Immersion cooling racks provide a bath of dielectric fluid in a tank. Computer servers or other electronic equipment may be mounted on immersion cooling racks within the tank. The dielectric fluid may be circulated around computer servers or other electronic equipment as a liquid coolant such that heat generated by the electronic equipment can be rejected from one or more computer servers or other electronic equipment mounted within the tank. While the flow of the dielectric fluid in and around the heat-generating electronic equipment immersed in the tank helps remove heat from the electronic equipment generally, providing adequate localized cooling to some of the most intensive heat-generating elements of the electronic equipment, such as CPUs and GPUs, remains challenging.
Various aspects include devices, systems, and methods for controlling how delivered dielectric fluid is directed toward electronic equipment immersed in an immersion coolant tank. The devices and systems may include a fluid delivery wand configured to selectively direct dielectric fluid toward the electronic equipment. The fluid delivery wand may include a coolant conduit and an aperture cover. The coolant conduit may extend from a support base of the immersion coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid, wherein the coolant conduit includes at least one conduit aperture extending through a sidewall of the coolant conduit. The aperture cover may be in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively restrict flow of dielectric fluid through the at least one conduit aperture by sliding along the outer surface of the outer of the sidewall.
In some embodiments, the aperture cover may include at least one release aperture, wherein alignment of the at least one release aperture with the at least one conduit aperture enables dielectric fluid to flow through the at least one conduit aperture. By sliding along the outer surface of the sidewall, the aperture cover may be configured to move between at least a first position and a second position, wherein the first position enables a greater flow of dielectric fluid through the at least one conduit aperture than the second position. The movement between at least the first position and the second position may include a linear movement of the aperture cover extending parallel to a longitudinal axis of the coolant conduit. The movement between at least the first position and the second position may include a rotational movement of the aperture cover around a longitudinal axis of the coolant conduit.
In some embodiments, by sliding along the outer surface of the sidewall, the aperture cover may be configured to move between at least a fully open position, a semi-open position, and a closed position, wherein the fully open position enables a greater flow of dielectric fluid through the at least one conduit aperture than the semi-open position and the closed position prevents flow of dielectric fluid through the at least one conduit aperture.
In some embodiments, the at least one conduit aperture may include a plurality of conduit apertures spaced along a longitudinal axis of the coolant conduit. The fluid delivery device may further include an actuator attached to the support base, wherein the actuator may be configured to control a sliding movement of the aperture cover relative to the coolant conduit. The fluid delivery device may further include a base bracket forming an enclosure with two opposed walls on opposite sides of the coolant conduit. The two opposed walls may be configured to together receive a component of the electronic equipment seated thereon. The two opposed walls may extend parallel to a longitudinal axis of the coolant conduit.
In some embodiments, the aperture cover may be formed as a conduit sleeve that surrounds a circumference of the coolant conduit. Selectively directing dielectric fluid toward the electronic equipment may comprise directing the dielectric fluid toward an inlet face of an enclosure or chassis of the electronic equipment.
Various aspects may include a method of delivering fluid to an electronic equipment immersed in an immersion coolant tank. The method may include directing dielectric fluid to flow toward electronic equipment from at least one conduit aperture in a coolant conduit disposed within an immersion coolant tank. In addition, the coolant conduit may include a lumen configured to receive the dielectric fluid. Also, the least one conduit aperture may extend through a sidewall of the coolant conduit. The method may also include sliding an aperture cover along an outer surface of the sidewall of the coolant conduit. Sliding the aperture cover may control a flow of the dielectric fluid through the at least one conduit aperture.
In some embodiments, directing the dielectric fluid to flow from the at least one conduit aperture may include directing the dielectric fluid to flow from a plurality of conduit apertures spaced along a longitudinal axis of the coolant conduit. In some embodiments, directing the dielectric fluid to flow toward the electronic equipment may comprise directing the dielectric fluid toward an inlet face of an enclosure or chassis of the electronic equipment.
In some embodiments, sliding the aperture cover from at least a first position to a second position may enable a greater flow of dielectric fluid through the at least one conduit aperture. In some embodiments, sliding from at least the first position to the second position may include a linear movement of the aperture cover extending parallel to a longitudinal axis of the coolant conduit. In some embodiments, sliding from at least the first position to the second position may include a rotational movement of the aperture cover around a longitudinal axis of the coolant conduit. In some embodiments, sliding the aperture cover along the outer surface of the sidewall may move the aperture cover to one of a fully open position, a semi-open position, and a closed position. The fully open position may enable a greater flow of dielectric fluid through the at least one conduit aperture than the semi-open position and the closed position may prevent flow of dielectric fluid through the at least one conduit aperture.
In some embodiments, the method may additionally include activating an actuator. Sliding the aperture cover along the outer surface of the sidewall of the coolant conduit may be controlled by the actuator.
The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate exemplary embodiments of the claims and together with the general description given above and the detailed description given below, serve to explain the features of the claims.
Various embodiments will be described in detail with reference to the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. References made to particular examples and implementations are for illustrative purposes and are not intended to limit the scope of the claims.
Various embodiments enhance and direct flow rates to specific elements of electronic equipment within an immersion coolant tank and include techniques and devices that will help facilitate significant power handling increases in that equipment. Localized enhanced flow rates of dielectric fluid may improve performance of electronic equipment within the immersion coolant tank.
Certain components of electronic equipment, such as a server, namely the central processing unit (CPU), may benefit from additional cooling as compared to other components within the immersion coolant tank. This may be due to the CPU being the most intensive heat generating element. For example, cooling the internal spaces of a rack unit in a server rack may be challenging. However, sizing the entire fluid circulation system around providing adequate flow across the CPU or each rack unit for cooling purposes is generally impractical. Thus, various embodiments include a fluid delivery wand to promote additional and/or directed flow to particular electronic components, such as a server, rack unit, CPU, and/or other similar components. In particular, various embodiments may include fluid delivery wand that is configured to control and direct coolant flow into specific server “U” spaces within the coolant tank, rather than merely directing flow to specific components. Some U spaces may be empty and therefor need no flow, but other U spaces may have moderate power servers and need moderate flow, while others may have higher power servers needing even more flow.
