The present invention relates to a cutting tool hard film disposed as coating on a surface of a cutting tool and a hard film coated cutting tool provided with the hard film and particularly to an improvement for increasing both abrasion resistance and welding resistance.
Cutting tools such as drills and taps are provided and coated with a hard film to increase abrasion resistance. TiN-based, TiCN-based, TiAlN-based and AlCrN-based coatings are widely used for this cutting tool hard film and improvements are achieved for further increasing performance thereof. For example, this corresponds to a hard laminated film described in Patent Document 1.
However, a cutting tool with a hard film formed by the conventional technique as described above may have insufficient welding resistance at the time of cutting depending on a type of work material and a cutting condition. Therefore, a tool life may be shortened due to welding of work material etc., and room for improvement exists. Therefore, it is requested to develop a cutting tool hard film and a hard film coated cutting tool excellent in both abrasion resistance and welding resistance.
The present invention was conceived in view of the situations and it is therefore an object of the present invention to provide a cutting tool hard film and a hard film coated cutting tool excellent in both abrasion resistance and welding resistance.
To achieve the object, the first aspect of the invention provides a cutting tool hard film disposed as coating on a surface of a cutting tool, wherein the cutting tool hard film is a multilayer film having a first film layer comprising AgaCu1-a, and a second film layer comprising nitride, oxide, carbide, carbonitride, or boride containing at least one element out of group IVa elements, group Va elements, group VIa elements, Al, and Si alternately laminated in two or more layers, wherein an atom ratio a related to the first film layer is within a range of 0.2 or more and 0.4 or less, wherein a lamination cycle of the first film layer and the second film layer is within a range of 0.2 nm or more and 100 nm or less, and wherein a total film thickness is within a range of 0.2 μm or more and 10.0 μm or less.
As described above, according to the first aspect of the invention, the cutting tool hard film is a multilayer film having a first film layer comprising AgaCu1-a, and a second film layer comprising nitride, oxide, carbide, carbonitride, or boride containing at least one element out of group IVa elements, group Va elements, group VIa elements, Al, and Si alternately laminated in two or more layers, an atom ratio a related to the first film layer is within a range of 0.2 or more and 0.4 or less, a lamination cycle of the first film layer and the second film layer is within a range of 0.2 nm or more and 100 nm or less, and a total film thickness is within a range of 0.2 μm or more and 10.0 μm or less; therefore, since Ag is contained in the film, friction coefficient and cutting resistance can be reduced; and a high hardness film excellent in lubricity and welding resistance can be provided. Thus, a cutting tool hard film excellent in both abrasion resistance and welding resistance can be provided.
The second aspect of the invention which depends from the first aspect of the invention provides a hard film coated cutting tool having the cutting tool hard film recited in the first aspect of the invention disposed as coating on a surface. Consequently, since Ag is contained in the film, friction coefficient and cutting resistance can be reduced, and a high hardness film excellent in lubricity and welding resistance is acquired. Thus, a hard film coated cutting tool excellent in both abrasion resistance and welding resistance can be provided.
A cutting tool hard film of the present invention is preferably applied to surface coating of various cutting tools including rotary cutting tools such as end mills, drills, face mills, forming mills, reamers, and taps, as well as non-rotary cutting tools such as tool bits. Although cemented carbide and high speed tool steel are preferably used as tool base material, i.e., material of a member provided with the hard film, other materials are also available and, for example, the cutting tool hard film of the present invention is widely applied to cutting tools made of various materials such as cermet, ceramics, polycrystalline diamond, single-crystal diamond, polycrystalline CBN, and single-crystal CBN.
The cutting tool hard film of the present invention is disposed as coating on a portion or the whole of the surface of a cutting tool and is preferably disposed on a cutting portion involved with cutting in the cutting tool. More preferably, the cutting tool hard film is disposed to coat at least a cutting edge or a rake surface in the cutting portion.
The second film layer is made of nitride, oxide, carbide, carbonitride, or boride containing at least one element out of group IVa elements, group Va elements, group VIa elements, Al, and Si, or mutual solid solution thereof. Specifically, the second film layer comprises TiN, TiAlN, TiAlCrVSiB, TiSiO, TiWC, ZrVO, ZrNbB, HfTaCN, NbN, CrN, MoSiC, AlN, AlCrSiCN, SiN, etc.
Film thicknesses of the first film layer and the second film layer are respectively defined depending on composition etc., and if pluralities of the layers are repeatedly laminated, the respective film thicknesses may be constant or may be changed continuously or stepwise. Although average film thicknesses of the first film layers and the second film layers vary depending on a member to be coated, composition of the film, etc., appropriate average film thicknesses are within a range of about 0.1 to 90 nm, for example.
Although the first and second film layers are preferably disposed by, for example, a PVD method such as an arc ion plating method, an ion beam deposition method, a sputtering method, a PLD (Pulse Laser Deposition) method, and an IBAD (Ion Beam Assisted Deposition) method, other film formation methods are also employable.
A preferred embodiment of the present invention will now be described in detail with reference to the drawings. In the drawings used in the following description, portions are not necessarily precisely depicted in terms of dimension ratio, etc.
The first film layer 24 comprises AgaCu1-a containing unavoidable impurities. An atom ratio (mixed crystal ratio) a related to the first film layer 24 is within a range of 0.2 or more and 0.4 or less (0.2≦a≦0.4). The second film layer 26 consists of nitride, oxide, carbide, carbonitride, or boride containing at least one element out of group IVa elements, group Va elements, group VIa elements, Al, and Si, or mutual solid solution thereof, and contains unavoidable impurities. Specifically, the second film layer 26 comprises TiN, TiAlN, TiAlCrVSiB, TiSiO, TiWC, ZrVO, ZrNbB, HfTaCN, NbN, CrN, MoSiC, AlN, AlCrSiCN, SiN, etc.
