Not Applicable
Not Applicable
1. Field
This relates to electronics, specifically to the construction of enclosures for electronics.
2. Prior Art
Currently, enclosures for electronics lack the tactile qualities and aesthetic diversity of apparel items and other soft, goods. This fact is due in great part to broad technical differences between the makers of consumer electronics and the makers of soft goods. Hard plastic shells are typical of consumer electronics. The qualities of a hard plastic shell are in direct conflict with the crafted nature of soft goods. Soft goods use a patchwork of several materials that are sewn, glued and otherwise fastened to each other achieving form, function and aesthetic. The techniques used by soft goods manufacturers require materials that facilitate these methods. Hard shells of plastic and other materials can not accommodate such methods. Consumers are outfitted with many everyday personal electronics. Soft goods and, apparel makers have long sought means of crafting portable electronics with adequate tactile qualities and aesthetic diversity.
U.S. Pat. No. 7,519,192 to Laycock (2009) and U.S. Pat. No. 8,107,653 to Wolfe (2012) discloses methods for permanently setting headphones into a garment. These methods are narrow and only aim to feed wires and connectors through established garments offering no solutions for integrating various and diverse electronic components into an enclosure. U.S. Pat. No. 7,035,422 (2006) to Wiener arranges a complex sound system into a highly specialized garment that fails to provide soft good and apparel makers a platform for producing anything but this specialized device. U.S. Pat. No. 6,502,248 to Legette (2003) describes a method to impart desirable aesthetic and mechanical properties to ear warmers but fails to expand the invention to accommodate purchase points or internal volumes for any type of electronic component.
U.S. Pat. No. 7,673,528 to Yoon (2010) demonstrates a method for the setting sensors on a flexible substrate with embedded conductor lines connecting the sensors. The substrate is flat and flexible but in no way offers methods to enclose the sensors. There is no provision for manufacturability employing methods common to the soft good and apparel industry.
Alcombination of substrate, the substrate form features, electronic components, and applique make up the versatile framework.
In operation the user of the framework produces the substrate elements 3,46,7 with various forming operations performed on materials like EVA or TPU. The forming operations produce features 3a, 3b, 3c, 4a, 4b, 4c, 6a along with the general forms defined by the drawings. The user then combines the substrate elements 3,4,6,7 to the other elements by way of sewing gluing and/or mechanically fastening. The Drivers 1 are attached to the Substrate Baffle 7 by the operator through gluing. This combination of the Substrate Baffle 7 and the Drivers 1 are then sewn to the Substrate Chamber 4. The Chord 2 is woven through holes and Channel 4c in the Substrates and connected to terminals on the Drivers 1. Structural Rod 6 is slid into place and fastened to the Substrate Bridge 3 with Rivets 8 through Holes 3c. The applique 9,10 is sewn 9a to the substrate elements 3,4,6,7 achieving the desired tactile qualities and aesthetic diversity. This completes the headphones as a tailored personal electronic.
There are various possibilities with regard to the relative shape and mechanical features formed by the substrate elements like 3, 4, 6, and 7 in
(a) Vents for the release of heat or sound like Substrate Chamber 4 with feature 4a.
(b) Structural geometry for added strength like feature 3b on Substrate Bridge 3.
(c) Substrate elements like Substrate Baffle 7 offer purchase points for the attachment of electronic components such as a Driver 10
(d) The Substrate elements can be formed to incase a variety of electronic components such a microphone or a flash light. This flexibilty offers a platform for the production of various electronic devices in a tailored inclosure.
(e) The Substrate elements provide attachment points for other types of components such as a Structural Rod 5 or a Chord 2 adding further versatility to the framework.
(f) Forms such as feature 3a to provide aesthetic shapes or functional elements like the brim on a hat.
From the description above a number of advantages and various embodiments of the framework for the tailored personal electronics become evident:
(a) To provide viable means of tailoring and constructing personal electronics.
(b) To offer compatibility with established production methods and techniques of the soft good and apparel industry.
(c) To achieve the resulting personal electronics with adequate tactile qualities and aesthetic diversity.
(d) Leveraging the modular nature of electronics.
Accordingly, the reader will see that the framework for tailored personal electronics can be used by the soft goods and apparel industry to embody various personal electronic designs. The resulting personal electronics are produced inexpensively by leveraging established production methods and techniques of the soft good and apparel industry. By means of the applique 9, and 10, the framework allows personal electronics to take on the tactile qualities and aesthetic diversity previously reserved for soft good and apparel items. This applique method is not possible with traditional enclosures. Many electronics are standardizes allowing this framework to leverage speakers, lights, etc like buttons or badges that are typical components in a garments.
Although the description above contains many specificities, these should not be construed as limiting the scope of embodiments but as merely providing illustrations for one of the presently preferred embodiments. For example the substrate-bridge can form a visor; the substrate-chamber can be cylindrical and formed to house a light and not a driver.
Thus the scope of the embodiments should be determined by the appended claims and their legal equivalents, rather than by the examples given.
This application claims the benefit of provisional patent application Ser. No. 61/609,907, filed on 2012 Mar. 12 by present inventors