Various embodiments disclosed herein include a fluid delivery wand for electronic equipment located within an immersion coolant tank. The fluid delivery wand may include a coolant conduit extending from a support base of a dielectric coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid emitted from the support base. Also, the coolant conduit may include at least one conduit aperture extending through a sidewall of the coolant conduit. The fluid delivery want may also include an aperture cover in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively increase or restrict the flow of dielectric fluid through the at least one conduit aperture by sliding along an outer surface of the outer of the sidewall.
The immersion coolant tank 10 may be fabricated to have an inlet port 15 for receiving cooled liquid coolant (e.g., cooled dielectric fluid). The cooled liquid coolant may be supplied through a piping system connected to a heat exchanger that outputs a flow of lower temperature or cooled liquid coolant to the immersion coolant tank 20. The inlet port 15 may open into an internal supply conduit 17 within the immersion coolant tank 10. For example, the internal supply conduit 17 may direct dielectric fluid from the inlet port 15 to a fluid delivery device, such as fluid delivery wands 100, 101 shown in
The immersion coolant tank 20 may be sized and shaped according to the all the electronic components it is designed to hold. For example, the immersion coolant tank 20 may include front, back, left, and right walls 22, 24, 26, 28 that together with a tank floor 21 form a liquid-tight internal chamber 25 configured to hold both dielectric fluid and various components of electronic equipment 30. The immersion coolant tank 20 may be open on top. Although the immersion coolant tank 20 is depicted as a generally rectangular box, other shapes may be used as appropriate for the equipment being held and the location in which the immersion coolant tank 20 is located.
The configuration of electronic equipment within the immersion coolant tank 20 may have a number of different implementations. Preferably, mounting members are configured to receive multiple pieces of electronic equipment 30 (e.g., server blades) in a vertical orientation, thereby minimizing the footprint of the multiple pieces of electronic equipment 30 (e.g., servers) relative to the ground, and with a so-called “front” panel of the electronic equipment 30 facing upward for easy installation, removal, and manipulation from the immersion coolant tank 20 without the need to drain the dielectric fluid and/or remove or disturb any other component within the immersion coolant tank 20.
The mounting members may also be configured to mount each of the multiple pieces of electronic equipment 30 (e.g., server blades) such that the top level of the dielectric fluid completely submerges the front panel (i.e., the top) of the electronic equipment 30. Alternatively, the front panel of the electronic equipment 30 may lie just above the top surface level of the dielectric liquid for visual or physical access to controls, indicators, or another element thereon. As a consequence, a volume of liquid coolant (i.e., dielectric fluid) may surround and circulate about the multiple pieces of the electronic equipment 30.
As shown in
The base brackets 150 may be fixedly secured to the tank floor 21. In accordance with various embodiments, each of the base brackets 150 may house a fluid delivery wand 100, 101 therein. The base brackets 150 may each form an enclosure with two opposed walls 152, 154 on opposite sides of the fluid delivery wand 100, 101. The two opposed walls 152, 154 may extend parallel to the fluid delivery wand 100, 101 enclosed there between. Also, the two opposed walls 152, 154 may extend from the front wall 22 to the rear wall 24, thereby defining an inner chamber bounded by the tank floor 21, the two opposed walls 152, 154, and two of the tank walls 22, 24 (and a component of the electronic equipment 30 subsequently seated thereon). In some embodiments, a rear end of each of the base brackets 150, or at least the two opposed walls 152, 154 thereof, may be formed with cutouts 156, 158 configured to butt up against and/or mate with a portion of the internal supply conduit 17. The internal supply conduit 17 may include inwardly facing delivery ports in locations coincident with an open rear end of the base brackets 150. In this way, the inwardly facing deliver ports may each face into the inner chamber of separate base brackets 150. Also, a rear end of each of the fluid delivery wands 100, 101 may be coupled to the inwardly facing delivery ports for receiving freshly cooled dielectric fluid from the internal supply conduit 17. Thus, rather than having the freshly cooled dielectric fluid flowing generally into the inner chamber of the base brackets 150, the dielectric fluid may be directed specifically into the fluid delivery wands 100, 101, which may then direct and control the flow of dielectric fluid therefrom.
The base brackets 150 may have an open top side, which is configured to receive the component of the electronic equipment 30 thereon. In particular, the two opposed walls 152, 154 may be configured to together receive the component of the electronic equipment 30 seated on upper edges thereof. In addition, the open top may be sized such that when a component of electronic equipment 30 is mounted thereon, the inner chamber of the base bracket 150 is substantially enclosed (i.e., closed off).
The coolant conduit 110 may extend between a support base 140 and the supply conduit 17. Thus, a front end 113 of the coolant conduit 110 may be supported by the support base 140, while a rear end 111 of the coolant conduit 110 may be supported by an inwardly facing delivery port of the supply conduit 17. Both the support base 140 and the portion of the supply conduit 17 holding the coolant conduit 110 may be firmly secured to the tank floor (e.g., 21) and/or walls (e.g., 22, 24). In this way, the coolant conduit 110 may extend from the support base 140 to the supply conduit 17, traversing a bottom of the immersion coolant tank 20 from front to back. The coolant conduit 110 may include a lumen 125, at least one conduit aperture 112, 114, an opening at the rear end 111, and a closed-off front end connected to the support base 140. The lumen 125 may extend from the opening at the rear end 111 to the front end of the coolant conduit 110 or at least to the frontmost conduit aperture. The at least one conduit aperture 112, 114 may extend through a sidewall of the coolant conduit 110. In this way, the coolant conduit 110 may be configured to receive, at the rear end 110, dielectric fluid emitted from the supply conduit 17 (e.g., from one of the inwardly facing delivery ports). Once in the lumen 125, the dielectric fluid may then exit through the at least one aperture 112, 114, unless blocked or restricted by the aperture cover 120. In some embodiments, the coolant conduit 110 and/or lumen 125 may be movably affixed (e.g., with an accordion fitting that may move in a linear direction) to the supply conduit 17.
