Semiconductor manufacturing processes utilize a variety of different types of process gases that must be delivered with precise timing and in precise quantities and/or at precise delivery rates. In some cases, a semiconductor processing tool may utilize ten or more process gases, e.g., 14 different process gases, each of which must have its own separate control hardware. This collection of control hardware, which may include valves, mass flow controllers (MFCs), tubing, fittings, etc., is typically housed in a “gas box,” which is a cabinet or other structure that is typically mounted to the semiconductor processing tool (or in another location nearby).
In one embodiment, an apparatus may be provided. The apparatus may include a first hub that may have a plurality of first ports arranged about a first axis, a first mixing chamber offset from one of the first ports in a direction parallel to the first axis by a first distance, and a plurality of first flow paths. Each of the first flow paths may fluidically connect a corresponding one of the first ports to the first mixing chamber and each first flow path may include a first passage, a second passage, and a first valve interface. For each first flow path, the first passage may fluidically connect the corresponding first port with the first valve interface, the second passage may fluidically connect the first valve interface with the first mixing chamber, the first valve interface may be fluidically interposed between the first passage and the second passage, each first valve interface may be configured to interface with a first valve such that the first valve, when installed, is able to regulate fluid flow between the first passage and the second passage, and the first valve interface may be located between a first reference plane that is perpendicular to the first axis and passes through the corresponding first port and a second reference plane that is perpendicular to the first axis and passes through the first mixing chamber.
In some embodiments, the first ports may be arranged in a first radial pattern around the first axis.
In some embodiments, the first hub may also include at least three first ports and three first flow paths
In some embodiments, the first mixing chamber may be hemispherical in shape.
In one such embodiment, each first valve interface may include a valve mounting feature, such as a threaded bore or a pattern of threaded holes.
In further such embodiments, the threaded bore or threaded holes may have a center axis or center axes that are within 10° of perpendicular to the first axis.
In some embodiments, the apparatus may further include one or more first surfaces and one or more second surfaces. Each first port may be located on one of the one or more first surfaces, each second surface may be substantially perpendicular to the first surface, and/or each first valve interface may extend through one of the one or more second surfaces.
In some embodiments, the apparatus may also include a first outflow pipe that may be fluidically connected to the first mixing chamber.
In one such embodiment, the first hub may also include first mounting features that may be configured to mount a plurality of first fluid flow components to the first hub such that each first fluid flow component is fluidically connected with a corresponding one of the first flow paths via one of the first ports.
In further such embodiments, the first mounting features and the first valve interfaces of the first hub may be configured such that when one of the first valves is interfaced with one of the first valve interfaces and one of the first fluid flow components is mounted to the first hub using the first mounting features such that the first valve and the first fluid flow component fluidically interface with a corresponding one of the first flow paths, the first fluid flow component and the first valve overlap, at least in part, when viewed from a direction parallel to the first axis.
In further such embodiments, the apparatus may further include a plurality of first fluid flow components and a plurality of first valves. Each first fluid flow component may be mounted to the first hub using the first mounting features such that each first fluid flow component is fluidically connected with a corresponding one of the first ports, and each first valve may be interfaced with a corresponding one of the first valve interfaces.
In one such embodiment, the first passages may be at a first oblique angle off the first reference plane and the second passages may be at a second oblique angle off the first reference plane.
In further such embodiments, the absolute value of the difference between the first oblique angle and the second oblique angle may be 20° or less.
In some embodiments, the apparatus may also include a third surface which may be offset from one of the first ports in a direction parallel to the first axis by a first distance. The first mixing chamber may also extend through the third surface and the third surface may be configured to fluidically connect the first mixing chamber with a first mixing chamber of another hub.
In one such embodiment, the apparatus may further include a second hub that may have a plurality of second ports arranged about a second axis, a second mixing chamber offset from one of the second ports in a direction parallel to the second axis by a second distance, and a plurality of second flow paths. Each of the second flow paths may fluidically connect a corresponding one of the second ports to the second mixing chamber and each second flow path and may include a third passage, a fourth passage, and a second valve interface. For each second flow path, the third passage may fluidically connect the corresponding second port with the second valve interface, the fourth passage may fluidically connect the second valve interface with the second mixing chamber, the second valve interface may be fluidically interposed between the third passage and the fourth passage, each second valve interface may be configured to interface with a second valve such that the second valve, when installed, is able to regulate fluid flow between the third passage to the fourth passage, and the second valve interface may be located between a third reference plane that is perpendicular to the second axis and passes through the corresponding second port, and a fourth reference plane that is perpendicular to the second axis and passes through the second mixing chamber. An outflow pipe may further be included and may fluidically connect to an item such as the first mixing chamber or the second mixing chamber. The first hub and the second hub may also be assembled together such that the first mixing chamber is fluidically connected to the second mixing chamber.
