Claims
- 1. A folded fin heat sink assembly comprising at least one aluminum folded fin assembly mounted on a copper bass plate, each said folded tin assembly comprising a lower web to contact said base plate, an upwardly extending fin portion, an upper web, a downwardly extending fin portion, and so on, repeating in a progressive zig-zag fashion, each said folded fin assembly being soldered to said copper base plate by means of a Sn—Zn solder.
- 2. A folded fin heat sink assembly according to claim 1, produced by the steps of:(a) placing a sheet of Sn—Zn solder material on said base plate; (b) piecing said folded fin assembly on said solder sheet, with said lower web portions thereof against said base plate and solder sheet; (c) heating said base plate, said folded fin assembly and said solder to a temperature exceeding the liquidus temperature of said solder and allowing said solder to flow, and (d) cooling said solder to form a soldered joint between said base plate and said lower web portions of said folded fin assembly.
- 3. A folded fin heat sink assembly according to claim 2, wherein said heating is in the range of about 220-260 degrees Celsius.
- 4. A folded fin heat sink assembly according to claim 2, wherein flux is applied to one of the group consisting of: (a) said base plate and said fins, and (b) upper and lower surfaces of said sheet of solder material, prior to the steps of claim 2.
- 5. A folded tin heat sink assembly according to claim 1, wherein said solder comprises about 91% Sn and about 9% Zn.
- 6. A folded fin heat sink assembly according to claim 1, wherein said base plate is unplated.
- 7. A folded fin heat sink assembly according to claim 1, wherein said base plate is nickel plated.
Parent Case Info
This application claims benefit of U.S. Provisional 60/268,414 filed Feb. 14, 2001.
US Referenced Citations (9)
Provisional Applications (1)
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Number |
Date |
Country |
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60/268414 |
Feb 2001 |
US |