1. Field of the Invention
The present invention relates to flex circuits and more particularly to an assembly which couples a flex circuit between an electronic or optoelectronic device and a rigid structure.
2. Discussion of the Related Art
Electronic devices play an increasingly critical role in the lives of many consumers today. For example, applications as simple as listening to a compact disc player to applications incorporated in life saving machines used in emergency rooms implement electronic devices. Many of these devices read and transfer data using electro-optics.
These devices employ electro optical components capable of reading a medium. These applications may alternatively implement electronic components capable of transmitting and receiving information through a medium. These applications include various components, such as printed circuit boards (PCBs), integrated circuits, passive electrical components, photodetectors, and lasers.
The electronic components associated with these devices must of course electrically interconnect with one another. Among the components which may be used to electrically interconnect the components are flex circuits. Flex circuits typically include a single or multilayer electrically insulating material laminated to or otherwise patterned with metallic conductive pathways, possibly with a protective mask layer covering the multilayer materials to provide electrical isolation. Flex circuits are highly desirable. For example, they are relatively light weight and take-up little space. Flex circuit are also flexible and, because they are flexible, they are easy to install. Furthermore, flex circuits generally exhibit good impedance control, reliability and repeatability, thermal management characteristics, as well as uniform electrical characteristics, which is particularly important in high speed circuitry applications.
In addition, during fabrication of a device which uses the structure shown in
In addition, the adhesive in the assembly shown in related-art
Therefore, a need exists for an assembly that couples a flex circuit with a rigid structure in a mechanically robust manner. Furthermore, a need exists to reduce the costs associated with devices using the assembly.
Accordingly, the present invention is directed to a flex circuit assembly that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
An advantage of the present invention is to provide a mechanically robust interconnection between a flex circuit and a rigid structure. The present invention also provides a mechanical interconnection which minimizes strain where a flex circuit interfaces with a rigid structure. Embodiments of the invention use little board space and eliminate the need for adhesives.
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a flex circuit assembly is disclosed and may be used with a rigid structure in one embodiment. The flex circuit assembly includes a staple configured to extend into the rigid structure. In this embodiment, a flex circuit extends between a portion of the staple and the rigid structure such that the staple couples the flex circuit with the rigid structure.
In another aspect of the present invention, a flex circuit assembly for coupling a flex circuit to a rigid structure is disclosed. The flex circuit assembly comprises a staple having a first post and a second post opposite the first post. The first post and the second post are configured for insertion into a surface of the rigid structure. Moreover, the first post and the second post are spaced apart from one another such that the flex circuit extends between the first post and the second post when the flex circuit couples with the rigid structure.
In a further embodiment of the present invention, a flex circuit assembly for coupling an electrical device with a rigid structure is disclosed. The flex circuit assembly includes a flex circuit which couples with the electrical device and a staple. The staple is configured to extend into the rigid structure where the flex circuit extends between a portion of the staple and the rigid structure. The flex circuit couples with the rigid structure such that the flex circuit couples the electrical device with the rigid structure.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. These and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The accompanying drawings, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
In this example, a solder interconnect 110 electrically interconnects the flex circuit 106 with the optoelectronic package 102 in two locations. The solder interconnect 110 provides a electrically conductive interface between the flex circuit 106 and the optoelectronic package 102.
It should be noted that in accordance with an alternative embodiment of the present invention, the flex circuit 106 may interface with the optoelectronic package 102 as shown in
Returning to
The flex circuit 106 also couples with the PCB 100 as shown in
The staple 104 provides several advantages. The staple 104 provides strain relief thereby increasing reliability. In addition, a single staple can be used to retain multiple flex pieces. In addition and as describe more fully with reference to
Now making reference to
In accordance with a further embodiment of the present invention, the flex circuit 106 may also have circles 107, as shown in
As may be seen with reference to
In this example, the staple 104 includes four posts 104b as shown with reference to
The configuration of the staple 104 permits easy removal should the PCB 100, the optoelectronic package 102 or the plastic injection molded fiber optic alignment sleeve 112 fail. For example, if the PCB 100 fails, the flex circuit 106 may be easily removed from the PCB 100 and the flex circuit 106, along with the optoelectronic package 102 and the plastic injection molded fiber optic alignment sleeve 112, may be reused with another component. Alternatively, the flex circuit 106 itself can be easily replaced if necessary.
