The present invention relates generally to microelectromechanical systems (MEMS), and in particular to techniques for fluid delivery in applications involving nanometer-scale operations, such as assays and/or amplification and subsequent modification of DNA in biochips. In addition this invention can be used to remove or add material via chemical, electro-chemical, biochemical, mechanical and electrical methods in small controlled regions down to atomic dimensions of 0.1 nanometer.
Nanometer-scale components find utility in a wide variety of fields, particularly in the fabrication of microelectromechanical systems (MEMS). Typical MEMS include micro-sensors, micro-actuators, micro-instruments, micro-optics, and the like. Nanotechnology refers to broad categories of nanometer-scale manufacturing processes, materials and devices, including, for example, nanometer-scale lithography and nanometer-scale information storage. Many MEMS fabrication processes exist, including, for example surface micromachining techniques. Surface micromachining involves fabrication of microelectromechanical systems from films deposited on the surface of a substrate. For example, a common fabrication process includes depositing thin layers of polysilicon on a sacrificial layer of silicon dioxide formed on a bulk silicon substrate. Controlled removal of the selected portions of the various layers of material can produce useful micro- and nano-scale machine components.
Conventional semiconductor processing typically is performed in vacuum. The nature of the surrounding ambient is important. Often a dry ambient is required to avoid oxidizing and otherwise contaminating the surface of the silicon surface. Presently static conditions, vacuum generation, moisture problems and/or chemical reactivity control is obtained in SPM (scanning probe microscopy) systems and nanomachining centers by the introduction of large quantities of gas (including CDA, clean dry air) at some distance many inches or more away from the probe subject site. These gross-scale manipulations of fluid are at odds with the fine-scale operations required in nanotechnology-based machining systems. To date, no suitable techniques exist to provide for more effective gas and vacuum delivery in the proximity of a site being worked by a nanomachining process.
A micro electromechanical systems (MEMS) device is configured with fluidic channels to perform various tasks, including measuring and nanomachining a workpiece. One or more isotopic regions can be provided to further enhance the measuring function and to enhance nanomachining operations. The isotopic region(s) can provide power to a workpiece.
As can be seen in the enlarged view, a cover seal (or cover layer) f104 can be provided to contain the gas pressure that can be developed at the tip. In one embodiment, the cover seal can be any suitably patterned thin material including adhesive plastic films, silicon cover structure, or diamond film cover structure. These latter materials may be bonded by coating with Titanium, Nickel and Copper layers to make a Copper vacuum furnace bond, or by using conventional low temperature eutectic bonds such as a Ge/Ag, Ge/Au, In/Pt, In/Pa or In/Ag to a similarly coated device layer or other mechanically strong layer sufficient to contain the gas pressures used. This latter cover layer may be disposed so as to reduce the etched gap between the arms and the tip portion of the primary cantilever and in fact may overlap the cantilever end if it is suitably relieved by etching or other means to have clearance similar or identical to the clearance between the back of the primary cantilever and the secondary cantilever or a backing beam.
In
In
The fluid can be withdrawn from the area of the tip using the capillary action within the fluid, the maintenance of wetable surfaces in the channel, and the application of some backpressure on the fluid. Additionally, as shown in
In another embodiment, chemical, optical and/or electrical means may be provided through and/or with the tip to perform measurements at the tip region, or to effect other processes in the region of the tip with or without the benefit of fluid or gas delivered to the tip region. One or more streams of gas and/or fluid delivered to the tip region may also be used to induce reactions or processes suitable to the goals of measurement or process development. Specifically these latter techniques are well suited to be used with biological or chemical cell assemblies, sometimes referred to as biochips, such as those made by Affymetrix. In a biochip, the local region of fluid control and/or tip activity is substantially smaller than the size and volume of the biochip cell.
Furthermore these biochips are commonly caused to fluoresce on the activated DNA sites and the resulting light emission in conjunction with light sensitive tips can be used to locate the actual DNA directly. The DNA can then be removed and moved to another location for further operations. The DNA can be processed on site in the biochip. This light driven location would simply consist of monitoring the light received by the control computer or logic and/or memory and then mapping the region(s) of maximum and minimum light output for operations to be directed subsequently by the operator or a computer and or logic and/or memory based director. Alternately the fluid may be expelled in metered ways from the ends of the gas channel by a pulse pressure.
