FLOW PASSAGE STRUCTURE FOR WATER-COOLING DEVICE

Abstract

A flow passage structure for water-cooling device includes a heat-conductive main body provided with at least one flow passage, an inlet, and an outlet; and at least one vortex-forming section. The flow passage is provided in the heat-conductive main body and has a type of cooling liquid contained therein. The flow passage includes a channel portion and a top portion integrally connected to one another to ensure a leak-free flow passage. The at least one vortex-forming section is provided on one of the channel portion and the top portion for the cooling liquid flowing therethrough to form separated vortexes, so as to enable largely increased flow field turbulence in the flow passage and accordingly upgraded heat transfer performance of the cooling liquid.

Description

FIELD OF THE INVENTION

The present invention relates to a flow passage structure for water-cooling device, and more particularly to a flow passage structure for water-cooling device that includes at least one flow passage provided with at least one vortex-forming section, so as to enable upgraded heat transfer effect of a cooling liquid flowing through the flow passage.

BACKGROUND OF THE INVENTION

Following the increasing progress in the electronic information technology, various kinds of electronic apparatus, such as computers, notebook computers, communication chassis and the like, are now highly popular and have very wider applications. However, when these electronic apparatus operate at high speed, electronic elements thereof will produce waste heat. The produced heat must be timely expelled from the electronic apparatus, lest the heat should accumulate in the electronic apparatus to constantly increase the temperature thereof and cause overheating, damage, failure, or low efficiency of the electronic elements.

To improve the above-mentioned heat dissipation problem, one of the most common ways is to mount a cooling fan in the apparatus to forcefully dissipate the produced heat into ambient air. However, the cooling fan can only produce very limited air flow and accordingly fails to enable largely lowered temperature and upgraded heat dissipation effect. Another solution has been suggested to directly attach a water-cooling type heat dissipation device to a heat-producing element, such as a central processing unit (CPU), a microprocessor unit (MPU), south-bridge and north-bridge chips, and other electronic elements that would produce high amount of heat during operation thereof, and then, use a pump to introduce a cooling liquid from a reservoir into the water-cooling type heat dissipation device, so that the heat transferred from the heat-producing element to the water-cooling heat dissipation device is absorbed by the cooling liquid through heat exchange. Then, the heat-absorbed cooling liquid flows out of the water-cooling heat dissipation device via an outlet thereof to a thermal module and is cooled again before flowing back into the reservoir. By circulating the cooling liquid, it is helpful in lowering the temperature of the heat-producing element, allowing the heat-producing element to operate smoothly.

However, while the water-cooling type heat dissipation device improves the air-cooling type heat dissipation, it is subject to another problem. That is, the water-cooling type heat dissipation device has one face (i.e. a heat-absorbing face) tightly bearing on one face of the heat-producing element, and the cooling liquid is introduced into and circulates in a flow passage of the water-cooling type heat dissipation device to perform heat exchange with the water-cooling type heat dissipation device. Since the cooling liquid stays in the water-cooling type heat dissipation device only for a very short time, it soon flows out of the water-cooling type heat dissipation device via the outlet before it can fully absorb the heat through heat exchange. As a result, the water-cooling type heat dissipation device has low function and poor heat dissipation effect.

In the conventional water-cooling type heat dissipation device, the flow passage thereof is a one-way smooth flow passage, and the cooling liquid stays in the smooth flow passage for only a very short time to carry away only a relatively small amount of heat from the heat source. That is why the conventional water-cooling type heat dissipation device has poor heat exchange efficiency and poor heat transfer effect to provide low heat dissipation performance. In brief, the conventional water-cooling type heat dissipation device has the following disadvantages: (1) poor heat exchange efficiency; and (2) low heat dissipation performance.

It is therefore tried by the inventor to develop an improved flow passage structure for water-cooling device, so as to overcome the disadvantages in the prior art.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a flow passage structure for water-cooling device that causes a cooling liquid flowing therethrough to form separated vortexes, so as to enable increased flow field turbulence in the flow passage structure and upgraded heat transfer performance of the cooling liquid.

To achieve the above and other objects, the flow passage structure for water-cooling device according to the present invention includes a heat-conductive main body and at least one vortex-forming section. The heat-conductive main body is provided with at least one flow passage, an inlet, and an outlet. The flow passage is arranged in the heat-conductive main body and includes a channel portion and a top portion; and the channel portion and top portion are connected to one another to ensure a leak-free flow passage. The at least one vortex-forming section is provided on one of the channel portion and the top portion of the flow passage; and the inlet and the outlet separately communicate with two opposite ends of the flow passage.