In various embodiments, the at least one conduit aperture 112, 114 may include a plurality of apertures. For example, the plurality of apertures 112, 114 may be spaced along a longitudinal axis of the coolant conduit 110. As shown in
The aperture cover 120 may be mounted over the coolant conduit 110 to encompass the coolant conduit. The aperture cover 120 may be in sliding engagement with an outer surface of the sidewall of the coolant conduit 110. By sliding along the outer surface of the coolant conduit 110, the aperture cover 120 may be configured to restrict or encourage the flow of dielectric fluid depending upon whether the aperture cover 120 is blocking the at least one aperture 112, 114. For example,
In contrast,
In accordance with various embodiments, the aperture cover 120 may be formed as a conduit sleeve that wraps completely around a circumference of the coolant conduit 110. In this way, the coolant conduit 110 and the aperture cover 120 may be concentric with one another. Alternatively, the aperture cover 120 may not wrap completely around the circular circumference of the coolant conduit 110. For example, the aperture cover 120 may alternatively include a gap or slide that runs the entire length of the aperture cover 120. As yet a further alternative, the aperture cover 120 may be formed as one or more panels sized to only cover the at least one conduit aperture 112, 114 and not much more. In embodiments in which the aperture cover 120 may be formed as one or more panels, the aperture cover 120 may remain moveably attached to the coolant conduit 110 through a rail or pair of guide tracks configured to hold the one or more panels and guide their movement.
The linearly controlled fluid delivery wand 100 may be configured to selectively move the aperture cover 120 relative to the coolant conduit 100 in order to move from/to the open position, the closed position, and other positions therebetween. For example, from the open position illustrated in
In various embodiments, the aperture cover 120 may include at least one release aperture 122, 124. The size and shape of the at least one release aperture 122, 124 may match or be slightly larger than the at least one conduit aperture 112, 114. Thus, complete alignment of the at least one release aperture 122, 124 with the at least one conduit aperture 112, 114 may enable maximum dielectric fluid to flow through the at least one conduit aperture 112, 114. In operation, either the coolant conduit 100 may be moved in relation to the aperture cover 120 or vice versa such that there is partial alignment of the at least one release aperture 122, 124 with the at least one conduit aperture 112, 114 to provide a variable amount of dielectric fluid to flow through the at least one conduit aperture 112, 114.
In various embodiment, the at least one release aperture 122, 124 may include a plurality of apertures. For example, the plurality of release apertures may be spaced along a longitudinal axis of the aperture cover 120 spacing configured to align the release apertures with the at least one conduit aperture 112, 114 in one or more positions. As shown in
In some embodiments, the length of linear movement may be limited such that all of the at least one conduit aperture 112, 114 may be fully obstructed. For example, moving less than all the way to the closed position (e.g.,
The linear movement of the linearly controlled fluid delivery wand 100 may be regulated using an actuator, such as one contained within the support base 140. An external power source and control circuit may provide the energy and control signals, respectively, to power and control the actuator. For example, a demand control algorithm executed by the control circuit may use metered power, measured from a component of electronic equipment 30 being cooled by that particular fluid delivery wand or information such as CPU silicon (die) temperature as process variables to dynamically control a position of the aperture cover 120 and regulate flow. The algorithm(s) may use open loop or closed loop methods. The actuator may be any device that may induce movement, such as a conventional electric motor (e.g., a stepper or servo motor), which generates rotary or direct linear movement. Alternatively, the actuator may be a linear motor, which in instead of producing rotational movement, provides a linear force along a length or alternately a piezoelectric actuator that directly creates discrete linear steps. The actuator may move either the aperture cover 120 and/or coolant conduit 110 in a continuous manner (i.e., analog fashion) or to predetermined positions (i.e., digital fashion). The aperture cover 120 may also be controlled in simple on-off motion by means of solenoid coil that creates linear motion of a ferromagnetic plunger surrounded by the solenoid coil. The ferromagnetic plunger may be directly coupled or coupled via linkage mechanically to the aperture cover, so that motion of the solenoid plunger may be translated into motion of the aperture cover 120.
In
In
In
The size, shape, and position of the fluid apertures may have a pronounced effect on the distribution of dielectric fluid flow. Although rectangular/square and circular apertures have been illustrated, it should be understood that alternatively the apertures may have a different shape, such as oval, triangular, tear-shaped, or other less traditional geometric shapes.
In
In
In
Alternatively, the coolant conduit 710 may be configured to rotate relative to the aperture cover 720 that remains stationery. In this way, the relative movements between the coolant conduit 710 and the aperture cover 720 may be similar, but the coolant conduit 710 is the element actually rotating. As yet a further alternative, both the coolant conduit 710 and the aperture cover 720 may be configured to rotate together in order to change a radial direction of the fluid flow from the apertures 112 and the release apertures 122. For example, rather than directing the fluid flow vertically, rotation of the coolant conduit 710 and the aperture cover 720 together may tilt the direction of the fluid flow as desired.