In further such embodiments, the apparatus may further include a plate that may be sandwiched between the first hub and the second hub when the first hub and the second hub are assembled together.
In further such embodiments, the first hub may further include first mounting features that may be configured to mount a plurality of first fluid flow components to the first hub such that each first fluid flow component is fluidically connected with a corresponding one of the first ports, and the second hub may further include second mounting features that may be configured to mount a plurality of second fluid flow components to the second hub such that each second fluid flow component is fluidically connected with a corresponding one of the second ports.
In one further such embodiment, the first mounting features and the first valve interfaces may be configured such that when one of the first valves is interfaced with one of the first valve interfaces and one of the first fluid flow components is mounted to the first hub using the first mounting features such that the first valve and the first fluid flow component fluidically interface with a corresponding one of the first flow paths, the first fluid flow component and the first valve overlap, at least in part, when viewed from a direction parallel to the first axis, and the second mounting features and the second valve interfaces may be configured such that when one of the second valves is interfaced with one of the second valve interfaces and one of the second fluid flow components is mounted to the second hub using the second mounting features such that the second valve and the second fluid flow component fluidically interface with a corresponding one of the second flow paths, the second fluid flow component and the second valve overlap, at least in part, when viewed from a direction parallel to the second axis.
In one further such embodiment, the apparatus may further include a plurality of first fluid flow components, a plurality of first valves, a plurality of second fluid flow components, and a plurality of second valves. Each first fluid flow component may be mounted to the first hub using the first mounting features such that each first fluid flow component is fluidically connected with a corresponding one of the first ports and each first valve may be interfaced with a corresponding one of the first valve interfaces. Each second fluid flow component may be mounted to the second hub using the second mounting features such that each second fluid flow component is fluidically connected with a corresponding one of the second ports and each second valve may be interfaced with a corresponding one of the second valve interfaces.
In some embodiments, the apparatus may also include a plurality of first fluid flow components, each of which may be mounted to the first hub and in fluidic communication with a different one of the first flow paths; a plurality of first valves, each of which may be mounted to the first hub and in fluidic communication with a corresponding one of the first flow paths through one of the first valve interfaces; at least one semiconductor processing chamber; a gas distribution system that may be configured to supply gas to the semiconductor processing chamber; and a controller that may include at least one memory and at least one processor. The first hub may be fluidically connected with the gas distribution system, the memory may store computer-executable instructions for controlling the plurality of first fluid control components and the plurality of first valves may cause desired quantities of process gases, process liquids, or process gases and process liquids to be delivered to the first mixing chamber and then to the at least one semiconductor processing chamber by way of the gas distribution system.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the presented concepts. The presented concepts may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail so as to not unnecessarily obscure the described concepts. While some concepts will be described in conjunction with the specific implementations, it will be understood that these implementations are not intended to be limiting.
There are many concepts and implementations described and illustrated herein. While certain features, attributes and advantages of the implementations discussed herein have been described and illustrated, it should be understood that many others, as well as different and/or similar implementations, features, attributes and advantages of the present inventions, are apparent from the description and illustrations. As such, the above implementations are merely exemplary. They are not intended to be exhaustive or to limit the disclosure to the precise forms, techniques, materials and/or configurations disclosed. Many modifications and variations are possible in light of this disclosure. It is to be understood that other implementations may be utilized and operational changes may be made without departing from the scope of the present disclosure. As such, the scope of the disclosure is not limited solely to the description above because the description of the above implementations has been presented for the purposes of illustration and description.
Importantly, the present disclosure is neither limited to any single aspect nor implementation, nor to any single combination and/or permutation of such aspects and/or implementations. Moreover, each of the aspects of the present disclosure, and/or implementations thereof, may be employed alone or in combination with one or more of the other aspects and/or implementations thereof. For the sake of brevity, many of those permutations and combinations will not be discussed and/or illustrated separately herein.
Semiconductor processes typically utilize a large number of different types of processing gases and/or liquids. These fluids may need to be individually controlled to a high degree of precision to ensure that the proper quantities and ratios of gases are delivered to the semiconductor processing chamber (or chambers) where semiconductor processing occurs at the right time and in the right sequence—it is to be understood that the term “fluid,” as used herein, may refer to either a gas or a liquid. To provide such fluidic control, semiconductor processing tools usually include, or are connected with, a “gas box,” which is a complex assembly of fluid flow components, such as valves, mass flow controllers (MFCs), fittings, tubes, manifold blocks, etc.