The present invention provides an attractive solution to engineers and designers wishing to incorporate flex circuits into electronic components. The present invention provides an assembly which allows easy integration of a flex circuit into a variety of devices. The devices which may use the present invention include optical transceivers, CD players, DVD players, CD-ROM drives, hard drives and the like. The staple of the present invention lends itself to automated processes since attaching the staple to the PCB is coupling one rigid structure with another rigid structure. Furthermore, the decreased part count minimizes the aforementioned thermal issues where different thermal properties of different materials increase the possibility of the creation of stress points during thermal cycling thereby reducing reliability. As such, the present invention decreases costs associated with coupling flex circuits with rigid structures, and more importantly, costs to consumers of goods which incorporate the present invention, such as the aforementioned devices.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
This application claims the benefit of U.S. Provisional Application No. 60/566,665, filed Apr. 30, 2004 and entitled FLEX CIRCUIT ASSEMBLY, which is hereby incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
3271214 | Tabor | Sep 1966 | A |
3629787 | Wilson | Dec 1971 | A |
3987676 | Bennewitz | Oct 1976 | A |
4092061 | Stigliani, Jr. | May 1978 | A |
4128697 | Simpson | Dec 1978 | A |
4162817 | Briggs et al. | Jul 1979 | A |
4295696 | Gray | Oct 1981 | A |
4375578 | Mitchell et al. | Mar 1983 | A |
4435031 | Black et al. | Mar 1984 | A |
4435740 | Huckabee et al. | Mar 1984 | A |
4769684 | Crocker et al. | Sep 1988 | A |
4818099 | Preikschat et al. | Apr 1989 | A |
4952016 | Adams et al. | Aug 1990 | A |
4953006 | Kovats et al. | Aug 1990 | A |
4962991 | Carvalho | Oct 1990 | A |
4973211 | Potucek | Nov 1990 | A |
5044980 | Krumme et al. | Sep 1991 | A |
5125054 | Ackley et al. | Jun 1992 | A |
5136682 | Moyer et al. | Aug 1992 | A |
5212345 | Gutierrez | May 1993 | A |
5249245 | Lebby et al. | Sep 1993 | A |
5253311 | Killen et al. | Oct 1993 | A |
5262590 | Lia | Nov 1993 | A |
5299276 | Okamura et al. | Mar 1994 | A |
5359686 | Galloway et al. | Oct 1994 | A |
5361317 | Hartman et al. | Nov 1994 | A |
5371820 | Welbourn et al. | Dec 1994 | A |
5371822 | Horwitz et al. | Dec 1994 | A |
5375184 | Sullivan | Dec 1994 | A |
5389686 | Diop et al. | Feb 1995 | A |
5414786 | Ohta et al. | May 1995 | A |
5420954 | Swirhun et al. | May 1995 | A |
5432630 | Lebby et al. | Jul 1995 | A |
5462441 | Renn et al. | Oct 1995 | A |
5471552 | Wuu et al. | Nov 1995 | A |
5474463 | Robinson et al. | Dec 1995 | A |
5495125 | Uemura | Feb 1996 | A |
5499312 | Hahn et al. | Mar 1996 | A |
5539848 | Galloway | Jul 1996 | A |
5545846 | Williams et al. | Aug 1996 | A |
5596662 | Boscher | Jan 1997 | A |
5613024 | Shahid | Mar 1997 | A |
5625734 | Thomas et al. | Apr 1997 | A |
5638469 | Feldman et al. | Jun 1997 | A |
5666449 | Sawae et al. | Sep 1997 | A |
5703895 | Ghirardi et al. | Dec 1997 | A |
5706378 | Suzuki et al. | Jan 1998 | A |
5717800 | Funabashi | Feb 1998 | A |
5733151 | Edsall et al. | Mar 1998 | A |
5752851 | Zaderej et al. | May 1998 | A |
5774614 | Gilliland et al. | Jun 1998 | A |
5894409 | Tanaka | Apr 1999 | A |
5974214 | Shacklette et al. | Oct 1999 | A |
6010359 | Etters et al. | Jan 2000 | A |
6011695 | Dumke | Jan 2000 | A |
6017222 | Kao | Jan 2000 | A |
6039600 | Etters et al. | Mar 2000 | A |
6040624 | Chambers et al. | Mar 2000 | A |
6045269 | Watanabe et al. | Apr 2000 | A |
6069991 | Hibbs-Brenner et al. | May 2000 | A |
6088498 | Hibbs-Brenner et al. | Jul 2000 | A |
6091475 | Ogino et al. | Jul 2000 | A |
6118666 | Aoki et al. | Sep 2000 | A |
6162065 | Benham | Dec 2000 | A |
6195261 | Babutzka et al. | Feb 2001 | B1 |
6268231 | Wetzel | Jul 2001 | B1 |
6294255 | Suzuki et al. | Sep 2001 | B1 |
6326553 | Yim et al. | Dec 2001 | B1 |
6380493 | Morita et al. | Apr 2002 | B1 |
6404960 | Hibbs-Brenner et al. | Jun 2002 | B1 |
6473314 | Custer et al. | Oct 2002 | B1 |
6485322 | Branch et al. | Nov 2002 | B1 |
6521989 | Zhou | Feb 2003 | B2 |
6537082 | Hopfer et al. | Mar 2003 | B2 |
6586678 | Rosenberg et al. | Jul 2003 | B1 |
6617518 | Ames et al. | Sep 2003 | B2 |
6703561 | Rosenberg et al. | Mar 2004 | B1 |
6709607 | Hibbs-Brenner et al. | Mar 2004 | B2 |
6767220 | Wilson et al. | Jul 2004 | B2 |
6769920 | Mease et al. | Aug 2004 | B1 |
6809905 | Kilmer | Oct 2004 | B2 |
6863453 | Wang et al. | Mar 2005 | B2 |
20020170742 | Liaw et al. | Nov 2002 | A1 |
20030102157 | Rosenberg et al. | Jun 2003 | A1 |
20030197254 | Huang | Oct 2003 | A1 |
20040018409 | Hui et al. | Jan 2004 | A1 |
20040062491 | Sato et al. | Apr 2004 | A1 |
20040090620 | Farr | May 2004 | A1 |
20040092135 | Hofmesiter et al. | May 2004 | A1 |
20050130488 | Zhu et al. | Jun 2005 | A1 |
Number | Date | Country |
---|---|---|
0 881 671 | Dec 1998 | GB |
0 905 838 | Mar 1999 | GB |
61-071689 | Apr 1986 | JP |
62114545 | May 1987 | JP |
63-136680 | Jun 1988 | JP |
01-169986 | May 1989 | JP |
02-240989 | Sep 1990 | JP |
03-0148190 | Jun 1991 | JP |
406034838 | Feb 1994 | JP |
407159636 | Jun 1995 | JP |
09-223848 | Aug 1997 | JP |
9200538 | Jan 1992 | WO |
Number | Date | Country | |
---|---|---|---|
20050245118 A1 | Nov 2005 | US |
Number | Date | Country | |
---|---|---|---|
60566665 | Apr 2004 | US |