The coolant conduit 710 may extend between a support base 141 and the supply conduit 17. Thus, a front end 713 of the coolant conduit 710 may be supported by the support base 141, while a rear end 711 of the coolant conduit 710 may be supported by an inwardly facing delivery port of the supply conduit 17. Both the support base 141 and the portion of the supply conduit 17 holding the coolant conduit 710 may be firmly secured to the tank floor (e.g., 21) and/or walls (e.g., 22, 24). In this way, the coolant conduit 710 may extend from the support base 141 to the supply conduit 17, traversing a bottom of the immersion coolant tank 20 from front to back. While the embodiments of
The coolant conduit 710 may be similar to the coolant conduit 110 described above, including any one or more aspects of the embodiments related thereto. For example, the coolant conduit 710 may include a lumen, conduit apertures 112, an opening at the rear end 711, and a closed-off front end connected to the support base 141. In this way, the coolant conduit 710 may be configured to receive, through the opening at the rear end 710, dielectric fluid emitted from the supply conduit 17 (e.g., from one of the inwardly facing delivery ports). Once in the lumen, the dielectric fluid may then exit through the apertures 112, unless blocked by the aperture cover 720. In accordance with various embodiments, the apertures 112 in the coolant conduit 710 may all be facing in the same direction, aligned in one row. Although the coolant conduit 710 is illustrative with only one size conduit aperture 112, it should be understood that the sizes, shapes, grouping, and position of the conduit apertures may be modified as appropriate.
The aperture cover 720 may be mounted on the coolant conduit 710 and may be in rotational engagement with an outer surface of the sidewall of the coolant conduit 710. By rotating around the outer surface of the coolant conduit 710, the aperture cover 720 may be configured to restrict or encourage the flow of dielectric fluid depending upon whether the aperture cover 720 is blocking the apertures 112. For example,
In contrast,
The rotational movement of the rotationally controlled fluid delivery wand 101 may be regulated using an actuator, such as one contained within the support base 141. The actuator within support base 141 may operate, be powered, and controlled similarly to the actuator in support base 140 described above. However, in contrast to the actuator in support base 140, the actuator in support base 141 may directly apply rotational movement to the aperture cover 720 to control rotational movement around the coolant conduit 710. The actuator may rotate either the aperture cover 120 and/or coolant conduit 110 in a continuous manner (i.e., analog fashion) or to predetermined positions (i.e., digital fashion).
In
In
In
In
With reference to
In block 1120, the method may include sliding an aperture cover (e.g., 120, 520, 620, 720, 920) along an outer surface of the sidewall of the coolant conduit. In addition, sliding the aperture cover may control a flow of the dielectric fluid through the at least one conduit aperture. In some embodiments, sliding the aperture cover from at least a first position to a second position may enable a greater flow of dielectric fluid through the at least one conduit aperture. In such embodiments, sliding the aperture cover from at least the second position to the first position may enable a restricted flow of dielectric fluid through the at least one conduit aperture. In some embodiments, sliding from at least the first position to the second position may include a linear movement of the aperture cover extending parallel to a longitudinal axis of the coolant conduit. In some embodiments, sliding from at least the first position to the second position may include a rotational movement of the aperture cover around a longitudinal axis of the coolant conduit. In some embodiments, sliding the aperture cover along the outer surface of the sidewall may move the aperture cover to one of a fully open position, a semi-open position, and a closed position. The fully open position may enable a greater flow of dielectric fluid through the at least one conduit aperture than the semi-open position and the closed position may prevent flow of dielectric fluid through the at least one conduit aperture.
With reference to
