The present application relates to the use of the large imaging plates. The application subject matter finds particular use in computed tomography (CT) scanners and will be described with particular reference thereto. However, the invention finds use in connection with DF and RF imaging, x-ray fluoroscopy, radiography, and other examination systems for medical and non-medical examinations.
Computed tomography (CT) imaging typically employs an x-ray source that generates a fan-beam, wedge-beam, or cone-beam of x-rays that traverse an examination region. A subject arranged in the examination region interacts with and absorbs a portion of the traversing x-rays. A two-dimensional radiation detector including an array of detector elements is arranged opposite the x-ray source to detect and measure intensities of the transmitted x-rays.
Typically, the x-ray source and the radiation detector are mounted at opposite sides of a rotating gantry such that the gantry is rotated to obtain an angular range of projection views of the subject. In some configurations the x-ray source is mounted on the rotating gantry while the radiation detector is mounted on a stationary gantry. In either configuration, the projection views are reconstructed using filtered backprojection or another reconstruction method to produce a three-dimensional image representation of the subject or of a selected portion thereof.
The radiation detector typically includes an imaging plate consisting of an array of scintillation crystals which produce bursts of light, called scintillation events, in response to x-rays. An array of photodetectors such as a photodiode array is arranged to view the scintillation crystals and produce analog electrical signals indicative of the spatial location and intensity of the scintillation event. Large imaging plates, for the use in the CT scanners and general medical examinations, include an assembly of pixels independently responsive to the incident x-rays and generating electrical signals, which are used to generate a digital image. In some detectors the scintillator assembly includes an array of individual crystals which are assembled together or cut from a common scintillator plate, e.g., by photoetching or other semiconductor manufacturing techniques. To improve resolution in some large area imaging plates, the scintillation crystals are alkali halide needle crystals of a very small diameter. The needle crystals are grown to an appropriate length to ensure an adequate absorption of the x-rays to deliver a good optical image to the underlying photodiode array. The bundle of such grown needle crystals traps the x-rays and delivers an optical image of higher resolution to the underlying photodiode array.
The major disadvantage of the alkali needle crystals is the deliquescence. Such crystals must be protected from the ambient moisture by the hermetic sealing.
The present invention contemplates an improved method and apparatus which overcomes the above-referenced problems and others.
In accordance with one aspect of the present application, a radiation detector is disclosed. The radiation detector comprises a two-dimensional array of nondeliquescent ceramic scintillating fibers or sheets, which array views radiation events and converts the radiation events into visible light.
In accordance with another aspect of the present application, a method of manufacturing a radiation detector is disclosed. A two-dimensional scintillation array of nondeliquescent ceramic scintillating fibers or sheets is fabricated. The array converts received radiation events into visible light.
One advantage of the present application resides in the ability to shape and scale the detector array.
Another advantage resides in the absence of the deliquescence.
Yet another advantage resides in the radiation stability.
Numerous additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments.
The invention may take form in various components and arrangements of components, and in various process operations and arrangements of process operations. The drawings are only for the purpose of illustrating preferred embodiments and are not to be construed as limiting the invention.
With reference to
Preferably, the rotating gantry 22 rotates simultaneously with linear advancement of the subject support 20 to produce a generally helical trajectory of the x-ray source 14 and collimator 16 about the examination region 18. However, other imaging modes can also be employed, such as a single- or multi-slice imaging mode in which the gantry 22 rotates as the subject support 20 remains stationary to produce a generally circular trajectory of the x-ray source 14 over which an axial image is acquired. After the axial image is acquired, the subject support optionally steps a pre-determined distance in the Z-direction and the axial image acquisition is repeated to acquire volumetric data in discrete steps along the Z-direction.
A radiation detector or detector array 24 is arranged on the gantry 22 across from the x-ray source 14. The radiation detector 24 includes a scintillation layer or array 26 of ceramic scintillating needles and spans a selected angular range that preferably comports with a fan angle of the x-ray beam. The radiation detector 24 also extends along the Z-direction. The detector 30 acquires a series of projection views as the gantry 22 rotates. It is also contemplated to arrange the radiation detector on a stationary portion of the gantry encircling the rotating gantry such that the x-rays continuously impinge upon a continuously shifting portion of the radiation detector during source rotation. Preferably, a spatial resolution of the scanner 10 is controlled by a grid 28, such as an anti-scatter grid, which is arranged on a radiation receiving face of the array 26 of scintillating needles. The grid 28 has apertures 30 which define the effective cross-section of each of the radiation rays that define the pixels of the views. An array 32 of photodiodes or other photodetectors 34 is provided on an opposite side of the scintillator needle array 26. The diodes 34 are sized and arranged to correspond to the apertures 30 in the grid 28. Alternatively, there may be no grid, in which case the spatial resolution is a function of the photodiode array.
With continuing reference to
A reconstruction processor 42 reconstructs the acquired projection data, using filtered backprojection, an n-PI reconstruction method, or other reconstruction method, to generate a three-dimensional image representation of the subject or of a selected portion thereof which is stored in an image memory 44. The image representation is rendered or otherwise manipulated by a video processor 46 to produce a human-viewable image that is displayed on a user interface 48 or another display device, printing device, or the like for viewing by an operator.
