Claims
- 1. A resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10, wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000.
- 2. The resin composition according to claim 1, wherein the aspect ratio of the clay mineral is in a range of from 200 to 3,000.
- 3. The resin composition according claim 1, wherein the weight percentage of the hydrogen-bonding group or ionic group per unit weight of the hydrogen-bonding resin is in the range of 30-50%.
- 4. The resin composition according to claim 1, wherein the high hydrogen-bonding resin is polyvinyl alcohol or a polysaccharide.
- 5. The resin composition according to claim 1, which further contains a cross-linking agent for the hydrogen-bonding group of the hydrogen-bonding resin.
- 6. The resin composition according to claim 5, wherein the cross-linking agent is a compound containing zirconium.
- 7. A laminated film or laminate having at least one layer formulated from the composition claimed in claim 1, 2, 3, 4, 5, or 6.
- 8. A laminated film or laminate comprising:
- at least one layer selected from the group consisting of a biaxially oriented polypropylene film, a biaxially oriented nylon film and a biaxially oriented polyethylene terephthalate film; and
- at least one layer formulated from the composition claimed in claim 1, 2, 3, 4, 5, or 6.
- 9. The resin composition according to claim 1, wherein the clay mineral is selected from the group consisting of montmorillonite, hectorite, sodium terasililic mica, sodium taeniolite, and any combination thereof.
- 10. A water-resistant gas-barrier film formulated at least from a resin composition, said resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10 wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000.
- 11. A water-resistant gas-barrier film according to claim 10, wherein the aspect ratio of the clay mineral is in a range of from 200 to 3,000.
- 12. A water-resistant gas-barrier film according to claim 10, wherein the weight percentage of the hydrogen-bonding group or ionic group per unit weight of the hydrogen-bonding resin is in the range of 30-50%.
- 13. A water-resistant gas-barrier film according to claim 10, wherein the high hydrogen-bonding resin is polyvinyl alcohol or a polysaccharide.
- 14. A water-resistant gas-barrier film according to claim 10, which further contains a cross-linking agent for the hydrogen-bonding group of the hydrogen-bonding resin.
- 15. A water-resistant gas-barrier film according to claim 14, wherein the cross-linking agent is a compound containing zirconium.
- 16. A water-resistant gas-barrier film according to claim 10, wherein the film has an oxygen permeability per .mu.m of thickness at 31.degree. C. and 61% RH of 2 cc/m.sup.2 /day/atm or less.
- 17. A water-resistant gas-barrier film according to claim 10, wherein the film has an oxygen permeability per .mu.m of thickness at 31.degree. C. and 61% RH of 0.2 cc/m.sup.2 /day/atm or less.
- 18. A water-resistant gas-barrier film according to claim 10, wherein the clay mineral is selected from the group consisting of montmorillonite, hectorite, sodium terasililic mica, sodium taeniolite, and any combination thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-202339 |
Jul 1992 |
JPX |
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CROSS-REFERENCES TO RELATED APPLICATIONS
This is a continuation-in-part of application Ser. No. 08/384,798 filed Feb. 6, 1995, now abandoned, which is a continuation of application Ser. No. 08/097,889 filed Jul. 28, 1993, now abandoned, the complete disclosures of which are incorporated herein by reference.
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Continuations (1)
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Number |
Date |
Country |
Parent |
97889 |
Jul 1993 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
384798 |
Feb 1995 |
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