The foregoing descriptions of systems, devices, and methods are provided merely as illustrative examples and are not intended to require or imply that the steps of the various embodiments must be performed in the order presented. As will be appreciated by one of skill in the art the order of steps in the foregoing embodiments may be performed in any order. Words such as “thereafter,” “then,” “next,” etc. are not intended to limit the order of the steps; these words are used to guide the reader through the description of the methods. Further, any reference to claim elements in the singular, for example, using the articles “a,” “an” or “the” is not to be construed as limiting the element to the singular.
The preceding description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the following claims and the principles and novel features disclosed herein.
Number | Name | Date | Kind |
---|---|---|---|
2643282 | Greene | Jun 1953 | A |
3094133 | Treanor | Jun 1963 | A |
3320762 | Murdoch | May 1967 | A |
3406244 | Sevgin | Oct 1968 | A |
3450265 | Kreusch et al. | Jun 1969 | A |
3489207 | Miller | Jan 1970 | A |
3600636 | Petersen | Aug 1971 | A |
3754741 | Whitehurst et al. | Aug 1973 | A |
3858090 | Lehmann | Dec 1974 | A |
4034335 | Harazoe et al. | Jul 1977 | A |
4245668 | Lindstrom | Jan 1981 | A |
4302793 | Rohner | Nov 1981 | A |
4313310 | Kobayashi et al. | Feb 1982 | A |
4399501 | Masselin | Aug 1983 | A |
4460008 | O'Leary et al. | Jul 1984 | A |
4464315 | O'Leary | Aug 1984 | A |
4493010 | Morrison et al. | Jan 1985 | A |
4590538 | Cray, Jr. | May 1986 | A |
4600230 | Ise | Jul 1986 | A |
4648043 | O'Leary | Mar 1987 | A |
4659459 | O'Leary et al. | Apr 1987 | A |
4704658 | Yokouchi et al. | Nov 1987 | A |
4741385 | Bergles et al. | May 1988 | A |
4834257 | Book et al. | May 1989 | A |
5102503 | Silinski et al. | Apr 1992 | A |
5145585 | Coke | Sep 1992 | A |
5260850 | Sherwood et al. | Nov 1993 | A |
5294916 | Bolton et al. | Mar 1994 | A |
5297621 | Taraci et al. | Mar 1994 | A |
5329418 | Tanabe | Jul 1994 | A |
5332494 | Eden et al. | Jul 1994 | A |
5414591 | Kimura et al. | May 1995 | A |
5574627 | Porter | Nov 1996 | A |
5851143 | Hamid | Dec 1998 | A |
5907473 | Przilas et al. | May 1999 | A |
6019167 | Bishop et al. | Feb 2000 | A |
6374627 | Schumacher et al. | Apr 2002 | B1 |
D477617 | Resch | Jul 2003 | S |
6600656 | Mori et al. | Jul 2003 | B1 |
6616851 | Sforza-Heinen et al. | Sep 2003 | B1 |
6621707 | Ishimine et al. | Sep 2003 | B2 |
D483045 | Resch | Dec 2003 | S |
6909606 | Barsun et al. | Jun 2005 | B2 |
7086247 | Campbell et al. | Aug 2006 | B2 |
D530346 | Resch | Oct 2006 | S |
7184269 | Campbell et al. | Feb 2007 | B2 |
7210304 | Nagashima et al. | May 2007 | B2 |
7278273 | Whitted et al. | Oct 2007 | B1 |
7307841 | Berlin et al. | Dec 2007 | B2 |
7318322 | Ota et al. | Jan 2008 | B2 |
7403392 | Attlesey et al. | Jul 2008 | B2 |
7413394 | Risser | Aug 2008 | B2 |
7511959 | Belady et al. | Mar 2009 | B2 |
7511960 | Hillis et al. | Mar 2009 | B2 |
7551971 | Hillis | Jun 2009 | B2 |
7609518 | Hopton et al. | Oct 2009 | B2 |
7686175 | Waisanen | Mar 2010 | B2 |
7724513 | Coglitore et al. | May 2010 | B2 |
7724517 | Attlesey et al. | May 2010 | B2 |
7757506 | Ellsworth, Jr. et al. | Jul 2010 | B2 |
7843298 | Hosokawa et al. | Nov 2010 | B2 |
7854652 | Yates et al. | Dec 2010 | B2 |
7856838 | Hillis et al. | Dec 2010 | B2 |
7905106 | Attlesey | Mar 2011 | B2 |
7911782 | Attlesey et al. | Mar 2011 | B2 |
7911793 | Attlesey | Mar 2011 | B2 |
7934386 | Rummel et al. | May 2011 | B2 |
7961463 | Belady et al. | Jun 2011 | B2 |
7971632 | Eriksen | Jul 2011 | B2 |
7983040 | Campbell et al. | Jul 2011 | B2 |
8009419 | Attlesey et al. | Aug 2011 | B2 |
8047904 | Yates et al. | Nov 2011 | B2 |
8213261 | Imhof et al. | Jul 2012 | B2 |
8295047 | Hamburgen et al. | Oct 2012 | B1 |
8310829 | Monk et al. | Nov 2012 | B2 |
8654529 | Attlesey | Feb 2014 | B2 |
8817465 | Campbell et al. | Aug 2014 | B2 |
8964391 | Campbell | Feb 2015 | B2 |
9042098 | Campbell | May 2015 | B2 |
9049800 | Shelnutt et al. | Jun 2015 | B2 |
D744996 | Keisling et al. | Dec 2015 | S |
9269544 | Koo | Feb 2016 | B2 |
9386727 | Barringer et al. | Jul 2016 | B2 |
9439327 | Sheng | Sep 2016 | B1 |
9504190 | Best | Nov 2016 | B2 |
9664180 | Saavedra | May 2017 | B2 |
9699938 | Shelnutt | Jul 2017 | B2 |
D796654 | Baker et al. | Sep 2017 | S |
9756766 | Best | Sep 2017 | B2 |
D821326 | Kreiner | Jun 2018 | S |
9992914 | Best et al. | Jun 2018 | B2 |
10123463 | Best et al. | Nov 2018 | B2 |
10212849 | Matsumoto | Feb 2019 | B2 |
10306804 | Chester et al. | May 2019 | B2 |
D852936 | Baker et al. | Jul 2019 | S |
10342164 | So et al. | Jul 2019 | B2 |
10405457 | Boyd et al. | Sep 2019 | B2 |
D875206 | Gourgel et al. | Feb 2020 | S |
10743438 | Wakino et al. | Aug 2020 | B2 |
10820446 | Boyd et al. | Oct 2020 | B2 |
11359865 | Stone et al. | Jun 2022 | B2 |
11369041 | Yang | Jun 2022 | B2 |
11516943 | Bilan | Nov 2022 | B2 |
20020014460 | McKay | Feb 2002 | A1 |
