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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/473by flowing liquids

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,183,658
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,178,023
- Issue date Dec 24, 2024
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boiler enhancement coatings with active boiling management
- Patent number 12,178,005
- Issue date Dec 24, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus and semiconductor apparatus with cooling apparatus
- Patent number 12,178,007
- Issue date Dec 24, 2024
- Fuji Electric Co., Ltd.
- Ginji Uchibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cold plates incorporating S-cells
- Patent number 12,165,954
- Issue date Dec 10, 2024
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Temperature control device, in particular cooling device for a moto...
- Patent number 12,162,328
- Issue date Dec 10, 2024
- Valeo Systemes Thermiques
- Fethy Djallal
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heatsink and cooling device
- Patent number 12,165,953
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced pressure drop cold plate transition
- Patent number 12,158,314
- Issue date Dec 3, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling apparatus
- Patent number 12,158,786
- Issue date Dec 3, 2024
- Cooler Master Co., Ltd.
- Shui Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct cooling of a power converter by using a stamped plate
- Patent number 12,160,982
- Issue date Dec 3, 2024
- Audi AG
- Thomas Gradinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Techniques for incorporating sensors into apparatuses and systems
- Patent number 12,148,538
- Issue date Nov 19, 2024
- Battelle Energy Alliance, LLC
- Isabella J. van Rooyen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for power module
- Patent number 12,144,147
- Issue date Nov 12, 2024
- Hyundai Motor Company
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power electronics module with increased cooling surface
- Patent number 12,136,585
- Issue date Nov 5, 2024
- Danfoss Silicon Power GmbH
- Stefan Behrendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shield of an integrated circuit package
- Patent number 12,137,545
- Issue date Nov 5, 2024
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Convectors
- Patent number 12,129,868
- Issue date Oct 29, 2024
- Pedro Arnulfo Sarmiento
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Metal-coated, polymer-encapsulated electronics modules and methods...
- Patent number 12,132,010
- Issue date Oct 29, 2024
- GM Global Technology Operations LLC
- Anthony M. Coppola
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20240429113
- Publication date Dec 26, 2024
- MEDIATEK INC.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240421027
- Publication date Dec 19, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS
- Publication number 20240419226
- Publication date Dec 19, 2024
- Cooler Master Co., Ltd.
- Shui Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING DEVICE FOR POWER DEVICE
- Publication number 20240413055
- Publication date Dec 12, 2024
- Nikkeikin ALMO COMPANY, LTD.
- Kazuhito SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
Boiler Enhancement Coatings with Active Boiling Management
- Publication number 20240407129
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...
- Publication number 20240379498
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR DEVICE
- Publication number 20240379499
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUC...
- Publication number 20240371727
- Publication date Nov 7, 2024
- MAGNA POWERTRAIN GMBH & CO KG
- Benjamin Pessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK AND FABRICATION METHOD
- Publication number 20240363489
- Publication date Oct 31, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20240347416
- Publication date Oct 17, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH EFFICIENCY TRANSISTOR COOLING
- Publication number 20240347422
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Daniel CHANEMOUGAME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR
- Publication number 20240347421
- Publication date Oct 17, 2024
- Microsoft Technology Licensing, LLC
- Vaidehi ORUGANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS

by flowing liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with logic circuits and memor...

Systems and methods for single channel fault encoding for inverter...

Semiconductor module

Embedded cooling assemblies for advanced device packaging and metho...

Manifold designs for embedded liquid cooling in a package

Power conversion device

Boiler enhancement coatings with active boiling management

Cooling apparatus and semiconductor apparatus with cooling apparatus

Direct bonded copper substrates fabricated using silver sintering

Cold plates incorporating S-cells

Rack system for housing at least one immersion case

Temperature control device, in particular cooling device for a moto...

Systems and methods for phase switch timing controller for inverter...

Heatsink and cooling device

Reduced pressure drop cold plate transition

Cooling apparatus

Direct cooling of a power converter by using a stamped plate

Semiconductor device with spaced apart containers

Rack system for housing an electronic device

Techniques for incorporating sensors into apparatuses and systems

Alignment mechanism

Data center rack system with integrated liquid and dielectric immer...

Package including multiple semiconductor devices

Cooling apparatus for power module

Compact power electronics module with increased cooling surface

Electromagnetic shield of an integrated circuit package

Device and method for a two phase heat transfer

Convectors

Metal-coated, polymer-encapsulated electronics modules and methods...

Systems and methods for bidirectional message architecture for inve...

Patents Applicationslast 30 patents

LIDDED SEMICONDUCTOR PACKAGE

HOOD FOR MEMS-BASED COOLING SYSTEMS

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

COOLING APPARATUS

COOLING DEVICE FOR POWER DEVICE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

Boiler Enhancement Coatings with Active Boiling Management

Sealed Rack Server Unit

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

Semiconductor Device Package with Thermal Module

EMITTERS FOR INTEGRATED POWER CARD COOLING

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

SEMICONDUCTOR DEVICE

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...

COOLER AND SEMICONDUCTOR DEVICE

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

SEMICONDUCTOR MODULE ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUC...

CHIP STACK AND FABRICATION METHOD

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...

INTEGRATED HIGH EFFICIENCY TRANSISTOR COOLING

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR

POWER MODULE WITH OVERLAPPING TERMINALS