In still another embodiment, one or more diaphragms (electrostatically, piezoelectrically, or thermally actuated) can be integrated into the cantilever f100 via known MEMS techniques to provide gas flow (such as by applying a vacuum or lower pressure to the channels) or fluid flow through the channels from a source of gas or fluid that is provided to the device. Alternatively, a co-resonant pendulum pump with or without valves (as shown in the views of
Further the fluid or gas may be further shaped and guided by the arrangement shown in
The mechanical constraints are removed when normal or positive pressure is applied to channel(s). By this means, the tip platform may be moved or scanned over the surface or clamped in between the channels alternate means well know in the MEMS art may be used to move the channel arms in x, y and z axis including independent thermal, electrostatic and piezoelectric translation of all or any of the arms. Furthermore, the channel arms may be arranged to lie over secondary cantilevers (which are described in more detail in one or more of the above-referenced applications) such that these cantilevers do not extend to the area of the primary cantilever. Instead, when the movable arms are used to clamp the primary cantilever the whole clamped assembly is free to move back until each clamp arm of the assembly encounters a secondary cantilever with a corresponding increase in spring constant from these structures. Furthermore when driven independently, the instant of electrical contact of any given arm with the structure to be clamped can be sensed and used by an external controller or analog circuit to control the clamping force and motion of the arm so that a given displacement of the clamped structure can be obtained (including zero displacement). The motion of the arms can also be sensed by conventional piezoelectric and piezoresistive methods.
Furthermore as shown above in
Finally, in either embodiment shown in
Another embodiment is to use Americium 241 which is commonly used in smoke detectors as the isotopic source of alpha particles. These emitters will form ions in the gas flowing around them which can then be used to charge or neutralize charge around the tip area where measurement or surface modification is taking place. The gas flow rate determines the charge transfer rate out of the channels. The gas flow can be monitored by conventional measuring by techniques the charge across the channel through connections. This aspect of the invention is shown in
A further embodiment of the nuclear emitter is shown in
The diode and capacitor may be integrally formed on the silicon MEMS device. In this way, a quantity of current is available for any general use by making a connection to the conductor that connects f304a and f305a. Many nanogenerator regions may be made and integrated on one device such that under normal circumstances no local concentration of isotopic material will exceed the legally accepted microcurie concentration per unit area of the device. Furthermore the intrinsic diode may be spaced away from the radiation source by a hard vacuum and an internal thin metal diaphragm which may be released by the passage of current through one of its support arms allowing the other support bar to roll it up and out of the way of the radiation source. By the latter means the generator diode can be protected from radiation damage while in storage and the storage life can be extended to hundreds of years.
In another embodiment, the intrinsic diamond layer may be grown or mechanically contacted against a doped SiC (silicon carbide) crystal with a boron doped diamond layer (either random or aligned biased grown) grown on the other side of the intrinsic diamond away from the SiC. An additional embodiment includes a conductor followed by an intrinsic SiC layer grown on top of a doped SiC layer. In this and the former embodiments, these structures may also be used as radiation detectors for forms of radiation which give rise to detectable electronic or optical changes in the layered diode structure.
Yet another embodiment of the above elements includes the provision for active mechanical and/or electrical actuation of the gas/fluid channels (see above and the drawings of
In operation if the tip platform is pressed back to the secondary cantilevers or support beam and the fluid channel is flexed in the channel cams and locks the platform against the secondary cantilevers or beam. If on the other hand the tip platform is not pressed back, then the edges of the fluid channel wedge under the tip platform and separate it positively from the secondary cantilevers or beam. In operation, this design may include two paddles on long cantilevers within the handle layer rear fluid channels. These respond to long wavelength modulation of a typical AFM acoustic tip drive to move up and down perpendicular to the plane of the cantilever assembly and in conjunction with the check valves and/or openings depending from the front cover and from the handle cavities to the two fluid arms act to pump surrounding gas or fluid through the channels over the tip and subject area. The quantity of fluid or ionized gas can be controlled by a software module which allows the operator to change the duty cycle of the long wave acoustic excitation.