20020151799 | Pantages et al. | Oct 2002 | A1 |
20020185262 | Baer | Dec 2002 | A1 |
20020189173 | Staschik | Dec 2002 | A1 |
20030053293 | Beitelmal et al. | Mar 2003 | A1 |
20030127240 | Beckbissinger et al. | Jul 2003 | A1 |
20040008490 | Cheon | Jan 2004 | A1 |
20040013563 | Romer et al. | Jan 2004 | A1 |
20040050491 | Miya et al. | Mar 2004 | A1 |
20040223300 | Fink et al. | Nov 2004 | A1 |
20040246683 | Honsberg-Riedl et al. | Dec 2004 | A1 |
20040254682 | Kast | Dec 2004 | A1 |
20050011839 | Dart et al. | Jan 2005 | A1 |
20050024826 | Bash et al. | Feb 2005 | A1 |
20050052847 | Hamman | Mar 2005 | A1 |
20050083657 | Hamman | Apr 2005 | A1 |
20050111184 | Cliff et al. | May 2005 | A1 |
20050114876 | Atarashi et al. | May 2005 | A1 |
20050152112 | Holmes et al. | Jul 2005 | A1 |
20050259402 | Yasui et al. | Nov 2005 | A1 |
20060026610 | Sasao et al. | Feb 2006 | A1 |
20060064709 | Throckmorton et al. | Mar 2006 | A1 |
20060123436 | Tanaka et al. | Jun 2006 | A1 |
20060135042 | Frost et al. | Jun 2006 | A1 |
20060250755 | Tilton et al. | Nov 2006 | A1 |
20060274501 | Miller | Dec 2006 | A1 |
20070006599 | Kawamura et al. | Jan 2007 | A1 |
20070025081 | Berlin et al. | Feb 2007 | A1 |
20070034360 | Hall | Feb 2007 | A1 |
20070199340 | Knight et al. | Aug 2007 | A1 |
20070213000 | Day | Sep 2007 | A1 |
20070227710 | Belady et al. | Oct 2007 | A1 |
20070267741 | Attlesey et al. | Nov 2007 | A1 |
20080002364 | Campbell et al. | Jan 2008 | A1 |
20080017355 | Attlesey et al. | Jan 2008 | A1 |
20080026509 | Campbell et al. | Jan 2008 | A1 |
20080029250 | Carlson et al. | Feb 2008 | A1 |
20080030945 | Mojaver et al. | Feb 2008 | A1 |
20080055845 | Murakami et al. | Mar 2008 | A1 |
20080158818 | Clidaras et al. | Jul 2008 | A1 |
20080174954 | Vangilder et al. | Jul 2008 | A1 |
20080180908 | Wexler | Jul 2008 | A1 |
20080196868 | Attlesey et al. | Aug 2008 | A1 |
20080196870 | Attlesey et al. | Aug 2008 | A1 |
20080209931 | Stevens | Sep 2008 | A1 |
20080266726 | Murakami et al. | Oct 2008 | A1 |
20080270572 | Belady et al. | Oct 2008 | A1 |
20080273306 | Campbell et al. | Nov 2008 | A1 |
20090168345 | Martini | Jul 2009 | A1 |
20090229194 | Armillas | Sep 2009 | A1 |
20090251860 | Belady et al. | Oct 2009 | A1 |
20090260777 | Attlesey | Oct 2009 | A1 |
20090262455 | Merrow | Oct 2009 | A1 |
20090295167 | Clidaras et al. | Dec 2009 | A1 |
20100027212 | Daunert Armillas | Feb 2010 | A1 |
20100030267 | Winslow et al. | Feb 2010 | A1 |
20100061057 | Dersch et al. | Mar 2010 | A1 |
20100103618 | Campbell et al. | Apr 2010 | A1 |
20100139887 | Slessman | Jun 2010 | A1 |
20100165565 | Hellriegal et al. | Jul 2010 | A1 |
20100226094 | Attlesey et al. | Sep 2010 | A1 |
20100246118 | Attlesey | Sep 2010 | A1 |
20100263885 | Tuma | Oct 2010 | A1 |
20100275441 | Rasmussen et al. | Nov 2010 | A1 |
20100290190 | Chester et al. | Nov 2010 | A1 |
20100302678 | Merrow | Dec 2010 | A1 |
20110075353 | Attlesey et al. | Mar 2011 | A1 |
20110103019 | Campbell et al. | May 2011 | A1 |
20110120885 | Miller et al. | May 2011 | A1 |
20110132579 | Best et al. | Jun 2011 | A1 |
20110134604 | Attlesey | Jun 2011 | A1 |
20110151765 | Chen et al. | Jun 2011 | A1 |
20110157829 | Wormsbecher et al. | Jun 2011 | A1 |
20110240281 | Avery | Oct 2011 | A1 |
20110267775 | Vanderveen et al. | Nov 2011 | A1 |
20120026691 | Campbell et al. | Feb 2012 | A1 |
20120035773 | Stabinski et al. | Feb 2012 | A1 |
20120123595 | Bower, III et al. | May 2012 | A1 |
20120155027 | Broome et al. | Jun 2012 | A1 |
20120171943 | Dunnavant | Jul 2012 | A1 |
20120236487 | Wallace et al. | Sep 2012 | A1 |
20120294737 | Singh et al. | Nov 2012 | A1 |
20120300391 | Keisling et al. | Nov 2012 | A1 |
20130025888 | Eckholm et al. | Jan 2013 | A1 |
20130032217 | Pesek et al. | Feb 2013 | A1 |
20130075066 | Reytblat | Mar 2013 | A1 |
20130105120 | Campbell et al. | May 2013 | A1 |
20130105139 | Campbell et al. | May 2013 | A1 |
20130146273 | Chester et al. | Jun 2013 | A1 |
20140060773 | Wajima | Mar 2014 | A1 |
20140060799 | Eckberg et al. | Mar 2014 | A1 |
20140085817 | Campbell et al. | Mar 2014 | A1 |
20140085821 | Regimbal et al. | Mar 2014 | A1 |
20140109610 | Wulf et al. | Apr 2014 | A1 |
20140211412 | Best | Jul 2014 | A1 |
20140216686 | Shelnutt et al. | Aug 2014 | A1 |
20140218858 | Shelnutt et al. | Aug 2014 | A1 |
20140301037 | Best | Oct 2014 | A1 |
20140307384 | Best | Oct 2014 | A1 |
20140362527 | Best | Dec 2014 | A1 |
20150048950 | Zeighami et al. | Feb 2015 | A1 |
20150062806 | Shelnutt et al. | Mar 2015 | A1 |
20150138723 | Shedd et al. | May 2015 | A1 |
20150181762 | Boyd et al. | Jun 2015 | A1 |
20150195953 | Best | Jul 2015 | A1 |
20150276292 | Son et al. | Oct 2015 | A1 |
20150305209 | Inaba et al. | Oct 2015 | A1 |
