The disclosure relates in general to a detecting system, and more particularly to a full-range image detecting system and method thereof.
Along with the trend of wafer thinning, wafer warpage and deformation has reached millimeter level. However, when warpage volume increases but the focus range is not large enough and the focusing speed is not fast enough, the focusing of the automatic optical inspection (AOI) system will become more difficult and the detecting time will be prolonged. Consequently, the AOI system will have poor performance in detection, and subsequent manufacturing processes will be affected.
Of the current technologies, the focusing mode mainly includes an active focus mode and a passive focus mode. The focusing process of the passive focus mode includes a coarse tuning stage and a fine tuning stage. In the active focus mode, the light generated by a light source is projected onto a focusing grating and then is further projected on the surface of an object via a lens. A phase comparison between the grating image reflected from the surface of the object and the original grating image is made to increase the focusing speed. However, the active focus mode incurs a higher cost.
The disclosure is directed to a full-range image detecting system and method thereof, which resolve the problems encountered in the prior art, improve the detection of the full-range image and increase the speed and accuracy of detection.
According to one exemplary embodiment, a full-range image detecting system including a planar light source, an image capturing device, a light sensing device, a processing unit and a measuring module is provided. The planar light source projects a photo image with periodical variations onto an object. The image capturing device captures a reflective photo image reflected from the object. The light sensing device detects the coordinates of at least three measuring points on the object for fitting a plane. The processing unit calculates the phase variation of the reflective photo image after phase shift, a relative altitude of the surface profile of the object according to the phase variation, and an absolute altitude of the surface profile of the object with respect to the plane to obtain an information of absolute coordinate. The measuring module detects the surface of the object according to the information of absolute coordinate of the object.
According to another exemplary embodiment, a full-range image detecting method includes following steps is provided. A photo image with periodical variations is projected onto an object by a planar light source. A reflective photo image reflected from the object is captured. The coordinates of at least three points on the object are detected for fitting a plane. The phase variation of the reflective photo image after phase shift is calculated, and then a relative altitude of the surface profile of the object is calculated according to the phase variation. An absolute altitude of the surface profile of the object with respect to the plane is calculated to obtain an information of absolute coordinate. The surface of the object is detected according to the information of absolute coordinate.
The above and other aspects of the disclosure will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment(s). The following description is made with reference to the accompanying drawings.
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Below, exemplary embodiments will be described in detail with reference to accompanying drawings so as to be easily realized by a person having ordinary knowledge in the art. The inventive concept may be embodied in various forms without being limited to the exemplary embodiments set forth herein. Descriptions of well-known parts are omitted for clarity, and like reference numerals refer to like elements throughout.
According to the full-range image detecting system and method of the disclosure, a relative altitude of a surface profile of an object (such as a wafer) is measured, and the information of reference coordinate (such as the circle center position, the alignment-groove position and the rotation angle of the wafer and the resolution of the image) is outputted and used as the movement information for a measuring module (such as an optical microscope or an optical interferometer) and a positioning platform to reduce the focusing time, such that the measuring module perform quick detection point by point.
Let the surface detection of a wafer be taken for example. Firstly, a relative altitude of the surface profile of the wafer is measured. Then, the relative altitude of the surface profile of the wafer and a reference coordinate information are provided to the measuring module, such that the coarse tuning and fine tuning in the focusing process of a conventional measuring module be omitted, the fine scanning process be shortened, and the focusing problems arising from wafer warpage is resolved.
A number of embodiments are disclosed below for elaborating the disclosure. However, the embodiments of the disclosure are for detailed descriptions only, not for limiting the scope of protection of the disclosure.
Referring to
Referring to
Refer to
δy=L[tan(α+2θ)−tan(α)] (1)
When the slope change θ on the surface of the object 10 is very tiny, equation (1) be simplified as:
δy=2Lθsec2α (2)
Therefore, the slope change θ on the surface of the object 10 be calculated from the offset δy of the reflective photo image.
Refer to the photo image 11 of
In step S102, the photo image control module 121, which is a programmable control module, generates a photo image 11 and controls the photo image 11 to move at an equal distance with respect to the object 10 along at least a direction to generate phase shift. For example, the photo image is moved at an equal distance by using three-step phase-shifting method or four-step phase-shifting method to generate multiple photo images (such as 6 or 8). As indicated in
In the above disclosure, the three-step phase-shifting method requires three photo images with phase shift. The phase shift between the first image I1 and the second image I2 is 2π/3. The phase shift between the second image I2 and the third image I3 is 4π/3. The phase-shift relationship be expressed as a set of simultaneous equations:
Besides, the four-step phase-shifting method requires four stripe images with phase shift. The phase shift between the first image I1 and the second image I2 is π/2. The phase shift between the second image I2 and the third image I3 is π. The phase shift between the third image I3 and the fourth image I4 is 3π/2. The phase-shift relationship is expressed as a set of simultaneous equations:
As disclosed above, the phase variation Δϕ of each coordinate point (x, y) is positively proportional to the offset δy of the reflective photo image. In step S103, the calculation module 123 of
As indicated in equation (3), the slope change θ on the surface of the object 10 is obtained from the phase variation Δϕ. Both the three-step phase-shifting method and the four-step phase-shifting method disclosed above are based on the arctangent (tan−1) function, and the phase is restricted between −π/2˜π/2, therefore the phase chart is a discontinuous phase distribution chart. To restore the discontinuous phase as the original continuous phase with 0˜Nπ periods (N is an integer), the phase needs to be unwrapped.