By providing the vortex-forming sections in the flow passage, the heat-conductive main body can have increased heat-exchange efficiency, and the cooling liquid flowing through the vortex-forming sections is able to form separated vortexes in the flow passage to thereby enable increased flow field turbulence in the flow passage and upgraded heat transfer performance of the cooling liquid.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

FIG. 1 is an exploded perspective view of a flow passage structure for water-cooling device according to a first embodiment of the present invention;

FIG. 2 is an assembled view of the first embodiment;

FIG. 3 is an assembled sectional view of the first embodiment;

FIG. 4 a is a top plan view of a first variant of the first embodiment;

FIG. 4 b is a top plan view of a second variant of the first embodiment;

FIG. 5 a is a top plan view of the first embodiment with square-shaped vortex-forming sections;

FIG. 5 b is a top plan view of the first embodiment with triangular-shaped vortex-forming sections;

FIG. 5 c is a top plan view of the first embodiment with rectangular-shaped vortex-forming sections;

FIG. 5 d is a top plan view of the first embodiment with round-shaped vortex-forming sections;

FIG. 5 e is a top plan view of the first embodiment with diamond-shaped vortex-forming sections;

FIG. 6 a is a lengthwise sectional view of a flow passage structure for water-cooling device according to a second embodiment of the present invention;

FIG. 6 b is a lengthwise sectional view of a variant of the flow passage structure for water-cooling device according to the second embodiment of the present invention;

FIG. 7 is a top plan view of a flow passage structure for water-cooling device according to a third embodiment of the present invention;

FIG. 8 is a perspective view of a flow passage structure for water-cooling device according to a fourth embodiment of the present invention;

FIG. 9 is an exploded perspective view of a flow passage structure for water-cooling device according to a fifth embodiment of the present invention; and

FIG. 10 is a top plan view showing the operation of a water-cooling device with the flow passage structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

The present invention provides a flow passage structure for water-cooling device. For the purpose of conciseness, the present invention is also briefly referred to as “the flow passage structure” herein. FIGS. 1 and 2 are exploded and assembled perspective views, respectively, of the flow passage structure according to a first embodiment of the present invention; FIG. 3 is an assembled sectional view of the first embodiment; FIGS. 4a and 4b are top plan views of a first and a second variant of the first embodiment, respectively; and FIGS. 5a to 5e are top plan views of the first embodiment with differently shaped vortex-forming sections. Please refer to FIGS. 1 through 5e. The flow passage structure in the first embodiment includes a heat-conductive main body 1, on which at least one flow passage 11, an inlet 12, and an outlet 13 are provided.

The flow passage 11 is arranged in the heat-conductive main body 1 to contain a type of cooling liquid 2 therein (see FIG. 10). The flow passage 11 has a channel portion 111 and a top portion 112 that are connected to one another to ensure a leak-free flow passage. At least one vortex-forming section 14 is provided on one of the channel portion 111 and the top portion 112. In the illustrated first embodiment, a plurality of vortex-forming sections 14 is provided. The inlet 12 and the outlet 13 separately communicate with two opposite ends of the flow passage 11.

The channel portion 111 includes a first wall surface 1111, a second wall surface 1112, and a third wall surface 1113. The second and the third wall surface 1112, 1113 are integrally connected to two lateral edges of the first wall surface 1111. The vortex-forming sections 14 can be selectively provided on one of the first wall surface 1111 (see FIG. 1), the second wall surface 1112 (see FIG. 4a), and the third wall surface 1113 (see FIG. 4b). The vortex-forming sections 14 are protrusions axially spaced in the flow passage 11. In the illustrated first embodiment, the vortex-forming sections 14 are provided on the first wall surface 1111 of the channel portion 111, as shown in FIG. 1.

The heat-conductive main body 1 is formed from a base 1a and a cover 1b. The cover 1b is correspondingly closed onto an open top of the base 1a.

The vortex-forming sections 14 in the form of protrusions can be differently shaped. For example, FIGS. 5a to 5e respectively show square-shaped, triangular-shaped, rectangular-shaped, round-shaped, and diamond-shaped protrusions 14. In practical implementation of the present invention, the protrusions 14 can be of any geometrical shapes without being limited to the above-mentioned ones.

The protrusions 14 respectively have a width not exceeding one third of a width of the flow passage 11. The protrusions 14 have a height that can be as high as the top portion 112 or lower than the top portion 112.

Please refer to FIG. 6a that is a lengthwise sectional view of a flow passage structure according to a second embodiment of the present invention, and to FIG. 6b that shows a variant of the second embodiment. The second embodiment is generally structurally similar to the first embodiment except that the vortex-forming sections 14 are recesses. In FIG. 6a, the recesses 14 are axially spaced in the flow passage 11. In FIG. 6b, the recesses 14 are axially continuously arranged in the flow passage 11. In practical implementation of the present invention, the recesses 14 can be arranged in the flow passage 11 in any one of the two manners shown in FIGS. 6a and 6b. Meanwhile, the recesses 14 are provided on the first wall surface 1111 of the channel portion 111.

