The present invention relates to replacement of bulbs used for lighting by light emitting diode (LED) bulbs, and more particularly, to the efficient removal of the heat generated by the LEDs in order to permit the replacement bulb to match the light output of the bulb being replaced.
An LED consists of a semiconductor junction, which emits light due to a current flowing through the junction. At first sight, it would seem that LEDs should make an excellent replacement for the traditional tungsten filament incandescent bulb. At equal power, they give far more light output than do incandescent bulbs, or, what is the same thing, they use much less power for equal light; and their operational life is orders of magnitude larger, namely, 10-100 thousand hours vs. 1-2 thousand hours.
However, LEDs have a number of drawbacks that have prevented them, so far, from being widely adopted as incandescent replacements. Among the chief of these is that, although LEDs require substantially less power for a given light output than do incandescent bulbs, it still takes many watts to generate adequate light for illumination. Whereas the tungsten filament in an incandescent bulb operates at a temperature of approximately 3000K, an LED, being a semiconductor, cannot be allowed to get hotter than approximately 120° C. The LED thus has a substantial heat problem: If operated in vacuum like an incandescent, or even in air, it would rapidly get too hot and fail. This has limited available LED bulbs to very low power (<approximately 3 W), producing insufficient illumination for incandescent replacements.
One possible solution to this problem is to use a large metallic heatsink, attached to the LEDs. This heatsink would then extend out away from the bulb, removing the heat from the LEDs. This solution is undesirable, because of the common perception that customers will not use a bulb that is shaped radically differently from the traditional shaped incandescent bulb; and also from the consideration that the heatsink may make it impossible for the bulb to fit in to pre-existing fixtures.
More recently, a means for cooling LEDs in light bulbs have had the LEDs immersed in a fluid, a gel or a plastic (PCT/US07/10470 and PCT/US07/10469). The fluid, gel or plastic provides a high thermal conductivity path from the LED heat sources to the bulb's surface and the ambient.
In some cases, however, the thermal conductivity of the fluid, gel or plastic may still not be high enough to maintain the LEDs at their desirable operating temperature. This is true especially when using individual high-power LEDs as opposed to using many low-power LEDs. For these applications, then, it would be desirable to find a material that had even higher thermal conductivity or could be combined with these materials to achieve higher thermal conductivity, but that at the same time maintained the desirable characteristics of the fluid, gel or plastic, that is, low optical loss, and potentially electrical insulation.
This invention has the object of developing a light emitting apparatus utilizing light emitting diodes (LEDs), such that the above-described primary problem is effectively solved. It aims at providing a replacement bulb for incandescent lighting having a plurality of LEDs with a light output equal in intensity to that of an incandescent bulb, and whose dissipated power may be effectively removed from the LEDs in such a way that their maximum rated temperature is not exceeded. The apparatus includes a bulb-shaped shell or body, formed of glass. The shell or body may be transparent, or may contain materials dispersed in or on it to disperse the light, making it appear not to have point sources of light, and may also contain materials dispersed in or on it to change the bluish color of the LED light to more yellowish color, more closely resembling the light from traditional incandescent bulbs.
The shell or body is preferably hollow inside having a cylindrical or tubular inner hollow cavity (or hollow portion). The hollow portion has the LEDs and their interconnecting means installed into it, and the remaining hollow portion filled with a thermally conductive fluid, gel or plastic, such as water or a hydrogel. This fluid, gel or plastic acts as the means to transfer the heat power generated by the LEDs to the glass, and from the glass to the shell, where it may be removed by radiation and convection, as in a traditional incandescent bulb. The fluid, gel or plastic may be transparent, or may contain materials dispersed in it to disperse the light, making it appear not to have point sources of light, and may also contain materials dispersed in it to change the bluish color of the LED light to more yellowish color, more closely resembling the light from traditional incandescent bulbs. The fluid, gel or plastic is preferably electrically insulating.
