associated with surface mounted components

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H05K1/181

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/181associated with surface mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,174,446
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including lines provided on elastic base
- Patent number 12,177,981
- Issue date Dec 24, 2024
- Japan Display Inc.
- Takumi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,177,982
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component, circuit board, and electronic device
- Patent number 12,176,135
- Issue date Dec 24, 2024
- Taiyo Yuden Co., Ltd.
- Hidenori Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular electronic prototyping platforms
- Patent number 12,177,969
- Issue date Dec 24, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward Hodges
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip resistor, method of producing chip resisitor and chip resistor...
- Patent number 12,177,980
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Kentaro Naka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,177,975
- Issue date Dec 24, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component and method for manufacturing a component
- Patent number 12,177,986
- Issue date Dec 24, 2024
- TDK ELECTRONICS AG
- Jan Ihle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving device, and camera module and optical device including...
- Patent number 12,177,547
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Sang Ok Park
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Free positioning charging pad
- Patent number 12,176,729
- Issue date Dec 24, 2024
- AIRA, INC.
- Eric Heindel Goodchild
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board (PCB) module comprising an embedded radio-fre...
- Patent number 12,171,058
- Issue date Dec 17, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting strip
- Patent number 12,169,059
- Issue date Dec 17, 2024
- SIGNIFY HOLDING, B.V.
- Andrew Christanto
- F21 - LIGHTING
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connected structure of substrate and carbon nanotube wire
- Patent number 12,166,324
- Issue date Dec 10, 2024
- Furukawa Electric Co., Ltd.
- Satoshi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging devices with user-interface controls
- Patent number 12,159,188
- Issue date Dec 3, 2024
- Zebra Technologies Corporation
- Darran Michael Handshaw
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising semiconductor module
- Patent number 12,160,144
- Issue date Dec 3, 2024
- Denso Corporation
- Syuhei Miyachi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device
- Patent number 12,156,335
- Issue date Nov 26, 2024
- Hung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,156,336
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,156,337
- Issue date Nov 26, 2024
- Dai Nippon Printing Co., Ltd.
- Seiji Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaged battery
- Patent number 12,156,338
- Issue date Nov 26, 2024
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, electronic device, and production method for circuit...
- Patent number 12,156,346
- Issue date Nov 26, 2024
- HONOR DEVICE CO., LTD.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE
- Publication number 20240431029
- Publication date Dec 26, 2024
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS
- Publication number 20240431026
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jaeho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE CAPABLE OF FAST CHARGING
- Publication number 20240429470
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kiyeong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...
- Publication number 20240428994
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke OYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240427435
- Publication date Dec 26, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND IMAGING MATERIAL BOX
- Publication number 20240424801
- Publication date Dec 26, 2024
- E-Z INK TECHNOLOGY CO., LTD
- Wenyi FAN
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLOUD COMPUTING AND INTERNET OF THINGS-BASED MONITORING TECHNIQUES...
- Publication number 20240422915
- Publication date Dec 19, 2024
- CDW LLC
- Donald L. Doyle
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VERTICALLY MOUNTED ADD-ON CAMERA MODULE
- Publication number 20240422418
- Publication date Dec 19, 2024
- SAGEMCOM BROADBAND SAS
- Hugo CHUSSEAU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ROTATING COMPACT LIGHT RANGING SYSTEM
- Publication number 20240418833
- Publication date Dec 19, 2024
- Ouster, Inc.
- Angus PACALA
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...
- Publication number 20240422911
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Controller Assembly and a Chassis System for a Vehicle
- Publication number 20240409050
- Publication date Dec 12, 2024
- ROBERT BOSCH GmbH
- Jian Fan
- B60 - VEHICLES IN GENERAL
Information Patent Application
SENSOR CABLE SUPPORT DEVICE INCLUDING MECHANICAL CONNECTORS
- Publication number 20240407673
- Publication date Dec 12, 2024
- DexCom. Inc.
- Pey-Jiun Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240414835
- Publication date Dec 12, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20240413762
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Takuya NAKAMURA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SURFACE MOUNT ELECTRICAL DEVICES AND METHODS
- Publication number 20240412937
- Publication date Dec 12, 2024
- BOURNS, INC
- Kelly C. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER STRUCTURE FOR POWER MODULES
- Publication number 20240413118
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240414847
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Takeshi KAZAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTOR UNIT
- Publication number 20240414895
- Publication date Dec 12, 2024
- JTEKT CORPORATION
- Yuki HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DISPLAY DEVICE
- Publication number 20240411168
- Publication date Dec 12, 2024
- LG ELECTRONICS INC.
- Jaebok OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...
- Publication number 20240412924
- Publication date Dec 12, 2024
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240414843
- Publication date Dec 12, 2024
- GOERTEK INC.
- Katsumi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES
- Publication number 20240414855
- Publication date Dec 12, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Module
- Publication number 20240402428
- Publication date Dec 5, 2024
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Long ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...
- Publication number 20240407100
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...
- Publication number 20240402024
- Publication date Dec 5, 2024
- UNIVERSAL CEMENT CORPORATION
- Sih-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

associated with surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor lens assembly having non-soldering configuration

Electronic device including lines provided on elastic base

Module

Coil component, circuit board, and electronic device

Modular electronic prototyping platforms

Chip resistor, method of producing chip resisitor and chip resistor...

High frequency and high power thin film component

Wiring substrate

Component and method for manufacturing a component

Lens driving device, and camera module and optical device including...

Free positioning charging pad

Printed circuit board (PCB) module comprising an embedded radio-fre...

Electronic assembly and method for thermal balancing of surfacemoun...

Semiconductor apparatus with inspection terminals

Lighting strip

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Connected structure of substrate and carbon nanotube wire

Systems and methods for phase switch timing controller for inverter...

High density 3D interconnect configuration

Imaging devices with user-interface controls

Light emitting diode for low temperature applications

Electronic device comprising semiconductor module

Electronic device

Electronic device

Wiring board and method for manufacturing wiring board

Electronic package and manufacturing method thereof, and substrate...

Chip packaged battery

Printed circuit board with single rank memory configuration using p...

Method and configuration for stacking multiple printed circuit boards

Circuit board, electronic device, and production method for circuit...

Patents Applicationslast 30 patents

INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE

APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

PRINTED WIRING BOARD

ELECTRONIC DEVICE CAPABLE OF FAST CHARGING

MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...

WATERPROOF ELECTRONIC PEN

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

CHIP ASSEMBLY AND IMAGING MATERIAL BOX

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

CLOUD COMPUTING AND INTERNET OF THINGS-BASED MONITORING TECHNIQUES...

VERTICALLY MOUNTED ADD-ON CAMERA MODULE

ROTATING COMPACT LIGHT RANGING SYSTEM

ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUI...

Controller Assembly and a Chassis System for a Vehicle

SENSOR CABLE SUPPORT DEVICE INCLUDING MECHANICAL CONNECTORS

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

POWER CONVERSION DEVICE

SURFACE MOUNT ELECTRICAL DEVICES AND METHODS

SOLDER BARRIER STRUCTURE FOR POWER MODULES

MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME

MOTOR UNIT

DISPLAY DEVICE

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES

Optical Module

ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...

SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...