Similarly, the recesses 14 can be differently shaped, such as square-shaped, triangular-shaped, rectangular-shaped, round-shaped, and diamond-shaped, or can be any other geometrical shapes.

FIG. 7 is a top plan view showing a base for the flow passage structure according to a third embodiment of the present invention. As shown, the third embodiment is generally structurally similar to the first embodiment except that the vortex-forming sections 14 are protrusions axially continuously arranged in the flow passage 11.

FIG. 8 is a perspective view showing a flow passage structure according to a fourth embodiment of the present invention. As shown, the fourth embodiment is generally structurally similar to the first embodiment except that the heat-conductive main body 1 includes a first face 15 in contact with at least one heat source 3 and an opposite second face 16 provided with a plurality of heat radiating fins 161.

FIG. 9 is an exploded perspective view showing a flow passage structure for water-cooling device according to a fifth embodiment of the present invention, and FIG. 10 is a top plan view of FIG. 9 showing the operation of the flow passage structure. As shown, the fifth embodiment is generally structurally similar to the first embodiment except that the inlet 12 and the outlet 13 of the heat-conductive main body 1 are respectively connected to at least a first pipe 4 and a second pipe 5. The first pipe 4 and the second pipe 5 are respectively connected at an end opposite to the heat-conductive main body 1 to a pump 6. When the pump 6 is pressurized to drive the cooling liquid 2 through the first pipe 4 into the flow passage 11 in the heat-conductive main body 1, the vortex-forming sections 14 cause the cooling liquid 2 flowing therethrough to form separated vortexes to thereby enable increased flow field turbulence in the flow passage structure and accordingly upgraded heat transfer performance of the cooling liquid.

The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims

1. A flow passage structure for water-cooling device, comprising: a heat-conductive main body being provided with at least one flow passage, an inlet, and an outlet; the flow passage being arranged in the heat-conductive main body and including a channel portion and a top portion; the channel portion and top portion being connected to one another to ensure a leak-free flow passage; andat least one vortex-forming section being provided on one of the channel portion and the top portion; andwherein the inlet and the outlet separately communicate with two opposite ends of the flow passage.

2. The flow passage structure for water-cooling device as claimed in claim 1, wherein there are provided two and more vortex-forming sections and the vortex-forming sections are protrusions axially continuously arranged in the flow passage.

3. The flow passage structure for water-cooling device as claimed in claim 1, wherein there are provided two and more vortex-forming sections and the vortex-forming sections are protrusions axially spaced in the flow passage.

4. The flow passage structure for water-cooling device as claimed in claim 1, wherein there are provided two and more vortex-forming sections and the vortex-forming sections are recesses axially continuously arranged in the flow passage.

5. The flow passage structure for water-cooling device as claimed in claim 1, wherein there are provided two and more vortex-forming sections and the vortex-forming sections are recesses axially spaced in the flow passage.

6. The flow passage structure for water-cooling device as claimed in claim 1, wherein the channel portion includes a first wall surface, a second wall surface, and a third wall surface; the second wall surface and the third wall surface being separately connected to two opposite lateral edges of the first wall surface; and the vortex-forming sections being selectively provided on one of the first, the second and the third wall surface.

7. The flow passage structure for water-cooling device as claimed in claim 1, wherein the heat-conductive main body has a first face and an opposite second face; the first face being in contact with at least one heat source, and the second face being provided with a plurality of heat radiating fins.

8. The flow passage structure for water-cooling device as claimed in claim 1, wherein the inlet and the outlet of the heat-conductive main body are

9. The flow passage structure for water-cooling device as claimed in claim 2, wherein the protrusions are selected from the group consisting of square-shaped, triangular-shaped, rectangular-shaped, round-shaped, diamond-shaped, and other geometrically-shaped protrusions.

10. The flow passage structure for water-cooling device as claimed in claim 3, wherein the protrusions are selected from the group consisting of square-shaped, triangular-shaped, rectangular-shaped, round-shaped, diamond-shaped, and other geometrically-shaped protrusions.

11. The flow passage structure for water-cooling device as claimed in claim 4, wherein the recesses are selected from the group consisting of square-shaped, triangular-shaped, rectangular-shaped, round-shaped, diamond-shaped, and other geometrically-shaped recesses.

12. The flow passage structure for water-cooling device as claimed in claim 5, wherein the recesses are selected from the group consisting of square-shaped, triangular-shaped, rectangular-shaped, round-shaped, diamond-shaped, and other geometrically-shaped recesses.

13. The flow passage structure for water-cooling device as claimed in claim 1, wherein the heat-conductive main body is formed from a base and a cover, and the cover being correspondingly closed onto an open top of the base.