, which are preferably fed by input and output lines consisting of silver are also advantageously printed on by the gravure printing method, the necessary low tolerance of the series resistors is advantageously far below 10% because of the high uniformity of the gravure printing method. The required power loss of the series resistors is achieved by the relatively large-area configuration of the printed-on resistance faces. The light-emitting lighting elements are preferably bonded with a silver-containing conductive adhesive to the corresponding connection contact faces or soldered thereto. Said silver-containing conductive adhesive has a very low coefficient of heat conduction, so good heat dissipation takes place from the light-emitting lighting elements to the metallic carrier sheet.
In a preferred configuration of the invention as a wall covering of light, respective parallel branches with four or more series connections connected in series in each case consisting of a light-emitting lighting element and a series resistor are arranged between the current supply and current discharge lines to compensate the different forward characteristics of the lighting elements.
The individual light-emitting lighting elements, after they have been fastened to the corresponding connection contact faces, are advantageously further fixed and mechanically stabilised by a stabilisation coating.
As the surface of the metallic carrier sheet can be occupied practically without additional costs with conductor path structures by the gravure printing method, in a preferred configuration of the invention, additional conductor paths for potential equalisation are also printed parallel to the current supply and current discharge lines. Normally, no current flows through these potential equalisation conductor paths, as all light-emitting lighting elements, which are connected in series between a current supply line and a current discharge line, lie on the same potential. If a light-emitting lighting element fails, a cross current flows, which continues to supply the light-emitting lighting elements connected in series to the failed light-emitting lighting element with current. Thus the entire series of light-emitting lighting elements advantageously does not fail but only one light-emitting lighting element.
An important advantage of the method according to the invention is that because of the application of the conductor paths, the current supply lines, the current discharge lines, the connection contact faces, optionally the potential equalisation conductor paths and the series resistor faces by the gravure printing method in comparison to methods with etched conductor paths or with conductor paths produced by screen printing, operation can be substantially more economical, and, owing to the use of an aluminium sheet as the metallic carrier sheet, the necessary heat distribution is simultaneously achieved to dissipate and distribute the heat that has been generated pointwise of the light-emitting lighting elements into the face on the rear of the aluminium sheet.
In a further preferred configuration of the invention, the flexible metallic carrier sheet is reinforced by a stable composite part, so self-supporting light panels can be produced. Here, a composite part preferably configured in a honeycombed manner and also made of a metallic material is bonded onto the metallic carrier sheet, the opposite side being covered with an optically transparent plastics material or an opaque plastics material bringing about a diffuse light distribution. The light-emitting lighting elements, conductor paths and resistors are advantageously mechanically and electrically protected thereby and a stable sandwich element is produced with a heat-dissipating rear and a light-emitting front side, which can be lined up with other correspondingly configured sandwich elements next to each other to provide larger light faces.
The invention and the configuration thereof are described in more detail below in conjunction with the figures, in which:
According to
In the embodiment of the method according to the invention, an insulating layer 3 of varnish is firstly applied in a flat manner to the aluminium sheet 2, which is preferably hard-rolled and has a thickness of about 70 μm, the layer of varnish preferably consisting of polyurethane and being 10 μm thick. It is conceivable for the insulating layer 3 of varnish to be applied in two or more layers in order to prevent insulation defects owing to holes. It is also possible to achieve the insulation by means of a paper web or plastics material sheet laminated onto the aluminium sheet.
Various electrically conductive paths or faces, which preferably consist of conductive dyes and are used for the production of the current supply and current discharge lines 4′, of the conductor paths 4 for distribution of current into the face of the lighting device 10, the connection contact faces 8 for the light-emitting diodes 1 and the series resistor faces 5, are preferably printed, in several layers, on the surface of the insulating layer 3 of varnish by the gravure printing method. The current supply and current discharge lines 4′, the conductor paths 4 and the connection contact faces 8 particularly preferably consist of a silver conductive dye printed on by a gravure printing method step. The series resistor faces 5 preferably consist of a graphite conductive dye printed on in a separate gravure printing method step.
The series resistor faces 5 are produced overlapping the corresponding conductor paths 4 in the separate gravure printing method step, so good electrical connections are produced.
The connections 7 of the light-emitting diodes 1 are then fastened to the connection contact faces 8 of the conductor paths 4. For this purpose, the connections 7 are then applied in the correct position with respect to the connection contact faces 8 in an assembly process and fastened or bonded thereto with the aid of a conductive adhesive, a good electrical connection and a connection with a good heat conductivity being brought about. Alternatively, the connections 7 of the diodes 1 can also be soldered at the connection contact faces 8.
In the correct position, the heat-conductive body part 9 of the diodes 1, which preferably consists of copper, is seated on a connection contact face 8 located therebelow, so good heat dissipation from the body part 9 in the direction of the arrow 11 takes place via the conductor path 4 and the layer 3 of varnish to the aluminium sheet 2.
The connection contact faces 8 can also be formed directly by a partial region of the conductor paths 4.
To stabilise and mechanically fix the diodes 1, a stabilisation coating 6 is expediently applied to the fastening region of the diodes 1, care being taken that the diodes 1 are only embedded to such an extent into the material of the coating 6 that their light-emitting front side 12 is exposed. The stabilisation coating 6 simultaneously also covers in each case the contacts between the connections 7 of the diodes 1 and the corresponding connection contact faces 8. The application of the stabilising coating 6 is particularly advantageous because, by it, a fixed bond is produced between the diodes 1 and the aluminium sheet 2, which is rigid compared to the aluminium sheet 2 which is flexible per se. Bending radii, which are produced during the handling of the lighting device 10 by deformations, are therefore not introduced directly into the contact points, but, as shown by the arrows 13, into the aluminium sheet 2. The contact points are thus substantially relieved of pressure.
According to
The points 16, arranged next to one another in the direction of the current supply and current discharge lines 4′, of the conductor paths 4 of the branches, which are in each case located between two corresponding series connections of the branches, may preferably be connected to one another by potential equalisation lines 4″, which run parallel to the current supply and current discharge lines 4′, for the reasons mentioned at the outset.
To produce a stable lighting device 10′, which can be handled as a light panel, according to
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2005 011 857.7 | Mar 2005 | DE | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP2006/002102 | 3/8/2006 | WO | 00 | 9/17/2007 |