LEDs are installed in the fluid, gel or plastic in such a way as to prevent them from being shorted. If the fluid, gel or plastic is electrically insulating, no special measures need to be taken. If the fluid, gel or plastic is not electrically insulating, the electrically conductive portions of the LEDs may be electrically insulated to prevent shorting.
With the LEDs installed in the fluid, gel or plastic, the shell is sealed with a watertight seal, such as a plastic. Electrical contacts for powering the LEDs are brought out through the seal before the sealing is accomplished. These leads are connected to the power source for the LEDs, which will typically be included inside the remainder of the bulb. The power source is preferentially designed to be compatible with pre-existing designs, so that the bulb may directly replace traditional bulbs without requiring any change in the pre-existing fixture.
According to the present invention, an LED replacement bulb for incandescent lighting is constructed out of glass, with an interface material for heat transfer and mechanical buffering surrounding the LEDs inside the glass bulb.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
According to the design characteristics, a detailed description of the preferred embodiment is given below.
The screw-in base 20 includes a series of screw threads 22 and a base pin 24. The screw-in base 20 is configured to fit within and make electrical contact with a standard electrical socket. The electrical socket is preferably dimensioned to receive an incandescent or other standard light bulb as known in the art. However, it can be appreciated that the screw-in base 20 can be modified to fit within any electrical socket, which is configured to receive an incandescent bulb. The screw-in base 20 makes electrical contact with the AC power in a socket through its screw threads 20 and its base pin 24. Inside the screw-in base 20 is a power supply (not shown) that converts the AC power to a form suitable for driving the at least one LED 50.
In accordance with one embodiment, the LED replacement bulb 10 includes a glass bulb 30 comprised of a bulb-shaped body 32. The bulb-shaped body 32 is preferably formed of glass with a constant or variable thickness, which extends toward the tip of the bulb 30. The tip portion 34 of the bulb 10 is fully comprised of glass or a glass-like material. The bulb-shaped body 32 may be transparent, or may contain materials dispersed in or on it to disperse the light, making it appear not to have point sources of light, and may also contain materials dispersed in or on it to change the bluish color of the LED light to more yellowish color, more closely resembling the light from traditional incandescent bulbs.
As shown in
The hollow portion 40 contains the at least one LED 50 and the connecting wires 56 to the power source (not shown) within the base 20 of the bulb 10. The hollow portion 40 is filled, either completely or partially, and more preferably partially filled to approximately 90% of the total volume of the hollow portion 40, with a fluid, gel or plastic material 60, which functions as a low thermal-resistance thermal conductor for the heat dissipated by the LED or LEDs 50 to the glass bulb 30. It can be appreciated that the fluid, gel or plastic material 60 can be optically transparent, and/or an electrically insulating. In accordance with one embodiment, the fluid material 60 preferably includes a means to gel when exposed to air. It can be appreciated that in order to prevent leaks, the glass bulb 30 entirely encases the gel, fluid or plastic-filled hollow portion or cavity 40 with the exception of the portion of the hollow portion or cavity 40, which is attached to the base 20. The hollow portion of cavity 40 is preferably sealed, either with the glass of the glass bulb 30 or other material.
As shown in
The LED or LEDs 50 are comprised of two parts, the connecting wires 56 that connect them to the power supply, and the LED or LEDs 50 themselves. The connecting wires 56 are stiff enough to function as support for the LED or LEDs 50. In another embodiment, the connecting wires 56 may also form the interconnects between the LEDs 50 when there are multiple devices.