This application is a continuation of U.S. patent application Ser. No. 13/079,741, filed Apr. 4, 2011, which is a continuation of U.S. application Ser. No. 12/399,165, filed Mar. 6, 2009, now U.S. Pat. No. 7,930,766,which is a continuation of U.S. application Ser. No. 11/244,312, filed Oct. 4, 2005, now U.S. Pat. No. 7,503,206,which is a divisional of U.S. application Ser. No. 10/659,737, filed Sep. 9, 2003, now U.S. Pat. No. 6,998,689,which claims priority from U.S. Provisional Application No. 60/409,403, filed Sep. 9, 2002 and from U.S. Provision Application No. 60/433,242, filed Dec. 12, 2002, all the disclosures of which are hereby incorporated by reference in their entirety for all purposes. This application is related to U.S. patent applications: U.S. patent application Ser. No. 10/094,149, filed Mar. 7, 2002, now U.S. Pat. No. 6,802,646;U.S. patent application Ser. No. 10/094,411, filed Mar. 7, 2002;U.S. patent application Ser. No. 10/094,408, filed Mar. 7, 2002, now U.S. Pat. No. 6,923,044;U.S. patent application Ser. No. 10/093,842, filed Mar. 7, 2002; now U.S. Pat. No. 7,196,328;U.S. patent application Ser. No. 10/094,148, filed Mar. 7, 2002, now U.S. Pat. No. 6,752,008; andU.S. patent application Ser. No. 10/228,681, filed Aug. 26, 2002, now U.S. Pat. No. 6,880,388 the disclosures of which are hereby incorporated by reference for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
3586865 | Baker et al. | Jun 1971 | A |
3812288 | Walsh et al. | May 1974 | A |
4115806 | Morton | Sep 1978 | A |
4244783 | Corbett et al. | Jan 1981 | A |
4604520 | Pohl | Aug 1986 | A |
4672559 | Jansson et al. | Jun 1987 | A |
4673477 | Ramalingram et al. | Jun 1987 | A |
RE32457 | Matey | Jul 1987 | E |
4681451 | Guerra et al. | Jul 1987 | A |
4697594 | Mayo, Jr. | Oct 1987 | A |
4793201 | Kanai et al. | Dec 1988 | A |
4831614 | Duerig et al. | May 1989 | A |
4866986 | Cichanski | Sep 1989 | A |
4907195 | Kazan et al. | Mar 1990 | A |
4924091 | Hansma et al. | May 1990 | A |
4954704 | Elings et al. | Sep 1990 | A |
4999495 | Miyata et al. | Mar 1991 | A |
5001344 | Kato et al. | Mar 1991 | A |
5010249 | Nishikawa | Apr 1991 | A |
5015850 | Zdeblick et al. | May 1991 | A |
5018865 | Ferrell et al. | May 1991 | A |
5025346 | Tang et al. | Jun 1991 | A |
5038322 | Van Loenen | Aug 1991 | A |
5043577 | Pohl | Aug 1991 | A |
5047633 | Finlan et al. | Sep 1991 | A |
5047649 | Hodgson et al. | Sep 1991 | A |
5072116 | Kawade et al. | Dec 1991 | A |
5081390 | Elings et al. | Jan 1992 | A |
5105305 | Betzig et al. | Apr 1992 | A |
5107112 | Yanagisawa et al. | Apr 1992 | A |
5108865 | Zwaldo et al. | Apr 1992 | A |
5118541 | Yamamoto et al. | Jun 1992 | A |
5138159 | Takase et al. | Aug 1992 | A |
5142145 | Yasutake | Aug 1992 | A |
5148308 | Miyauchi | Sep 1992 | A |
5155589 | Gere | Oct 1992 | A |
5166520 | Prater et al. | Nov 1992 | A |
5187367 | Miyazaki et al. | Feb 1993 | A |
RE34214 | Carlsson et al. | Apr 1993 | E |
5210410 | Barrett | May 1993 | A |
5216631 | Sliwa | Jun 1993 | A |
5220555 | Yanagisawa et al. | Jun 1993 | A |
5231286 | Kajimura et al. | Jul 1993 | A |
5241527 | Eguchi et al. | Aug 1993 | A |