Preferably, the user interface 48 is additionally programmed to interface a human operator with the CT scanner 12 to allow the operator to initialize, execute, and control CT imaging sessions. The user interface 48 is optionally interfaced with a communication network such as a hospital or clinic information network via which image reconstructions are transmitted to medical personnel, a patient information database is accessed, or the like.
With reference to
With reference to FIGS. 3 and 4A-B, a vertical sintering press 60 produces GOS disc(s) or wafer(s) 62 by sintering GOS powder layer or layers 64 appropriately at 1250° C. and 100-200 MPa of pressure. More specifically, the GOS powder layer 64 is pressed between an anvil 66 and a piston 68. The GOS powder layer 64 is preferably a finely divided layer with a starting thickness h1 of about 0.14 mm to make circular GOS discs 62 of a diameter d1 equal to 25-125 mm. Of course, it is also contemplated that the GOS discs 62 might be a square with each side d1 equal to 25-125 mm. A final thickness h2 of each disc 62 is preferably 0.1-0.3 mm. In one embodiment, the press 60 simultaneously produces the plurality of the GOS discs 62 by interlaying the GOS powder layers 64 with spacers 70. The materials used for the spacers 70 include, but are not limited to, molybdenum, molybdenum alloy, and other such refractory materials that are known for withstanding a high temperature. A thickness h3 of the spacers 70 is preferably equal to or exceeds 20 mm. In one embodiment, the spacers 70 are refractory-metal discs, preferably 30 μm thick. Such thin spacers allow a 30 cm high vertical sintering press 60, which is readily available in the industry, to manufacture over 1,000 GOS discs 0.1 mm thick each in a single cycle. Of course, it is also contemplated that the GOS discs 62 might be manufactured to have different thicknesses by appropriately adjusting the thickness h1 of the GOS powder layer 64.
Preferably, the spacers 70 are coated with a spacer coating layer 72 to ease a release of the GOS discs 62 after sintering. The materials, such as boron nitride and the like that are used for the spacer coating layer 72, produce a smooth glossy optical surface which results in elimination of further polishing. Preferably, upper and lower faces 80, 82 of each disc 62 are skimmed to remove any defective surfaces and polished.
With reference to
With reference to
With reference again to
In one embodiment, the 100-200μ thick discs 62 are coated with the first layer 86 and stacked together into the first block 84. The first block 84 is diced with the multi-wire saw 90 in the first direction W into the plates 92 each with the thickness d2, equal to about 1-1.04 mm. The plates 92 are coated with the second layer 96 and stacked together into the second block 94. The second block 94 is sliced in the second direction X, orthogonal to the first direction W, with the multi-wire saw 90 to form the ceramic fiber optic scintillation strips 50 with the thickness h8 equal to about 1.4 mm.
With continuing reference to
In one embodiment, the photodiode array 32 includes BIP or back-illuminated diodes 34 and is a single, monolithic, semiconductor substrate having functional integrated circuitry formed thereon. The functional integrated circuitry includes a matrix of photosensitive elements or “pixels,” preferably photodiodes, formed on the light receiving side. The integrated circuitry of the array 32 is generally manufactured from silicon or other semiconductor wafers using established integrated circuit fabrication processes, such as masking, evaporation, etching, and diffusion processes, and so forth.
With reference to
With reference to
With reference to
The application has been described with reference to the preferred embodiments. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the application be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
This application claims the benefit of U.S. provisional application Ser. No. 60/623,748 filed Oct. 29, 2004, which is incorporated herein by reference.
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/IB2005/053359 | 10/12/2005 | WO | 00 | 4/20/2007 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2006/046163 | 5/4/2006 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4234792 | DeCou et al. | Nov 1980 | A |
4734588 | Akai | Mar 1988 | A |
4799094 | Rougeot | Jan 1989 | A |
4948978 | Guyot | Aug 1990 | A |
4980553 | Henry | Dec 1990 | A |
4985633 | Vieux et al. | Jan 1991 | A |
5150394 | Karellas | Sep 1992 | A |
5198673 | Rougeot et al. | Mar 1993 | A |
5262649 | Antonuk et al. | Nov 1993 | A |
5449449 | Vieux et al. | Sep 1995 | A |
6426991 | Mattson et al. | Jul 2002 | B1 |
6448566 | Riedner et al. | Sep 2002 | B1 |
6453899 | Tselesin | Sep 2002 | B1 |
6510195 | Chappo et al. | Jan 2003 | B1 |
6553092 | Mattson et al. | Apr 2003 | B1 |
6778637 | Luhta et al. | Aug 2004 | B2 |
7091490 | Sumiya et al. | Aug 2006 | B2 |
7132664 | Crosetto | Nov 2006 | B1 |
20030236388 | Armstrong et al. | Dec 2003 | A1 |
20070096031 | Meier et al. | May 2007 | A1 |
20070263764 | Mccallum et al. | Nov 2007 | A1 |
20080210877 | Altman et al. | Sep 2008 | A1 |
20090008562 | Grazioso et al. | Jan 2009 | A1 |
Number | Date | Country |
---|---|---|
1132754 | Sep 2001 | EP |
Number | Date | Country | |
---|---|---|---|
20080063138 A1 | Mar 2008 | US |
Number | Date | Country | |
---|---|---|---|
60623748 | Oct 2004 | US |