It will be apparent to those skilled in the art that various modifications and variation can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2008/011365 | 10/2/2008 | WO | 00 | 7/14/2010 |
Publishing Document | Publishing Date | Country | Kind |
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WO2009/045438 | 4/9/2009 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3962675 | Rowley et al. | Jun 1976 | A |
4025290 | Giangiulio | May 1977 | A |
4039885 | VAN Boekhold et al. | Aug 1977 | A |
4077076 | Masters | Mar 1978 | A |
4211955 | Ray | Jul 1980 | A |
4271458 | George, Jr. | Jun 1981 | A |
4290095 | Schmidt | Sep 1981 | A |
4325107 | MacLeod | Apr 1982 | A |
4336855 | Chen | Jun 1982 | A |
4346329 | Schmidt | Aug 1982 | A |
4405744 | Greinecker et al. | Sep 1983 | A |
4511952 | Vanbragt | Apr 1985 | A |
4539516 | Thompson | Sep 1985 | A |
4611512 | Honda | Sep 1986 | A |
4647331 | Koury et al. | Mar 1987 | A |
4650509 | Vanbragt | Mar 1987 | A |
4656564 | Felder | Apr 1987 | A |
4658532 | McFarland et al. | Apr 1987 | A |
4663558 | Endo | May 1987 | A |
4727289 | Uchida | Feb 1988 | A |
4728999 | Dannatt et al. | Mar 1988 | A |
4840383 | Lombardo | Jun 1989 | A |
4843266 | Szanto et al. | Jun 1989 | A |
4875852 | Ferren | Oct 1989 | A |
4876632 | Osterhout et al. | Oct 1989 | A |
4904991 | Jones | Feb 1990 | A |
4916352 | Haim et al. | Apr 1990 | A |
4942685 | Lin | Jul 1990 | A |
4947300 | Wen | Aug 1990 | A |
4967330 | Bell et al. | Oct 1990 | A |
4994705 | Linder et al. | Feb 1991 | A |
5008588 | Nakahara | Apr 1991 | A |
5065226 | Kluitmans et al. | Nov 1991 | A |
5065291 | Frost et al. | Nov 1991 | A |
5119831 | Robin et al. | Jun 1992 | A |
5136213 | Sacchetti | Aug 1992 | A |
5224773 | Arimura | Jul 1993 | A |
5237490 | Ferng | Aug 1993 | A |
5303124 | Wrobel | Apr 1994 | A |
5358880 | Lebby et al. | Oct 1994 | A |
5377000 | Berends | Dec 1994 | A |
5405208 | Hsieh | Apr 1995 | A |
5463280 | Johnson | Oct 1995 | A |
5496184 | Garrett et al. | Mar 1996 | A |
5514627 | Lowery et al. | May 1996 | A |
5528474 | Roney et al. | Jun 1996 | A |
5561347 | Nakamura et al. | Oct 1996 | A |
5585783 | Hall | Dec 1996 | A |
5622423 | Lee | Apr 1997 | A |
5630660 | Chen | May 1997 | A |
5662490 | Ogawa | Sep 1997 | A |
5664866 | Reniger et al. | Sep 1997 | A |
5667295 | Tsui | Sep 1997 | A |
5684354 | Gleckman | Nov 1997 | A |
5685637 | Chapman et al. | Nov 1997 | A |
5688042 | Madadi et al. | Nov 1997 | A |
5726535 | Yan | Mar 1998 | A |
5803588 | Costa | Sep 1998 | A |
5807157 | Penjuke | Sep 1998 | A |
5887967 | Chang | Mar 1999 | A |
5890794 | Abtahi et al. | Apr 1999 | A |
5892325 | Gleckman | Apr 1999 | A |
5899557 | McDermott | May 1999 | A |
5929568 | Eggers | Jul 1999 | A |
5931562 | Arato | Aug 1999 | A |
5931570 | Yamuro | Aug 1999 | A |
5936599 | Reymond | Aug 1999 | A |
5941626 | Yamuro | Aug 1999 | A |
5947588 | Huang | Sep 1999 | A |
5952916 | Yamabe | Sep 1999 | A |
5963126 | Karlin et al. | Oct 1999 | A |
5982059 | Anderson | Nov 1999 | A |
5984494 | Chapman et al. | Nov 1999 | A |
6003033 | Amano et al. | Dec 1999 | A |
6043591 | Gleckman | Mar 2000 | A |
6087764 | Matei | Jul 2000 | A |
6095671 | Hutain | Aug 2000 | A |
6102809 | Nichols | Aug 2000 | A |
6120312 | Shu | Sep 2000 | A |
6123631 | Ginder | Sep 2000 | A |
6147367 | Yang et al. | Nov 2000 | A |
6158451 | Wu | Dec 2000 | A |
6183310 | Shu | Feb 2001 | B1 |
6184628 | Ruthenberg | Feb 2001 | B1 |
6227679 | Zhang et al. | May 2001 | B1 |
6254939 | Cowan et al. | Jul 2001 | B1 |
6258699 | Chang et al. | Jul 2001 | B1 |
6268801 | Wu | Jul 2001 | B1 |
6273580 | Coleman et al. | Aug 2001 | B1 |
6276822 | Bedrosian et al. | Aug 2001 | B1 |
6277685 | Lin et al. | Aug 2001 | B1 |
6313892 | Gleckman | Nov 2001 | B2 |
6316911 | Moskowitz et al. | Nov 2001 | B1 |
6332692 | McCurdy | Dec 2001 | B1 |
6338647 | Fernandez et al. | Jan 2002 | B1 |
6357902 | Horowitz | Mar 2002 | B1 |
6382582 | Brown | May 2002 | B1 |
6426704 | Hutchison | Jul 2002 | B1 |
6471562 | Liu | Oct 2002 | B1 |
6478449 | Lee et al. | Nov 2002 | B2 |
6480389 | Shie et al. | Nov 2002 | B1 |
6488392 | Lu | Dec 2002 | B1 |
6496237 | Gleckman | Dec 2002 | B1 |
6504301 | Lowery | Jan 2003 | B1 |
6513955 | Waltz | Feb 2003 | B1 |
6528954 | Lys et al. | Mar 2003 | B1 |
6534988 | Flory, IV | Mar 2003 | B2 |
6541800 | Barnett et al. | Apr 2003 | B2 |
6547417 | Lee | Apr 2003 | B2 |
6568834 | Scianna | May 2003 | B1 |
6582100 | Hochstein et al. | Jun 2003 | B1 |
6608272 | Garcia | Aug 2003 | B2 |
6612712 | Nepil | Sep 2003 | B2 |
6619829 | Chen | Sep 2003 | B1 |
6626557 | Taylor | Sep 2003 | B1 |
6639360 | Roberts et al. | Oct 2003 | B2 |
6655810 | Hayashi et al. | Dec 2003 | B2 |
6659632 | Chen | Dec 2003 | B2 |
6685852 | Setlur et al. | Feb 2004 | B2 |
6709132 | Ishibashi | Mar 2004 | B2 |
6711426 | Benaron et al. | Mar 2004 | B2 |
6713961 | Honda et al. | Mar 2004 | B2 |
6734633 | Matsuba et al. | May 2004 | B2 |
6741029 | Matsubara et al. | May 2004 | B2 |
6742907 | Funamoto et al. | Jun 2004 | B2 |
6746885 | Cao | Jun 2004 | B2 |
6750824 | Shen | Jun 2004 | B1 |
6773192 | Chao | Aug 2004 | B1 |
6786625 | Wesson | Sep 2004 | B2 |
6789348 | Kneller et al. | Sep 2004 | B1 |
6791259 | Stokes et al. | Sep 2004 | B1 |
6791283 | Bowman et al. | Sep 2004 | B2 |
6793362 | Tai | Sep 2004 | B2 |
6793363 | Jensen | Sep 2004 | B2 |
6796698 | Sommers et al. | Sep 2004 | B2 |
6805461 | Witte | Oct 2004 | B2 |
6819049 | Bohmer et al. | Nov 2004 | B1 |
6819056 | Lin | Nov 2004 | B2 |
6828590 | Hsiung | Dec 2004 | B2 |
6864513 | Lin et al. | Mar 2005 | B2 |
6864554 | Lin et al. | Mar 2005 | B2 |