5249077 | Laronga et al. | Sep 1993 | A |
5252835 | Lieber et al. | Oct 1993 | A |
5253515 | Toda et al. | Oct 1993 | A |
5254209 | Schmidt et al. | Oct 1993 | A |
5254854 | Betzig | Oct 1993 | A |
5260824 | Okada et al. | Nov 1993 | A |
5276672 | Miyazaki et al. | Jan 1994 | A |
5278704 | Matsuda et al. | Jan 1994 | A |
5283437 | Greschner et al. | Feb 1994 | A |
5289004 | Okada et al. | Feb 1994 | A |
5289408 | Mimura et al. | Feb 1994 | A |
5297130 | Tagawa et al. | Mar 1994 | A |
5299184 | Yamano et al. | Mar 1994 | A |
5302239 | Roe et al. | Apr 1994 | A |
5307311 | Sliwa | Apr 1994 | A |
5308974 | Elings et al. | May 1994 | A |
5317152 | Takamatsu et al. | May 1994 | A |
5317533 | Quate et al. | May 1994 | A |
5319961 | Matsuyama et al. | Jun 1994 | A |
5319977 | Quate et al. | Jun 1994 | A |
5322735 | Fridez et al. | Jun 1994 | A |
RE34708 | Hansma et al. | Aug 1994 | E |
5338932 | Theodore et al. | Aug 1994 | A |
5343460 | Miyazaki et al. | Aug 1994 | A |
5349735 | Kawase et al. | Sep 1994 | A |
5353632 | Nakagawa | Oct 1994 | A |
5354985 | Quate | Oct 1994 | A |
5357109 | Kusumoto | Oct 1994 | A |
5357110 | Statham | Oct 1994 | A |
5360977 | Onuki et al. | Nov 1994 | A |
5362963 | Kopelman et al. | Nov 1994 | A |
5373494 | Kawagishi et al. | Dec 1994 | A |
5389475 | Yanagisawa et al. | Feb 1995 | A |
5392275 | Kawada et al. | Feb 1995 | A |
5393647 | Neukermans et al. | Feb 1995 | A |
5396483 | Matsuda et al. | Mar 1995 | A |
5408094 | Kajimura | Apr 1995 | A |
5412641 | Shinjo et al. | May 1995 | A |
5414260 | Takimoto et al. | May 1995 | A |
5414690 | Shido et al. | May 1995 | A |
5416331 | Ichikawa et al. | May 1995 | A |
5418363 | Elings et al. | May 1995 | A |
5426631 | Miyazaki et al. | Jun 1995 | A |
5453970 | Rust et al. | Sep 1995 | A |
5455420 | Ho et al. | Oct 1995 | A |
5461605 | Takimoto et al. | Oct 1995 | A |
5463897 | Prater et al. | Nov 1995 | A |
5471458 | Oguchi et al. | Nov 1995 | A |
5472881 | Beebe et al. | Dec 1995 | A |
5490132 | Yagi et al. | Feb 1996 | A |
5495109 | Lindsay et al. | Feb 1996 | A |
5502306 | Meisburger et al. | Mar 1996 | A |
5506829 | Yagi et al. | Apr 1996 | A |
5510615 | Ho et al. | Apr 1996 | A |
5519686 | Yanagisawa et al. | May 1996 | A |
5548117 | Nakagawa | Aug 1996 | A |
5559328 | Weiss et al. | Sep 1996 | A |
5560244 | Prater et al. | Oct 1996 | A |
5583286 | Matsuyama | Dec 1996 | A |
5602820 | Wickramasinghe et al. | Feb 1997 | A |
5610898 | Takimoto et al. | Mar 1997 | A |
5623476 | Eguchi et al. | Apr 1997 | A |
5634230 | Maurer | Jun 1997 | A |
5644512 | Chernoff et al. | Jul 1997 | A |
5658710 | Neukermans | Aug 1997 | A |
5679952 | Lutwyche et al. | Oct 1997 | A |
5684301 | Cresswell et al. | Nov 1997 | A |
5717680 | Yamano et al. | Feb 1998 | A |
5721721 | Yanagisawa et al. | Feb 1998 | A |
5751683 | Kley | May 1998 | A |
5756997 | Kley | May 1998 | A |
5763879 | Zimmer et al. | Jun 1998 | A |
5804709 | Bourgoin et al. | Sep 1998 | A |
5821410 | Xiang et al. | Oct 1998 | A |
5825670 | Chernoff et al. | Oct 1998 | A |
5865978 | Cohen | Feb 1999 | A |
5874726 | Haydon | Feb 1999 | A |
5883387 | Matsuyama et al. | Mar 1999 | A |