20150334880 | Best | Nov 2015 | A1 |
20160234970 | Shelnutt et al. | Aug 2016 | A1 |
20170142868 | Chen et al. | May 2017 | A1 |
20170265328 | Sasaki et al. | Sep 2017 | A1 |
20170303443 | Inano et al. | Oct 2017 | A1 |
20170332514 | Saito | Nov 2017 | A1 |
20180020571 | Saito | Jan 2018 | A1 |
20180020572 | Fujiwara et al. | Jan 2018 | A1 |
20180288906 | Hopton et al. | Oct 2018 | A1 |
20180368281 | Wang et al. | Dec 2018 | A1 |
20190090383 | Tufty et al. | Mar 2019 | A1 |
20190200482 | Boyd et al. | Jun 2019 | A1 |
20190387641 | Aoki et al. | Dec 2019 | A1 |
20200093038 | Enright | Mar 2020 | A1 |
20200323108 | Bilan et al. | Oct 2020 | A1 |
20210368656 | Heydari | Nov 2021 | A1 |
20210382533 | Heydari | Dec 2021 | A1 |
20220220976 | Perevozchikov et al. | Jul 2022 | A1 |
Number | Date | Country |
---|---|---|
2009282170 | Nov 2014 | AU |
101443724 | May 2009 | CN |
109874275 | Jun 2019 | CN |
111240448 | Jun 2020 | CN |
82014500002000 | May 2022 | GB |
2004319628 | Nov 2004 | JP |
2004363308 | Dec 2004 | JP |
2011518395 | Jun 2011 | JP |
2018019038 | Feb 2018 | JP |
2019161201 | Sep 2019 | JP |
2021519978 | Aug 2021 | JP |
2007023130 | Mar 2007 | WO |
2007098078 | Aug 2007 | WO |
2008027931 | Mar 2008 | WO |
2008089322 | Jul 2008 | WO |
2010019517 | Feb 2010 | WO |
2013022805 | Feb 2013 | WO |
2019061721 | Apr 2019 | WO |
2020234600 | Nov 2020 | WO |
Entry |
---|
Applicant-Initiated Interview Summary from U.S. Appl. No. 13/057,881, dated Feb. 25, 2014, 4 pages. |
Applicant-Initiated Interview Summary from U.S. Appl. No. 13/057,881, dated Jul. 1, 2014, 3 pages. |
Applicant-Initiated Interview Summary from U.S. Appl. No. 13/057,881, dated Oct. 9, 2014, 3 pages. |
Bakker A., “Modeling Flow Fields in Stirred Tanks,” Reacting Flows—Lecture 7, 2006, 40 pages. |
Communication pursuant to Article 94(3) EPC for European Patent Application No. 09807136.8, dated Nov. 26, 2018, 13 pages. |
“Disruptive Technologies,” SC|09, Disruptive Technologies Presentations, Retrieved from http://sc09.supercomputing.org/index-pg=disrupttech.html, Nov. 14-20, 2009, 2 pages. |
“Disruptive Technologies,” SC10 Disruptive Technologies, Retrieved from http://sc10.supercomputing.org/index-og=disrupttech.html, Nov. 13-19, 2010, 8 pages. |
Extended European Search Report for European Application No. 09807136.8, dated Jun. 6, 2017, 12 Pages. |
Extended European Search Report for European Application No. 12821634.8, dated Jul. 15, 2015, 6 pages. |
Final Office Action from U.S. Appl. No. 13/057,881, dated Jun. 16, 2015, 30 pages. |
Final Office Action from U.S. Appl. No. 13/057,881, dated Nov. 22, 2013, 13 pages. |
Final Office Action from U.S. Appl. No. 13/057,881, dated Nov. 3, 2014, 23 pages. |
“GRC ICE Immersion Cooling Solutions Brochure,” Retrieved from https://www.grcooling.com/wp-content/uploads/2018/06/GRC_ICE_Product_Brochure.pdf, Jun. 2018, 4 pages. |
“GRC ICEraQ@ Series 10 Launch Event Presentation,” Retrieved from https://digitalinfranetwork.com/videos/655447036-2/, Dec. 27, 2021, 1 page. |
“GRC® Releases the Next Generation of Data Center Liquid Immersion Cooling, Providing Increased Sustainability Capable of Delivering a PUE Yield of 1.03 and a Significant Reduction in Operating Costs,” Retrieved https://www.businesswire.com/news/home/20210518005857/en/GRC%C2%AE-Releases-the-Next-Generation-of-Data-Center-Liquid-Immersion-Cooling-Providing-Increased-Sustainability-Capable-of-Delivering-a-PUE-Yield-of-1.03-and-a-Significant-Reduction-in-Operating-Costs, May 18, 2021, 3 pages. |
“Green Revolution Cooling Named a Disruptive Technology of the Year at SC'10,” Press Release, Nov. 1, 2010, 1 page. |
“Green Revolution Cooling Named Disruptive at SC'09,” Press Release, Aug. 3, 2009, 1 page. |
Hernandez P., “Are Liquid-Cooled Servers Coming to a Data Center Near You?,” CleanTech, Dec. 4, 2009, 2 pages. |
Hernandez P., “Will IT Managers Warm to Liquid-Cooled Servers?,” Green Revolution Cooling, Dec. 8, 2009, 3 pages. |
“ICEraQ 10 Quad Duo-Specification Sheet,” Retrieved from https://www.grcooling.com/wp-content/uploads/2018/06/GRC_Data_Sheet_ICEraQ_Quad-Duo-One.pdf, 2021, 2 pages. |
Intel, “Intel® Core™2 Duo Processor on 65 nm Process for Embedded Applications,” Thermal Design Guide, Aug. 2007, pp. 1, 14, and 21. |
Intel, “Intel® Pentium® 4 Processor on 90 nm Process,” Datasheet, Feb. 2005, pp. 64-65. |
“Intel Xeon Processor E7-4800/8800 v3 Product Families”, May 2015, p. 46 (1 page). |
International Preliminary Report on Patentability, Application No. PCT/US2014/033081, dated Oct. 15, 2015, 7 pages. |
International Preliminary Report on Patentability, Application No. PCT/US2014/037005, dated Nov. 19, 2015, 12 bages. |
