associated with surface mounted components

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CPC
H05K1/181

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/181associated with surface mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Magnetic body, coil component including magnetic body, and method o...
- Patent number 12,315,660
- Issue date May 27, 2025
- Taiyo Yuden Co., Ltd.
- Yoko Orimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor with printed circuit board based contact
- Patent number 12,317,420
- Issue date May 27, 2025
- MEAS France
- Emilien Durupt
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for temperature measurement and method of processing subs...
- Patent number 12,317,419
- Issue date May 27, 2025
- Semes Co., Ltd.
- Yong Jun Seo
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, apparatuses, methods, and non-transitory computer-readable...
- Patent number 12,314,208
- Issue date May 27, 2025
- Huawei Technologies Co., Ltd.
- Davide Tonietto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongate medical tools including printed circuit boards
- Patent number 12,303,653
- Issue date May 20, 2025
- Pacesetter, Inc.
- Amanuel Seretse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Synchronous rectification assembly, manufacturing method thereof an...
- Patent number 12,308,757
- Issue date May 20, 2025
- APLUS POWER TECHNOLOGY (HANGZHOU) CO., LTD.
- Yuetian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,309,929
- Issue date May 20, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,342
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Myong Soo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor assembly and front cover of optical sensor assembly
- Patent number 12,306,035
- Issue date May 20, 2025
- Chih-Ming Sun
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device, pressure sensor module, and signal correcti...
- Patent number 12,306,050
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Hideaki Sugibayashi
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer circuit board having signal and power isolation circuit
- Patent number 12,309,914
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Point of load module and heatsink therefor
- Patent number 12,309,910
- Issue date May 20, 2025
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetically secured semiconductor chip package loading assembly
- Patent number 12,309,933
- Issue date May 20, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device including substrates with connectors
- Patent number 12,302,500
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Naoya Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,302,488
- Issue date May 13, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transformer in a package substrate
- Patent number 12,302,498
- Issue date May 13, 2025
- STMicroelectronics (Tours) SAS
- Laurent Moindron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed electrical connector
- Patent number 12,300,937
- Issue date May 13, 2025
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Wenfeng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a grooved shield film
- Patent number 12,295,130
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module having a shield film and method of manufacturing the same
- Patent number 12,295,129
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic coating of components
- Patent number 12,289,840
- Issue date Apr 29, 2025
- Heraeus Medevio GmbH & Co. KG
- Ulrich Hausch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS
- Publication number 20250168987
- Publication date May 22, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250168986
- Publication date May 22, 2025
- TDK Corporation
- Akiko SEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250168970
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Daichi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Electronic Device
- Publication number 20250155466
- Publication date May 15, 2025
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250159799
- Publication date May 15, 2025
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250159805
- Publication date May 15, 2025
- InnoLux Corporation
- Shang-Ru WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...
- Publication number 20250157999
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Jinwen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...
- Publication number 20250158262
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Bing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Improving Micro-Inverter Longevity
- Publication number 20250151199
- Publication date May 8, 2025
- AA Power Inc.
- Qun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20250151207
- Publication date May 8, 2025
- Shanghai AVIC Optoelectronics Co., Ltd.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR, CIRCUIT BOARD ASSEMBLY, AND INVERTER
- Publication number 20250149234
- Publication date May 8, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Jinkun LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250149252
- Publication date May 8, 2025
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...
- Publication number 20250151200
- Publication date May 8, 2025
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS

associated with surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for an interlocking feature on a power module

Magnetic body, coil component including magnetic body, and method o...

Sensor with printed circuit board based contact

Apparatus for temperature measurement and method of processing subs...

Electronic package and method of manufacturing the same

Systems, apparatuses, methods, and non-transitory computer-readable...

Wiring board, semiconductor device, and method of manufacturing wir...

Elongate medical tools including printed circuit boards

High density coil design and process

Electronic device

Synchronous rectification assembly, manufacturing method thereof an...

Board-level pad pattern for multi-row QFN packages

Sandwich structure power supply module

Bonding apparatus and bonding method

Optical sensor assembly and front cover of optical sensor assembly

Pressure sensor device, pressure sensor module, and signal correcti...

Multilayer circuit board having signal and power isolation circuit

High capacitance memory device

Point of load module and heatsink therefor

Magnetically secured semiconductor chip package loading assembly

Circuit board with convex shaped post, light emitting device, and m...

Devices with conductive or magnetic nanowires for localized heating...

Power conversion device including substrates with connectors

Electronic control device

Wiring substrate

Transformer in a package substrate

High speed electrical connector

Module including a grooved shield film

Module having a shield film and method of manufacturing the same

Hermetic coating of components

Patents Applicationslast 30 patents

MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WIRING BOARD

Heatsink techniques for optical and electrical modules

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Method For Manufacturing Electronic Device

PRINTED CIRCUIT BOARD ASSEMBLY

INTEGRATED CIRCUIT STRUCTURE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

FLEXIBLE CIRCUIT BOARD

ELECTRONIC DEVICE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...

SEMICONDUCTOR PACKAGE

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...

SEMICONDUCTOR STORAGE DEVICE

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

Apparatus and Method for Improving Micro-Inverter Longevity

WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

INTEGRATED INDUCTOR, CIRCUIT BOARD ASSEMBLY, AND INVERTER

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE