1. Field of the Invention
The present invention relates to a gasifier structure and, more particularly, to a gasifier which prevents the reduction of the total ion source obtained by the ion inplater in the gasifier from continuously gasifying the solid ion implater in the gasifier.
2. Description of the Prior Art
In all semiconductor devices, an ion implant is very important technology in the transistor structure. In the ion implantation process, the wafer is subjected to impact by the charge ion stream, which is the so-called dopant. When the doping obtains the sufficient energy, the thin film is implanted to a desired depth, thereby changing the property of the material and providing the specific electrical property. The ion implant accurately controls the dopant concentration in the doping area. The dopant solution (the dose) is controlled by the ion stream current (the total ion amount in the ion stream) and the scanning ratio (the times which the wafer passes through the ion stream). The depth of the dopant is determined by the energy magnitude of the ion stream.
However, the ion source in the ion stream is generally obtained from the solid ion source gasified in the gasifier. The structure of the conventional gasifier, as shown in
In view of the above problems, the present invention provides a gasifier structure to overcome the disadvantages of reducing the solid ion source.
The present invention provides a gasifier structure, comprising the size of an opening of the furnace less than the size of a bottom of the furnace, representing the narrow top and wide bottom furnace, which prevents the reduction of the ion source obtained by the ion inplater in the gasifier from gasifying the solid ion implater, and which prevents the loss cost and time from the manual operation required to arise the temperature in the gasifier.
The present invention also provides a gasifier structure, comprising the size of an opening of the furnace less than the size of a bottom of the furnace, representing the narrow top and wide bottom furnace, thereby effectively preventing the greatly increase of the surface area of the solid/gaseous interface from the continuously sublimation of the solid ion source due to the heating, resulting in maintaining a total gasified ion amount obtained by the ion implater, in order to solve the disadvantage of re-adjusting the ion stream current.
To achieve the aforementioned objects and more, a preferred embodiment of the present invention provides a gasifier structure, comprising a furnace and a heating system, characterized by: the size of an opening of the furnace less than the size of a bottom of the furnace, representing the narrow top and wide bottom furnace.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
Refer to
In order to describe the present invention, a solid ion source with a shorter heating time of
Refer to
If the heating time is shorter, as shown in
The present invention provides a gasifier which a furnace structure is represented by the size of the opening less than the size of the bottom, in order to effectively offsetting the greatly sublimation of the solid ion source caused by the furnace having the same width on the top and the bottom due to the sufficient heat energy, and in order to effectively offsetting the greatly reduction of total ion amount obtained by the ion implater as reducing the solid ion source, thereby preventing the re-adjustment of the electron beam from the conventional technology, and preventing the throughput reduction from arising the temperature in the gasifier to obtain an identical total ion amount.
The embodiment above is only intended to illustrate the present invention; it does not, however, to limit the present invention to the specific embodiment. Accordingly, various modifications and changes may be made without departing from the spirit and scope of the present invention as described in the following claims.
Number | Date | Country | Kind |
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2004200215414 | Jan 2004 | CN | national |