6881980 | Ting | Apr 2005 | B1 |
6886963 | Lodhie | May 2005 | B2 |
6903380 | Barnett et al. | Jun 2005 | B2 |
6905231 | Dickie | Jun 2005 | B2 |
6910794 | Rice | Jun 2005 | B2 |
6911678 | Fujisawa et al. | Jun 2005 | B2 |
6911915 | Wu et al. | Jun 2005 | B2 |
6926973 | Suzuki et al. | Aug 2005 | B2 |
6927683 | Sugimoto et al. | Aug 2005 | B2 |
6932638 | Burrows et al. | Aug 2005 | B1 |
6936857 | Doxsee et al. | Aug 2005 | B2 |
6943357 | Srivastava et al. | Sep 2005 | B2 |
6948829 | Verdes et al. | Sep 2005 | B2 |
6956243 | Chin | Oct 2005 | B1 |
6964878 | Horng et al. | Nov 2005 | B2 |
6967445 | Jewell et al. | Nov 2005 | B1 |
6971760 | Archer et al. | Dec 2005 | B2 |
6974924 | Agnatovech et al. | Dec 2005 | B2 |
6982518 | Chou et al. | Jan 2006 | B2 |
6983506 | Brown | Jan 2006 | B1 |
7022260 | Morioka | Apr 2006 | B2 |
7042150 | Yasuda | May 2006 | B2 |
7058103 | Ishida et al. | Jun 2006 | B2 |
D525374 | Maxik et al. | Jul 2006 | S |
7073920 | Konkle, Jr. et al. | Jul 2006 | B2 |
7074631 | Erchak et al. | Jul 2006 | B2 |
7075112 | Roberts et al. | Jul 2006 | B2 |
7078732 | Reeh et al. | Jul 2006 | B1 |
D527119 | Maxik et al. | Aug 2006 | S |
7086756 | Maxik | Aug 2006 | B2 |
7086767 | Sidwell et al. | Aug 2006 | B2 |
D528673 | Maxik et al. | Sep 2006 | S |
D531740 | Maxik | Nov 2006 | S |
D532532 | Maxik | Nov 2006 | S |
7138666 | Erchak et al. | Nov 2006 | B2 |
7161311 | Mueller et al. | Jan 2007 | B2 |
7186016 | Jao | Mar 2007 | B2 |
7213934 | Zarian et al. | May 2007 | B2 |
7239080 | Ng et al. | Jul 2007 | B2 |
7241039 | Hulse | Jul 2007 | B2 |
7246919 | Porchia et al. | Jul 2007 | B2 |
7261454 | Ng | Aug 2007 | B2 |
7270446 | Chang et al. | Sep 2007 | B2 |
7288798 | Chang et al. | Oct 2007 | B2 |
7315119 | Ng et al. | Jan 2008 | B2 |
7319293 | Maxik | Jan 2008 | B2 |
7344279 | Mueller et al. | Mar 2008 | B2 |
7350933 | Ng et al. | Apr 2008 | B2 |
7367692 | Maxik | May 2008 | B2 |
7396142 | Laizure, Jr. et al. | Jul 2008 | B2 |
7489031 | Roberts et al. | Feb 2009 | B2 |
7513669 | Chua et al. | Apr 2009 | B2 |
7524097 | Turnbull et al. | Apr 2009 | B2 |
7550319 | Wang et al. | Jun 2009 | B2 |
7677765 | Tajul et al. | Mar 2010 | B2 |
8075172 | Davey et al. | Dec 2011 | B2 |
20010008436 | Gleckman | Jul 2001 | A1 |
20010009400 | Maeno et al. | Jul 2001 | A1 |
20010019134 | Chang et al. | Sep 2001 | A1 |
20010026447 | Herrera | Oct 2001 | A1 |
20010035264 | Padmanabhan | Nov 2001 | A1 |
20010053077 | Anwly-Davies et al. | Dec 2001 | A1 |
20020021573 | Zhang | Feb 2002 | A1 |
20020039872 | Asai et al. | Apr 2002 | A1 |
20020068775 | Munzenberger | Jun 2002 | A1 |
20020070449 | Yagi et al. | Jun 2002 | A1 |
20020085379 | Han et al. | Jul 2002 | A1 |
20020093287 | Chen | Jul 2002 | A1 |
20020097586 | Horowitz | Jul 2002 | A1 |
20020117692 | Lin | Aug 2002 | A1 |