5922214 | Liu et al. | Jul 1999 | A |
6031756 | Gimzewski et al. | Feb 2000 | A |
6066265 | Galvin et al. | May 2000 | A |
6101164 | Kado et al. | Aug 2000 | A |
6144028 | Kley | Nov 2000 | A |
6173604 | Xiang et al. | Jan 2001 | B1 |
6199269 | Greco et al. | Mar 2001 | B1 |
6201226 | Shimada et al. | Mar 2001 | B1 |
6229138 | Kley | May 2001 | B1 |
6229607 | Shirai et al. | May 2001 | B1 |
6229609 | Muramatsu et al. | May 2001 | B1 |
6232597 | Kley | May 2001 | B1 |
6239426 | Muramatsu et al. | May 2001 | B1 |
6242734 | Kley | Jun 2001 | B1 |
6249747 | Binnig et al. | Jun 2001 | B1 |
6252226 | Kley | Jun 2001 | B1 |
6265711 | Kley | Jul 2001 | B1 |
6281491 | Kley | Aug 2001 | B1 |
6287765 | Cubicciotti | Sep 2001 | B1 |
6337479 | Kley | Jan 2002 | B1 |
6339217 | Kley | Jan 2002 | B1 |
6340813 | Tominaga et al. | Jan 2002 | B1 |
6353219 | Kley | Mar 2002 | B1 |
6369379 | Kley | Apr 2002 | B1 |
6396054 | Kley | May 2002 | B1 |
6507553 | Kley | Jan 2003 | B2 |
6515277 | Kley | Feb 2003 | B1 |
6517249 | Doll | Feb 2003 | B1 |
6573369 | Henderson et al. | Jun 2003 | B2 |
6614227 | Ookubo | Sep 2003 | B2 |
6724712 | Kley | Apr 2004 | B2 |
6737331 | Lewis et al. | May 2004 | B1 |
6752008 | Kley | Jun 2004 | B1 |
6787768 | Kley et al. | Sep 2004 | B1 |
6802646 | Kley | Oct 2004 | B1 |
6847036 | Darling et al. | Jan 2005 | B1 |
6861648 | Kley | Mar 2005 | B2 |
6880388 | Kley | Apr 2005 | B1 |
6891239 | Anderson et al. | May 2005 | B2 |
6923044 | Kley | Aug 2005 | B1 |
6998689 | Kley | Feb 2006 | B2 |
7091476 | Kley | Aug 2006 | B2 |
7503206 | Kley | Mar 2009 | B2 |
7930766 | Kley | Apr 2011 | B2 |
20010010668 | Kley | Aug 2001 | A1 |
20020007667 | Pohl et al. | Jan 2002 | A1 |
20020117611 | Kley | Aug 2002 | A1 |
20020135755 | Kley | Sep 2002 | A1 |
20020189330 | Mancevski et al. | Dec 2002 | A1 |
20030012657 | Marr et al. | Jan 2003 | A1 |
20030027354 | Geli | Feb 2003 | A1 |
20030062193 | Thaysen et al. | Apr 2003 | A1 |
20030089182 | Thaysen et al. | May 2003 | A1 |
20030167831 | Kley | Sep 2003 | A1 |
20040118192 | Kley | Jun 2004 | A1 |
20060150721 | Kley | Jul 2006 | A1 |
20100132076 | Kley | May 2010 | A1 |
20120066800 | Kley | Mar 2012 | A1 |
Number | Date | Country |
---|---|---|
325056 | Jul 1989 | EP |
61-133065 | Jun 1986 | JP |
01-262403 | Oct 1989 | JP |
07-105580 | Apr 1995 | JP |
9603641 | Feb 1996 | WO |
9704449 | Feb 1997 | WO |
9834092 | Aug 1998 | WO |
0103157 | Jan 2001 | WO |
03046473 | Jun 2003 | WO |
2004023490 | Mar 2004 | WO |
Entry |
---|
International Search Report for PCT Application No. PCT/US2003/028506 mailed Oct. 13, 2004, 6 pages. |
International Search Report for PCT Application No. PCT/US1998/001528 mailed Aug. 24, 1998, 4 pages. |
Ager et al., “Multilayer Hard Carbon Films with Low Wear Rates,” Surface and Coatings Technology 91(1-2): 91-94 (1997). |
Betzig et al., “Near-Field Optics: Microscopy, Spectroscopy, and Surface Modification Beyond the Diffraction Limit,” Science 257(5067): 189-195 (1992). |
Dai et al., “Nanotubes as Nanoprobes in Scanning Probe Microscopy,” Nature 384(6605): 147-150 (1996). |