In a typical gas box, each processing fluid may have an associated “gas stick,” which is typically a linear arrangement of shut-off valves, mixing valves, MFCs (if used), fittings, tubing, filters, pressure regulators, and/or manifold blocks. These gas sticks, which may also be used for liquid reactants (despite the name referring to “gas”), may then be arranged in a linear fashion, side-by-side, and connected to a common trunk line. In such arrangements, the average flow direction of each gas stick may typically be perpendicular to the average flow direction of the trunk line.
In a typical gas stick, the fluid flow components are laid out in a generally sequential manner.
Referring to
A regulator 108 may be used to regulate the pressure of the supply fluid, e.g., the pressure of a supply gas, and a pressure gauge 110 may be used to monitor the pressure of the supply fluid. In one implementation, the pressure may be preset and not need to be regulated. In another implementation, a pressure transducer (not illustrated) having a display to display the pressure may be used. The pressure transducer may be positioned next to the regulator 108. A filter 112 may be used to remove impurities in the supply fluid. A primary shut-off valve 114 may be used to prevent any corrosive supply fluids from remaining in the gas stick. The primary shut-off valve 114 may be two-port valve having an automatic pneumatically operated valve assembly that causes the valve to become deactivated (closed), which in turn effectively stops fluid flow within the gas stick. Once deactivated, a non-corrosive purge gas, such as nitrogen, may be used to purge the gas stick. The purge valve 116 may have three ports to provide for the purge process—an entrance port, an exit port and a discharge port.
Adjacent the purge valve 116 may be an MFC 118. The MFC 118 may be used to accurately measure and control the flow rate of the supply fluid, e.g., supply gas. Positioning the purge valve 116 next to the MFC 118 allows a user to purge any corrosive supply fluids in the MFC 118. A mixing valve (or secondary valve) 120 next to the MFC 118 may be used to release the amount of supply fluid to be mixed with other supply fluids in the gas box.
Each component of the gas stick 100 may be positioned above a manifold block. A plurality of manifold blocks may be joined together to form a substrate 122, which may be a layer of manifold blocks that creates the flow path of fluid through the gas stick 100. The fluid flow components may be positioned on the manifold blocks through any of a variety of mechanisms, e.g, threaded interfaces, flange plates with threaded fasteners, etc.
In such arrangements, each gas stick may be located a different distance from the end of the trunk line that serves as the supply to the semiconductor processing chamber. In such arrangements, it may take longer for gases that are introduced into the trunk line further from such a supply end to reach the supply end than gases that are introduced into the trunk line closer to the supply end.
In some of these arrangements, a high-flow carrier gas may be introduced into the trunk line to convey lower-flow process gases from the gas sticks to the supply end of the trunk line in a more rapid fashion, which may reduce the time it takes to deliver process fluids to the trunk line supply end.
The assignee of this disclosure has undertaken to fundamentally change the design of gas boxes for use in semiconductor manufacturing to make these systems more streamlined, more compact, and less expensive. As part of this effort, the present inventors determined that significantly improved fluid delivery could be obtained in a gas box where a) each MFC was linked to a common mixing chamber by generally equal-length flow passages and b) the MFCs were generally arranged in a circular pattern about the mixing chamber. Typically speaking, the MFC is the next-to-last (with respect to the direction of fluid flow) fluid flow component in a gas stick—it is usually the component that controls the rate at which gas or liquid is delivered to the mixing chamber/trunk line/or other volume in which the various fluids delivered by the gas sticks may mingle. The last fluid flow component in a gas stick, however, is usually a mixing valve that may start or stop flow of the fluid passing through the MFC. In addition to arranging the MFCs around the mixing chamber in a generally circular pattern and using generally equal-length flow passages between the MFCs and the mixing chamber, the present inventors also determined that a radical reconfiguration of the mixing valve and MFC relative placement provided additional performance increases.
Instead of the mixing valve being located as shown in
The above improvements may be provided by way of a mixing hub (or simply “hub”) that provides mounting interfaces for various fluid flow components. In most cases, these fluid flow components will include MFC and mixing valve pairs, although other fluid flow components may be mounted to the hub in place of, or in addition to, these fluid flow components. The hub may generally include a mixing chamber that is fluidically connected with a plurality of fluid flow paths arranged about it in a radial arrangement. Each of these fluid flow paths may lead to a different set of fluid flow components and may be used to deliver a different process gas or liquid to the mixing chamber. Such an implementation is discussed in more detail below.