20020126491 | Chen | Sep 2002 | A1 |
20020145863 | Stultz | Oct 2002 | A1 |
20020149312 | Roberts et al. | Oct 2002 | A1 |
20020153829 | Asai et al. | Oct 2002 | A1 |
20020154449 | Raphael et al. | Oct 2002 | A1 |
20020176246 | Chen | Nov 2002 | A1 |
20020183438 | Amarasekera et al. | Dec 2002 | A1 |
20020186538 | Kase et al. | Dec 2002 | A1 |
20020191416 | Wesson | Dec 2002 | A1 |
20030025449 | Rossner | Feb 2003 | A1 |
20030043579 | Rong et al. | Mar 2003 | A1 |
20030048632 | Archer | Mar 2003 | A1 |
20030058658 | Lee | Mar 2003 | A1 |
20030072156 | Pohlert et al. | Apr 2003 | A1 |
20030079387 | Derose | May 2003 | A1 |
20030111955 | McNulty et al. | Jun 2003 | A1 |
20030128629 | Stevens | Jul 2003 | A1 |
20030142508 | Lee | Jul 2003 | A1 |
20030164666 | Crunk | Sep 2003 | A1 |
20030185020 | Stekelenburg | Oct 2003 | A1 |
20030193841 | Crunk | Oct 2003 | A1 |
20030201903 | Shen | Oct 2003 | A1 |
20030230045 | Krause et al. | Dec 2003 | A1 |
20030231510 | Tawa et al. | Dec 2003 | A1 |
20040001338 | Pine | Jan 2004 | A1 |
20040004435 | Hsu | Jan 2004 | A1 |
20040004441 | Yano | Jan 2004 | A1 |
20040007980 | Shibata | Jan 2004 | A1 |
20040008525 | Shibata | Jan 2004 | A1 |
20040014414 | Horie et al. | Jan 2004 | A1 |
20040039274 | Benaron et al. | Feb 2004 | A1 |
20040039764 | Gonikberg et al. | Feb 2004 | A1 |
20040056600 | Lapatovich et al. | Mar 2004 | A1 |
20040085017 | Lee | May 2004 | A1 |
20040085758 | Deng | May 2004 | A1 |
20040101802 | Scott | May 2004 | A1 |
20040105262 | Tseng et al. | Jun 2004 | A1 |
20040113549 | Roberts et al. | Jun 2004 | A1 |
20040114352 | Jensen | Jun 2004 | A1 |
20040114367 | Li | Jun 2004 | A1 |
20040125034 | Shen | Jul 2004 | A1 |
20040125515 | Popovich | Jul 2004 | A1 |
20040127138 | Huang | Jul 2004 | A1 |
20040179355 | Gabor | Sep 2004 | A1 |
20040183458 | Lee | Sep 2004 | A1 |
20040187313 | Zirk et al. | Sep 2004 | A1 |
20040189262 | McGrath | Sep 2004 | A1 |
20040190305 | Arik et al. | Sep 2004 | A1 |
20040201673 | Asai | Oct 2004 | A1 |
20040207334 | Lin | Oct 2004 | A1 |
20040208002 | Wu | Oct 2004 | A1 |
20040211589 | Chou et al. | Oct 2004 | A1 |
20040217693 | Duggal et al. | Nov 2004 | A1 |
20040233661 | Taylor | Nov 2004 | A1 |
20040245912 | Thurk et al. | Dec 2004 | A1 |
20040257804 | Lee | Dec 2004 | A1 |
20040264192 | Nagata et al. | Dec 2004 | A1 |
20050007010 | Lee | Jan 2005 | A1 |
20050007770 | Bowman et al. | Jan 2005 | A1 |
20050011481 | Naumann et al. | Jan 2005 | A1 |
20050015029 | Kim | Jan 2005 | A1 |
20050018424 | Popovich | Jan 2005 | A1 |
20050023540 | Yoko et al. | Feb 2005 | A1 |
20050030761 | Burgess | Feb 2005 | A1 |
20050031281 | Nath | Feb 2005 | A1 |
20050036299 | Tsai | Feb 2005 | A1 |
20050036616 | Huang et al. | Feb 2005 | A1 |
20050047170 | Hillburger et al. | Mar 2005 | A1 |
20050052885 | Wu | Mar 2005 | A1 |
