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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/473by flowing liquids

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Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device and method for manufacturing power conversi...
- Patent number 12,368,386
- Issue date Jul 22, 2025
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus with offset flow paths
- Patent number 12,369,277
- Issue date Jul 22, 2025
- Motivair Corporation
- Rich S Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system with external bypass air plenum
- Patent number 12,369,281
- Issue date Jul 22, 2025
- Amazon Technologies, Inc.
- David Edward Bryan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion device with board retention member
- Patent number 12,368,387
- Issue date Jul 22, 2025
- Mitsubishi Electric Corporation
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet impingement cooling for high power semiconductor devices
- Patent number 12,368,088
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett Galloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device and cooling system of the storage device with spiral...
- Patent number 12,363,859
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Soo-Young Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal module for a semiconductor package and methods of forming t...
- Patent number 12,362,258
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Cooling module for providing enhanced localized cooling of a heatsink
- Patent number 12,356,585
- Issue date Jul 8, 2025
- Abaco Systems, Inc.
- Joo Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip cooling package with multiple fluid paths
- Patent number 12,341,082
- Issue date Jun 24, 2025
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device cooling structures bonded to semiconductor elements
- Patent number 12,341,083
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electrical apparatus comprising two power electronic modules...
- Patent number 12,342,512
- Issue date Jun 24, 2025
- Valeo eAutomotive France SAS
- Aurélien Pouilly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,334,409
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Yasufumi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component cooler for a computing device
- Patent number 12,336,147
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Christopher M. Helberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RF impedance matching network
- Patent number 12,334,306
- Issue date Jun 17, 2025
- ASM America, Inc.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actively cooled heat-dissipation lids for computer processors and p...
- Patent number 12,324,126
- Issue date Jun 3, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale active thermal interposer for device testing
- Patent number 12,320,841
- Issue date Jun 3, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Encapsulation structure and encapsulation method of power module
- Patent number 12,322,678
- Issue date Jun 3, 2025
- Huawei Technologies Co., Ltd.
- Huibin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for radiative cooling
- Patent number 12,320,596
- Issue date Jun 3, 2025
- The Board of Trustees of the Leland Stanford Junior University
- Aaswath Pattabhi Raman
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Component cooler with spring mechanism
- Patent number 12,324,130
- Issue date Jun 3, 2025
- Advanced Micro Devices, Inc.
- Robert Edward Radke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20250226289
- Publication date Jul 10, 2025
- Mitsubishi Heavy Industries, Ltd.
- Tsutomu KAWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER, COOLING DEVICE, AND SEMICONDUCTOR MODULE
- Publication number 20250218896
- Publication date Jul 3, 2025
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...
- Publication number 20250210429
- Publication date Jun 26, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK
- Publication number 20250201667
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...
- Publication number 20250201651
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE
- Publication number 20250201669
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...
- Publication number 20250194044
- Publication date Jun 12, 2025
- OVH
- Ali CHEHADE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STRUCTURES AND METHODS TO PROVIDE CONNECTIONS ACROSS CHANNELS
- Publication number 20250191999
- Publication date Jun 12, 2025
- Avago Technologies International Sales Pte. Limited
- Jeremy Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...
- Publication number 20250192000
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...
- Publication number 20250192001
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Power Conversion Device
- Publication number 20250192061
- Publication date Jun 12, 2025
- Hitachi Astemo, Ltd.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR MODULE
- Publication number 20250191992
- Publication date Jun 12, 2025
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
- Publication number 20250175060
- Publication date May 29, 2025
- Deere & Company
- BRIJ N. SINGH
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250167674
- Publication date May 22, 2025
- Mitsubishi Heavy Industries, Ltd.
- Takashi MASUZAWA
- H01 - BASIC ELECTRIC ELEMENTS

by flowing liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for power module for inverter for electric vehicle

Embedded cooling systems for advanced device packaging and methods...

Power conversion device and method for manufacturing power conversi...

Cooling apparatus with offset flow paths

Computer system with external bypass air plenum

Power conversion device with board retention member

Jet impingement cooling for high power semiconductor devices

Storage device and cooling system of the storage device with spiral...

Thermal module for a semiconductor package and methods of forming t...

Semiconductor module with external power sensor

Cooling module for providing enhanced localized cooling of a heatsink

Systems and methods for power module for inverter for electric vehicle

Chip cooling package with multiple fluid paths

Electronic device cooling structures bonded to semiconductor elements

Semiconductor device and manufacturing method thereof

Power electrical apparatus comprising two power electronic modules...

Systems and methods for multiple output integrated gate driver for...

Semiconductor module

Component cooler for a computing device

RF impedance matching network

Systems and methods for galvanic isolation for inverter for electri...

3D system integration

Actively cooled heat-dissipation lids for computer processors and p...

Wafer scale active thermal interposer for device testing

Encapsulation structure and encapsulation method of power module

Structures for radiative cooling

Component cooler with spring mechanism

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Patents Applicationslast 30 patents

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

COOLING DEVICE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

HEAT DISSIPATION MEMBER, COOLING DEVICE, AND SEMICONDUCTOR MODULE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK

SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...

SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...

STRUCTURES AND METHODS TO PROVIDE CONNECTIONS ACROSS CHANNELS

JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...

JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SE...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

Semiconductor Module and Power Conversion Device

COOLING DEVICE, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES

PACKAGES FORMED USING RDL-LAST PROCESS

POWER MODULE