Thus, for example, each first passage 208 may fluidically connect one first port 202 to a corresponding first valve interface 212. Each second passage 210 may fluidically connect one first valve interface 212 to the first mixing chamber 204. Accordingly, each first valve interface 212 may be fluidically interposed between the corresponding first passage 208 and the second passage 210.
In some configurations, the example first hub 200 may be configured to allow a fluid to travel from the first ports 202 to the first mixing chamber 204 along the first flow paths 206, such that gas may first travel through one first port 202 into one of the first passages 208, then through the first passage 208 that is fluidically connected in series with that first port 202 and into the first valve interface 212 that is fluidically connected in series with that first passage 208, and then through the first valve interface 212 and into the second passage 210 that is fluidically connected in series with the first valve interface 212, and then through that second passage 210 and into the first mixing chamber 204. In some such configurations, each flow path may be fluidically isolated from other first ports 202, first passages 208, and second passages 210 within the hub and upstream of the mixing chamber.
In some configurations, each first valve interface 212 may be configured to regulate fluid flow between the first passage 208 and the second passage 210, which, in some configurations, may be achieved by a valve (not shown, but discussed below and shown in later Figures) that may be interfaced with the first valve interface 212. In some configurations, the first valve interfaces 212 may be substantially cylindrically shaped with a circular cross-section, as depicted in
The first valve 618 is a surface-mount valve that is configured to be mounted to a flat surface with an inlet and an outlet port (these interfaces will generally include seals, but these are not shown). Such a face-mount valve will generally have internal flow paths or flow recesses that, when the valve is mounted to the flat surface, serve to define a contained flow path for the gas or liquid that is routed through the valve. As can be seen, a portion of the first flow path 606 is defined by the first valve 618. This portion is also indicated on the right side of
Returning to
Each first valve interface 212 may also be located between a first reference plane 230 that is perpendicular to the first axis 216 and passes through the corresponding first port 202, and a second reference plane 232 that is perpendicular to the first axis and passes through the first mixing chamber 204, as depicted, for example in
The first surface 220 in
In some configurations, there may also be a second surface 222 substantially perpendicular to the first surface 220 or the first reference plane 230. The first valve interfaces 212 are shown as cylindrical bores that extend through each of the second surfaces 222. The valve mounting feature described herein above (not shown), may also be configured onto the second surface 222 such that a first valve may be installed to interface with the first valve interface 212 using such a valve mounting feature. Some example valve mounting features on the second surface may include clamping features (such as flanges), threaded bores, or threaded holes. It is to be understood that the second surfaces may also be a non-planar surface or surfaces, e.g., the second surface may be a cylindrical or frusto-conical surface (or sections thereof)—such a configuration may be used when the first valves that are to be interfaced to the hub do not necessarily require a flat surface for mounting, as may be the case with some valves that thread into a threaded bore. It is to be further understood that the second surface(s) 222 may be substantially perpendicular to the first surface(s) 220 and/or the first reference plane 230, e.g., such second surfaces 222 may be ±10° from perpendicular and still be considered to be “substantially perpendicular.”
As discussed above, in some configurations, the valve mounting feature of each first valve interface 212 may include a threaded bore and/or a pattern of threaded holes. In some configurations, the threaded bore (or each threaded hole in a pattern of threaded holes, if used) may include a center axis that is within ±10° of being parallel to the first surface 220.
As discussed, the first ports may be arranged about the first axis. In
In some configurations, the first hub may have at least three first ports. In
In some configurations the first passages 208 and the second passages 210 may be cylindrical in shape with a circular cross-section, for instance, as depicted in
Generally speaking, the majority of each first passage 208 and the majority of each second passage 210 may follow paths that are at oblique angles α and β, respectively, off the first reference plane 230. In some implementations, the absolute value of the difference between the first oblique angle α and the second oblique angle β may be 25° or less, 20° or less, or 15° or less.
Due to the angled nature of the first and second passages, each first flow path is much shorter in length than a corresponding flow path would be in a typical, conventional gas stick. For example, in the conventional gas stick of
The first mixing chamber 204 may be offset from one of the first ports 202 in a direction that is parallel to the first axis 216 by a first distance. As depicted in
The example first hub 200 depicted in
In some implementations, the first mixing chamber 204 of the example first hub 200 may be, in part, fluidically open to the ambient environment, for instance, on the end opposite the outflow pipe 214 as depicted in
In some other implementations, the first mixing chamber 204 may be entirely sealed within the first hub 200 such that the only fluidic connections to the first mixing chamber 204 are the first outflow pipe 214 and the second passages 210. Some such implementations may permit the use of only a single first hub in a semiconductor manufacturing tool. Some such implementations may be manufactured using 3D printing techniques, casting techniques, injection molding techniques, and/or using traditional machining processes. The first hub 200 may be made from a variety of different types of materials that are suitable for handling semiconductor processing chemicals. For example, the first hub 200 may be made from stainless steel, ceramic, ceramic composites, or other blended materials.