20050057187 | Catalano | Mar 2005 | A1 |
20050063185 | Monjo et al. | Mar 2005 | A1 |
20050067343 | Zulauf et al. | Mar 2005 | A1 |
20050068776 | Ge | Mar 2005 | A1 |
20050084229 | Babbitt et al. | Apr 2005 | A1 |
20050099787 | Hayes | May 2005 | A1 |
20050105302 | Hofmann et al. | May 2005 | A1 |
20050110191 | Lin | May 2005 | A1 |
20050110384 | Peterson | May 2005 | A1 |
20050111234 | Martin et al. | May 2005 | A1 |
20050129979 | Kambe et al. | Jun 2005 | A1 |
20050141221 | Yu | Jun 2005 | A1 |
20050151664 | Kolish et al. | Jul 2005 | A1 |
20050152136 | Konkle et al. | Jul 2005 | A1 |
20050162864 | Verdes et al. | Jul 2005 | A1 |
20050174065 | Janning | Aug 2005 | A1 |
20050174769 | Yong et al. | Aug 2005 | A1 |
20050174780 | Park | Aug 2005 | A1 |
20050179358 | Soules et al. | Aug 2005 | A1 |
20050180136 | Popovich | Aug 2005 | A9 |
20050180137 | Hsu | Aug 2005 | A1 |
20050190561 | Ng et al. | Sep 2005 | A1 |
20050207152 | Maxik | Sep 2005 | A1 |
20050207159 | Maxik | Sep 2005 | A1 |
20050217996 | Liu et al. | Oct 2005 | A1 |
20050224829 | Negley et al. | Oct 2005 | A1 |
20050230691 | Amiotti et al. | Oct 2005 | A1 |
20050233485 | Shishov et al. | Oct 2005 | A1 |
20050237995 | Puranik | Oct 2005 | A1 |
20050243539 | Evans et al. | Nov 2005 | A1 |
20050243550 | Stekelenburg | Nov 2005 | A1 |
20050243552 | Maxik | Nov 2005 | A1 |
20050255026 | Barker et al. | Nov 2005 | A1 |
20050258446 | Raos et al. | Nov 2005 | A1 |
20050259419 | Sandoval | Nov 2005 | A1 |
20050265039 | Lodhie et al. | Dec 2005 | A1 |
20050270780 | Zhang | Dec 2005 | A1 |
20050276034 | Malpetti | Dec 2005 | A1 |
20050276051 | Caudle et al. | Dec 2005 | A1 |
20050276053 | Nortrup et al. | Dec 2005 | A1 |
20050276072 | Hayashi et al. | Dec 2005 | A1 |
20050285494 | Cho et al. | Dec 2005 | A1 |
20060002110 | Dowling et al. | Jan 2006 | A1 |
20060007410 | Masuoka et al. | Jan 2006 | A1 |
20060034077 | Chang | Feb 2006 | A1 |
20060044803 | Edwards | Mar 2006 | A1 |
20060050514 | Opolka | Mar 2006 | A1 |
20060061985 | Elkins | Mar 2006 | A1 |
20060071591 | Takezawa et al. | Apr 2006 | A1 |
20060092644 | Mok et al. | May 2006 | A1 |
20060142946 | Goujon et al. | Jun 2006 | A1 |
20060145172 | Su et al. | Jul 2006 | A1 |
20060158886 | Lee | Jul 2006 | A1 |
20060176699 | Crunk | Aug 2006 | A1 |
20060187653 | Olsson | Aug 2006 | A1 |
20060193121 | Kamoshita | Aug 2006 | A1 |
20060193130 | Ishibashi | Aug 2006 | A1 |
20060198147 | Ge | Sep 2006 | A1 |
20060208260 | Sakuma et al. | Sep 2006 | A1 |
20060226772 | Tan et al. | Oct 2006 | A1 |
20060243997 | Yang et al. | Nov 2006 | A1 |
20060250802 | Herold | Nov 2006 | A1 |
20060255353 | Taskar et al. | Nov 2006 | A1 |
20060261359 | Huang | Nov 2006 | A1 |
20060273340 | Lv | Dec 2006 | A1 |
20060274524 | Chang et al. | Dec 2006 | A1 |