Davis, “Deposition, Characterization, and Device Development in Diamond, Silicon Carbide, and Gallium Nitride Thin Films,” Journal of Vacuum Science and Technology A 11(4):829-837 (1993). |
Diaz et al., “An Improved Fabrication Technique for Porous Silicon,” Review of Scientific Instruemtns 64(2): 507-509 (1993). |
Givargizov et al., “Growth of Diamond Particles on Sharpened Silicon Tips,” Materials Letters 18(1-2): 61-63 (1993). |
Gomyou et al., “Effect of Electrochemical Treatments on the Photoluminescence from Porous Silicon,” Journal of the Electrochemical Society 139(9): L86-L88 (1992). |
Jaschke et al., “Deposition of Organic Material by the Tip of a Scanning Force Microscope,” Langmuir 11(4): 1061-1064 (1995). |
Nossarzewska-Orlowska et al., “Photoluminescence Properties of Porous Silicon Prepared by Electrochemical Etching of Si Epitaxial Layer,” Acta Physica Polonica a 84(4): 713-716 (1993). |
Rasmussen et al., “Fabrication of an All-Metal Atomic Force Microscope Probe,” Proceedings of the International Conference on Solid State Sensors and Actuators (Transducers '97) 1:463-466 (1997). |
Rossow et al., “Influence of the Formation Conditions on the Microstructure of Porous Silicon Layers Studied by Spectroscopic Ellipsometry,” Thin Solid Films 255(1-2): 5-8 (1995). |
Smestad et al., “Photovoltaic Response in Electrochemically Prepared Photoluminescent Porous Silicon,” Solar Energy Materials and Solar Cells 26(4): 277-283 (1992). |
Tang, “Electrostatic Comb Drive for Resonant Sensor and Actuator Applications,” abstract of Ph.D. dissertation at the University of California at Berkeley, 1 page (1990). |
Toledo-Crow et al., “Near-Field Differential Scanning Optical Microscope with Atomic Force Regulation,” Applied Physics Letters 60(24): 2957-2959 (1992). |
Van Hulst et al., “Near-Field Optical Microscope Using a Silicon-Nitride Probe,” Applied Physics Letters 62(5): 461-463 (1993). |
Watson et al., “The Radiation Patterns of Dielectric Rods—Experiment Theory,” Journal of Applied Physics 19: 661-670 (1948). |
Restriction Requirement for U.S. Appl. No. 13/079,741 mailed Sep. 18, 2012, 6 pages. |
Non-Final Office Action for U.S. Appl. No. 13/079,741 mailed Nov. 30, 2012, 7 pages. |
Interview Summary for U.S. Appl. No. 12/399,165 mailed Nov. 26, 2010, 1 page. |
Notice of Allowance for U.S. Appl. No. 12/399,165 mailed Nov. 26, 2010, 8 pages. |
Restriction Requirement for U.S. Appl. No. 11/244,312 mailed Jul. 3, 2006, 9 pages. |
Non-Final Office Action for U.S. Appl. No. 11/244,312 mailed Jan. 24, 2007, 5 pages. |
Final Office Action for U.S. Appl. No. 11/244,312 mailed Jun. 9, 2008, 5 pages. |
Notice of Allowance for U.S. Appl. No. 11/244,312 mailed Nov. 6, 2008, 4 pages. |
Non-Final Office Action for U.S. Appl. No. 10/659,737 mailed Jun. 9, 2004, 11 pages. |
Final Office Action for U.S. Appl. No. 10/659,737 mailed Nov. 29, 2004, 5 pages. |
Notice of Allowance for U.S. Appl. No. 10/659,737 mailed Jun. 2, 2005, 6 pages. |
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20140082776 A1 | Mar 2014 | US |
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60433242 | Dec 2002 | US |
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