Refer to
Then, the planarization module 125 plenaries a phase unwrapping chart to obtain a relative altitude of the surface profile of the object 10. In short, the planarization process brings the phase of each coordinate point to the same level such that variation in phase is compared and a relative altitude of the surface profile of the object 10 is calculated. The relative altitude of each coordinate point of the object 10 is denoted by Wi (x, y, z).
Referring to
Steps S205˜S207 are similar to step S104 disclosed above. In step S205, a uniform photo image (without periodical variation strips 12) is projected onto the object 10 by the planar light source 110, and a reflected uniform photo image is captured by the image capturing device 130. In step S206, the distortion of the reflected uniform photo image is calibrated such that such that an inclined projection of the uniform photo image onto the object 10 is calibrated as an orthographic projection of the uniform photo image onto the object 10. Then, a plane is fitted according to the coordinates of at least three measuring points on the object 10. Refer to
In step S208, the circle center position (xo, yo) and the resolution of the image are used for linking the plane coordinate system of the object 10 to other coordinate system (such as the coordinate system of the positioning platform 160 and the coordinate system of the measuring module 150). Additionally, the rotation angle θ1 of the alignment groove is used for calibrating the error in the rotation angle when the object 10 is placed. In step S209, the altitude of the measuring module 150 is adjusted according to the information of absolute coordinate of the object for detecting the surface of the object 10. As indicated in
The algorithm related to the information of absolute coordinate is disclosed below. In step S105, after the processing unit 120 obtains the relative coordinates of three measuring points A, B, and C, the coordinate positions of the three measuring points are used for fitting a plane Q (x, y, z), and surface overlapping computation is performed on a relative altitude Wi (x, y, z) of the surface profile of the object 10 and the plane Q (x, y, z) to calculate an absolute altitude of the surface profile of the object 10 with respect to the plane Q (x, y, z) to obtain an information of absolute coordinate of the object. The information of absolute coordinate is used as the coordinates (x, y, z) of actual absolute altitude Zi on the surface of the object 10.
Wherein,
Zi(x,y,z)=Wi(x,y,z)+Q(x,y,z)−P(xi,yi,zi);
P (xi, yi, zi) denotes the coordinates of a reference coordinate point (such as one of the three measuring points A, B, and C) of the coordinate system of absolute altitudes.
In step S106, after the measuring module 150 obtains the information of absolute coordinate, the measuring module 150 detect, focus, or perform an electrical test on the surface of the object 10 according to the information of absolute coordinate of the object. The measuring module 150 is an optical microscope, an optical interferometer or a probe card electrical testing device. In the present embodiment, after the full-range image detecting system 100 calibrates the absolute altitude between multiple points (xi, yi) of the object 10 and the measuring module 150 according to the altitude information of the image, the processing unit 120 control the measuring module 150 to move along the vertical axis and reach a destined position directly without employing coarse tuning, hence saving the focusing time or the positioning time.
According to the full-range image detecting system and method of the embodiments of the disclosure, the processing unit controls the positioning platform to move the object to a coordinate position according to the information of absolute coordinate of the object, and the measuring module move in the vertical axis of the altitude and directly reach a destined position according to the information of absolute coordinate of the object, such that the focusing speed is very fast and the measuring points be quickly detected one by one. The present system employs a focusing process quicker than that of the passive focus mode which includes a coarse tuning stage and a fine tuning stage, and incurs cost lower than the active focus mode, hence breaking through the bottleneck of conventional technologies. Additionally, the present system measures the profile (such as bump altitude distribution), the defects and the warpage on the surface of the object to meet different needs of the system.
It will be apparent to those skilled in the art that various modifications and variations be made to the disclosed embodiments. It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims and their equivalents.
Number | Date | Country | Kind |
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104133182 A | Oct 2015 | TW | national |
This application claims the benefits of U.S. provisional application Ser. No. 62/164,671, filed May 21, 2015 and Taiwan application Serial No. 104133182, filed Oct. 8, 2015, the subject matters of which are incorporated herein by references.
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Number | Date | Country | |
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20160344911 A1 | Nov 2016 | US |
Number | Date | Country | |
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62164671 | May 2015 | US |