20060289884 | Soules et al. | Dec 2006 | A1 |
20070018181 | Steen et al. | Jan 2007 | A1 |
20070057364 | Wang et al. | Mar 2007 | A1 |
20070086189 | Raos et al. | Apr 2007 | A1 |
20070090391 | Diamantidis | Apr 2007 | A1 |
20070090737 | Hu et al. | Apr 2007 | A1 |
20070120879 | Kanade et al. | May 2007 | A1 |
20070125982 | Tian et al. | Jun 2007 | A1 |
20070139949 | Tanda et al. | Jun 2007 | A1 |
20070153518 | Chen | Jul 2007 | A1 |
20070291490 | Tajul et al. | Dec 2007 | A1 |
20080013316 | Chiang | Jan 2008 | A1 |
20080048200 | Mueller et al. | Feb 2008 | A1 |
20080070331 | Ke | Mar 2008 | A1 |
20090001372 | Arik et al. | Jan 2009 | A1 |
20090324875 | Heikkila | Dec 2009 | A1 |
20100177534 | Ryu et al. | Jul 2010 | A1 |
Number | Date | Country |
---|---|---|
0658933 | Oct 2001 | EP |
63086484 | Apr 1988 | JP |
07-99372 | Apr 1995 | JP |
3351103 | Nov 2002 | JP |
0261805 | Aug 2002 | WO |
2004100213 | Nov 2004 | WO |
2005060309 | Jun 2005 | WO |
2007069119 | Jun 2007 | WO |
Entry |
---|
Non Final Office Action received for U.S. Appl. No. 12/299,043, mailed on Apr. 15, 2011, 60 pages. |
Office Action received for Chinese Patent Application No. 200780015112.2, mailed on Apr. 8, 2010, 9 pages of Office Action and 16 pages of English Translation. |
Office Action received for NZ Patent Application No. 573336, mailed on Apr. 19, 2010, 2 pages. |
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2007/010469, issued on Nov. 4, 2008, 12 pages. |
International Search Report received for PCT Patent Application No. PCT/US2007/010469, mailed on Aug. 7, 2008, 2 pages. |
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2007/010470, issued on Nov. 27, 2008, 5 pages. |
International Search report received for PCT Patent Application No. PCT/US2007/010470, mailed on Sep. 29, 2008, 7 pages. |
International Preliminary Report on Patentability and Written Opinion received for PCT Patent Application No. PCT/US2008/011365, mailed on Apr. 15, 2010, 7 pages. |
International Search Report and Written Opinion received for PCT Patent Application No. PCT/US2008/011365, mailed on Dec. 5, 2008, 6 pages. |
Non Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Jun. 16, 2011, 74 pages. |
Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Jan. 4, 2012, 24 pages. |
Final Office Action received for U.S. Appl. No. 12/299,003, mailed on Oct. 5, 2011, 16 pages. |
Non Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Mar. 16, 2012, 11 pages. |
Non Final Office Action received for U.S. Appl. No. 12/299,003 mailed on Jun. 13, 2012, 23 pages. |
Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Sep. 5, 2012, 15 pages. |
Number | Date | Country | |
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20110050098 A1 | Mar 2011 | US |
Number | Date | Country | |
---|---|---|---|
60977144 | Oct 2007 | US |