In some implementations, the example first hub 200 may not have an outflow pipe. In some such implementations, the first mixing chamber of the example first hub may be fluidically connected with the first mixing chamber of another first hub which does have an outflow pipe. In some such implementations, the two first mixing chambers are fluidically connected, but only one mixing chamber may have an outflow pipe.
The first mixing chamber 204 may be of an angled cylindrical shape, as depicted, for instance in
In some implementations, the first fluid flow components 826 may be MFCs. The details of the gas supply to the MFCs are not depicted here, but such MFCs may be supplied with gases or liquids, for example, using hardware similar to that used in conventional gas sticks. For instance, the first fluid component 826 may include an inlet port 828 through which gas and/or liquid may be supplied into the first fluid component and which may be connected to a fluid source, e.g., a facility gas source.
In some embodiments, the valve actuation axis of one or more of the first valves 1018 may be parallel to the surface to which the corresponding first fluid flow component 1026 mounts.
As can be seen in
The example first valves 218 may be configured, as described above, to regulate the flow between the first passages (not labeled) and second passages (not labeled) of the first hub 200, i.e., fluid flow along the first flow paths. Similarly, the example second valves 1418 may be configured to regulate the flow between the first passages and second passages of the second hub 1400, i.e., fluid flow along the second flow paths 1406. The example first valves 218 and the example second valves 1418 of
In some embodiments, the apparatus that results from assembling the first hub and the second hub together may be manufactured as a single, unibody piece. In other words, instead of manufacturing a separate first hub and a separate second hub, then connecting them together, the first hub and the second hub may be manufactured such that they are one solitary piece. Some such implementations may be manufactured using 3D printing techniques, casting techniques, injection molding techniques, and/or traditional machining processes. Such implementations may be made from a variety of different types of materials that are suitable for handling semiconductor processing chemicals, and may include, for instance, stainless steel, composite, ceramic, or other mixtures.
It is to be understood that the hubs and hub assemblies discussed herein may be provided as piece parts, e.g., as a single hub, pairs of hubs (either assembled or disassembled), as hubs assembled with fluid flow flow components (such as MFCs and/or valves), as part of a complete gas box, or as part of a semiconductor processing tool. The hubs, as described herein, may be fluidically connected with a plurality of gas or liquid supply sources, and to one or more process chambers in a semiconductor processing tool. The fluid flow components may be connected to a controller that may control the operation of the fluid flow components. The controller may include one or more processors and memory for storing instructions to control the one or more processors to perform various operations, e.g., turn on or off valves, adjust the flow rates of reactants through MFCs, etc.
Unless the context of this disclosure clearly requires otherwise, throughout the description and the claims, the words “comprise,” “comprising,” and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in a sense of “including, but not limited to.” Words using the singular or plural number also generally include the plural or singular number respectively. When the word “or” is used in reference to a list of two or more items, that word covers all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list. The term “implementation” refers to implementations of techniques and methods described herein, as well as to physical objects that embody the structures and/or incorporate the techniques and/or methods described herein.
There are many concepts and implementations described and illustrated herein. While certain features, attributes and advantages of the implementations discussed herein have been described and illustrated, it should be understood that many others, as well as different and/or similar implementations, features, attributes and advantages of the present inventions, are apparent from the description and illustrations. As such, the above implementations are merely exemplary. They are not intended to be exhaustive or to limit the disclosure to the precise forms, techniques, materials and/or configurations disclosed. Many modifications and variations are possible in light of this disclosure. It is to be understood that other implementations may be utilized and operational changes may be made without departing from the scope of the present disclosure. As such, the scope of the disclosure is not limited solely to the description above because the description of the above implementations has been presented for the purposes of illustration and description.
Importantly, the present disclosure is neither limited to any single aspect nor implementation, nor to any single combination and/or permutation of such aspects and/or implementations. Moreover, each of the aspects of the present disclosure, and/or implementations thereof, may be employed alone or in combination with one or more of the other aspects and/or implementations thereof. For the sake of brevity, many of those permutations and combinations will not be discussed and/or illustrated separately herein.
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