International Preliminary Report on Patentability for International Application No. PCT/US2009/053305, dated Feb. 24, 2011, 19 pages. |
International Preliminary Report on Patentability for International Application No. PCT/US2015/030618, dated Nov. 24, 2016, 10 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2009/053305, dated Oct. 14, 2009, 17 pages. |
International Search Report and Written Opinion for International Application No. PCT/US20115/030618, dated Aug. 5, 2015, 12 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2012/049668, dated Oct. 19, 2012, 10 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2014/017835, dated Jun. 13, 2014, 9 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2014/033081, dated Aug. 27, 2014, 9 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2014/033834, dated Sep. 15, 2014, 16 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2014/037005, dated Sep. 24, 2014, 18 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2015/43468, dated Oct. 30, 2015, 11 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2021/058991, dated Mar. 3, 2022, 10 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2022/043817, dated Jan. 10, 2023, 10 pages. |
Lee S.Y., “Hydraulics and Mixing Evaluations for NT-21/41 Tanks,” Revision 0, Oct. 2014, 32 pages. |
Markoff J., “Data Centers' Power Use Less Than Was Expected,” The New York Times, Jul. 31, 2011, 3 pages. |
Miller R, “Data Center Used to Heat Swimming Pool,” Data Center Knowledge, Retrieved from https://www.datacenterknowledge.com/archives/2008/04/02/data-center-used-to-heat-swimming-pool, Apr. 2, 2008, 2 pages. |
Non-Final Office Action in U.S. Appl. No. 14/667,091, dated May 22, 2015, 30 pages. |
Non-final Office Action, U.S. Appl. No. 14/237,100, dated Sep. 30, 2015, 21 pages. |
Non-final Office Action, U.S. Appl. No. 14/245,978, dated Jan. 13, 2016, 11 pages. |
Non-final Office Action, U.S. Appl. No. 14/251,014, dated Dec. 4, 2015, 13 pages. |
Non-final Office Action, U.S. Appl. No. 14/271,386, dated Dec. 17, 2015, 17 pages. |
Notice of Acceptance for Australian Application No. 2009282170, dated Nov. 14, 2014, 2 pages. |
Office Action and Search Report for Chinese Application No. 200980131707.3, dated Dec. 20, 2012, 17 pages. |
Office Action for Canadian Application No. 2731994, dated Dec. 3, 2015, 6 pages. |
Office Action for Canadian Application No. 2731994, dated Nov. 8, 2016, 4 pages. |
Office Action for Chinese Application No. 200980131707.3, dated Apr. 18, 2014, 7 pages. |
International Search Report and Written Opinion for International Application No. PCT/US2023/016342, dated Jul. 13, 2023, 8 pages. |
Office Action for Chinese Application No. 200980131707.3, dated Dec. 31, 2014, 10 pages. |
Office Action for Chinese Application No. 200980131707.3, dated Jul. 31, 2013, 8 pages. |
Office Action for Chinese Application No. 201280049039.1, dated Oct. 27, 2015, 33 pages. |
Office Action from U.S. Appl. No. 13/057,881, dated Apr. 11, 2014, 16 pages. |
Office Action from U.S. Appl. No. 13/057,881, dated Jan. 9, 2015, 3 pages. |
Office Action from U.S. Appl. No. 13/057,881, dated Jun. 4, 2013, 13 pages. |
Office Action from U.S. Appl. No. 13/057,881, dated Mar. 3, 2015, 20 pages. |
Park J, “New Cooling Strategies for Greater Data Center Energy Efficiency,” Facebook, Nov. 4, 2010, 4 pages. |
Patent Examination Report No. 2 for Australian Application No. 2009282170, dated Jun. 18, 2014, 4 pages. |
Patent Examination Report No. 2 for Australian Application No. 2009282170, dated Nov. 15, 2013, 4 pages. |
Substantive Examination Adverse Report for Malaysian Application No. PI2011000494, dated May 15, 2015, 3 pages. |
Supplementary Examination Report for Singapore Application No. 11202000306X, dated Nov. 18, 2022, 4 pages. |
“The Green500 List—Nov. 2013,” The Green 500, Nov. 20, 2013, 3 pages. |
U.S. Appl. No. 13/057,881, filed Feb. 7, 2011, Christiaan Scott Best, 72 pages. |
U.S. Appl. No. 14/338,013, filed Jul. 22, 2014, Christiaan Scott Best, 60 pages. |
U.S. Appl. No. 14/338,020, filed Jul. 22, 2014, Christiaan Scott Best, 60 pages. |
U.S. Appl. No. 14/338,026, filed Jul. 22, 2014, Christiaan Scott Best, 60 pages. |
U.S. Appl. No. 14/338,035, filed Jul. 22, 2014, Christiaan Scott Best, 60 pages. |
U.S. Appl. No. 14/667,091, filed Mar. 24, 2015, Christiaan Scott Best, 65 pages. |
Written Opinion and Search Report for Singapore Application No. 201100595-6, dated Apr. 16, 2012, 20 pages. |
Written Opinion and Search Report for Singapore Application No. 201100595-6, dated May 2, 2012, 21 pages. |
International Search Report and Written Opinion in PCT/US2023/032438, dated Dec. 27, 2023, 9 pages. |
Number | Date | Country | |
---|---|---|---|
20230302469 A1 | Sep 2023 | US |