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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/473by flowing liquids

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Patents Grantslast 30 patents

Information Patent Grant
Modular heat-transfer systems
- Patent number 12,213,289
- Issue date Jan 28, 2025
- Coolit Systems, Inc.
- Geoff Sean Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink
- Patent number 12,211,768
- Issue date Jan 28, 2025
- WELCON Inc.
- Yutaka Suzuki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and semiconductor module
- Patent number 12,205,867
- Issue date Jan 21, 2025
- Mitsubishi Electric Corporation
- Koji Kise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Arrangement comprising a baseplate for a power semiconductor module...
- Patent number 12,199,013
- Issue date Jan 14, 2025
- HITACHI ENERGY LTD
- Thomas Gradinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies including signal redistribution and m...
- Patent number 12,191,235
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,183,658
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- Koichi Ushijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,178,023
- Issue date Dec 24, 2024
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boiler enhancement coatings with active boiling management
- Patent number 12,178,005
- Issue date Dec 24, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus and semiconductor apparatus with cooling apparatus
- Patent number 12,178,007
- Issue date Dec 24, 2024
- Fuji Electric Co., Ltd.
- Ginji Uchibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cold plates incorporating S-cells
- Patent number 12,165,954
- Issue date Dec 10, 2024
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control device, in particular cooling device for a moto...
- Patent number 12,162,328
- Issue date Dec 10, 2024
- Valeo Systemes Thermiques
- Fethy Djallal
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heatsink and cooling device
- Patent number 12,165,953
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced pressure drop cold plate transition
- Patent number 12,158,314
- Issue date Dec 3, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling apparatus
- Patent number 12,158,786
- Issue date Dec 3, 2024
- Cooler Master Co., Ltd.
- Shui Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct cooling of a power converter by using a stamped plate
- Patent number 12,160,982
- Issue date Dec 3, 2024
- Audi AG
- Thomas Gradinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...
- Publication number 20250038069
- Publication date Jan 30, 2025
- CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
- HYOUNG SOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES
- Publication number 20250029891
- Publication date Jan 23, 2025
- SABANCI UNIVERSITESI
- Murat Kaya YAPICI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...
- Publication number 20250029890
- Publication date Jan 23, 2025
- Avago Technologies International Sales Pte. Limited
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING FLUID CIRCULATION MODULE AND ELECTRONIC DEVICE COMPRISING T...
- Publication number 20250016957
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Daehyuk SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Exchangers for Fuel Rods Incorporating Sensors
- Publication number 20250006388
- Publication date Jan 2, 2025
- Battelle Energy Alliance, LLC
- Isabella J. VAN ROOYEN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20250006566
- Publication date Jan 2, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-COOLED POWER MODULE
- Publication number 20250006589
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20240429113
- Publication date Dec 26, 2024
- MEDIATEK INC.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240421027
- Publication date Dec 19, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS
- Publication number 20240419226
- Publication date Dec 19, 2024
- Cooler Master Co., Ltd.
- Shui Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING DEVICE FOR POWER DEVICE
- Publication number 20240413055
- Publication date Dec 12, 2024
- Nikkeikin ALMO COMPANY, LTD.
- Kazuhito SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
Boiler Enhancement Coatings with Active Boiling Management
- Publication number 20240407129
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...
- Publication number 20240379498
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR DEVICE
- Publication number 20240379499
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS

by flowing liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular heat-transfer systems

Heat sink

Cold plates incorporating reactive multilayer systems and S-cells

Housing comprising a composite wall integrating at least one coolin...

Heat sink and semiconductor module

Systems and methods for non-overlap enforcement for inverter for el...

Modular microchannel thermal solutions for integrated circuit devices

Arrangement comprising a baseplate for a power semiconductor module...

Method and extraction system for extracting an electronic device fr...

Embedded cooling systems and methods of manufacturing embedded cool...

Integrated cooling assemblies including signal redistribution and m...

Integrated cooling assemblies for advanced device packaging and met...

3D semiconductor device and structure with logic circuits and memor...

Systems and methods for single channel fault encoding for inverter...

Semiconductor module

Embedded cooling assemblies for advanced device packaging and metho...

Manifold designs for embedded liquid cooling in a package

Power conversion device

Boiler enhancement coatings with active boiling management

Cooling apparatus and semiconductor apparatus with cooling apparatus

Direct bonded copper substrates fabricated using silver sintering

Rack system for housing at least one immersion case

Cold plates incorporating S-cells

Temperature control device, in particular cooling device for a moto...

Systems and methods for phase switch timing controller for inverter...

Heatsink and cooling device

Reduced pressure drop cold plate transition

Cooling apparatus

Direct cooling of a power converter by using a stamped plate

Semiconductor device with spaced apart containers

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...

INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES

STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...

COOLING FLUID CIRCULATION MODULE AND ELECTRONIC DEVICE COMPRISING T...

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

Heat Exchangers for Fuel Rods Incorporating Sensors

SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

FLUID-COOLED POWER MODULE

LIDDED SEMICONDUCTOR PACKAGE

HOOD FOR MEMS-BASED COOLING SYSTEMS

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

COOLING APPARATUS

COOLING DEVICE FOR POWER DEVICE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

Boiler Enhancement Coatings with Active Boiling Management

Sealed Rack Server Unit

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

Semiconductor Device Package with Thermal Module

EMITTERS FOR INTEGRATED POWER CARD COOLING

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

SEMICONDUCTOR DEVICE

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...

COOLER AND SEMICONDUCTOR DEVICE