The hard film 22 preferably has the first film layers 24 and the second film layers 26 formed with respective predefined constant film thicknesses (average film thicknesses). Although the respective average film thicknesses of the first film layers 24 and the second film layers 26 are separately set depending on a member to be coated, composition of the film, etc., preferably, an average film thickness d1 of the first film layers 24 and an average film thickness d2 of the second film layers 26 are appropriately defined within ranges of 0.1 to 90.0 nm and 0.1 to 75.0 nm, respectively. A lamination cycle d3 of the first film layer 24 and the second film layer 26 is within a range of 0.2 nm or more and 100 nm or less. The number of laminated layers of the first film layers 24 and the second film layers 26 (the total layer number of the first film layers 24 and the second film layers 26) is preferably within a range of 30 to 6300, Therefore, the respective layer numbers of the first film layers 24 and the second film layers 26 are preferably within a range of 15 to 3150. A total film thickness D of the hard film 22 is within a range of 0.2 μm or more and 10.0 μm or less.
Subsequently, the first film layer 24 and the second film layer 26 are alternately formed on the surface of the tool base material 20 in a sputtering process. For example, in formation of the second film layer 26, a constant negative bias voltage (e.g., about −50 to −60 V) is applied by a power source 40 to a target 38 such as TiAl making up the second film layer 26 while a constant negative bias voltage (e.g., about −100 V) is applied by the bias power source 34 to the tool base material 20 so as to cause the argon ions Ar+ to collide with the target 38, thereby beating out constituent material such as TiAl. Reactant gas such as nitrogen gas (N2) and hydrocarbon gas (CH4, C2H2) is introduced into the chamber 32 at predetermined flow rates in addition to argon gas, and nitrogen atoms N and carbon atoms C combine with TiAl etc. beaten out from the target 38 to form TiAlN etc., which are attached as the second film layer 26 etc. in the hard film 22 to the surface of the tool base material 20. Alternatively, targets may be formed for respective elementary substances such as Ti, Al, and the sputtering may be performed by using the multiple targets at the same time to form the second film layer 26 comprising TiAlN etc. In the sputtering step, a positive voltage may be applied to the tool base material 20. By alternately attaching the first film layer 24 and the second film layer 26 to the surface of the tool base material 20 as described above, the hard film 22 is formed on the surface of the tool base material 20.
A drilling test conducted by the present inventors for verifying an effect of the present invention will then be described.
[Machining Conditions]
Tool shape: φ8.3 cemented carbide drill
Work material: Inconel (registered trademark) 718
Cutting machine: vertical type M/C
Cutting speed: 10 m/min
Feed speed: 0.1 mm/rev
Machining depth: 33 mm (blind)
Step amount: non-step
Cutting oil: oil-based
As depicted in
Particularly, the inventive product 4 has the first film layer 24 comprising Ag0.4Cu0.6, the second film layers 26 comprising AlN, the average film thickness of 0.5 nm for the first film layers 24, the average film thickness of 36.5 nm for the second film layers 26, the lamination cycle of 37.0 nm, the layer number of 150, and the total film thickness of 2.8 μm and results in the machined hole number of 41; the inventive product 2 has the first film layer 24 comprising Ag0.3Cu0.7, the second film layers 26 comprising CrN, the average film thickness of 5.0 nm for the first film layers 24, the average film thickness of 10.0 nm for the second film layers 26, the lamination cycle of 15.0 nm, the layer number of 400, and the total film thickness of 3.0 μm and results in the machined hole number of 36; the inventive product 12 has the first film layer 24 comprising Ag0.4Cu0.6, the second film layers 26 comprising ZrNbB, the average film thicknesses of 0.1 nm for both the first film layers 24 and the second film layers 26, the lamination cycle of 0.2 nm, the layer number of 2000, and the total film thickness of 0.2 μm and results in the machined hole number of 36; the inventive product 13 has the first film layer 24 comprising Ag0.4Cu0.6, the second film layers 26 comprising TiSiO, the average film thickness of 5.0 nm for the first film layers 24, the average film thickness of 0.1 nm for the second film layers 26, the lamination cycle of 5.1 nm, the layer number of 3200, and the total film thickness of 8.2 μm and results in the machined hole number of 35: and, therefore, it can be seen that these inventive products result in the machined hole numbers equal to or greater than 35 when the flank wear width is 0.2 mm and exhibit particularly favorable cutting performance.
As depicted in
As described above, this embodiment provides a multilayer film having the first film layer 24 comprising AgaCu1-a and the second film layer 26 comprising nitride, oxide, carbide, carbonitride, or boride containing at least one element out of group IVa elements, group Va elements, group VIa elements, Al, and Si alternately laminated in two or more layers; the atom ratio a related to the first film layer 24 is within a range of 0.2 or more and 0.4 or less; the lamination cycle d3 of the first film layer 24 and the second film layer 26 is within a range of 0.2 nm or more and 100 nm or less; and the total film thickness D is within a range of 0.2 μm or more and 10.0 μm or less; therefore, since Ag is contained in the film, friction coefficient and cutting resistance can be reduced; and a high hardness film excellent in lubricity and welding resistance can be provided. Thus, the hard film 22 can be provided as a cutting tool hard film excellent in both abrasion resistance and welding resistance.
This embodiment provides the drill 10 having the hard film 22 disposed as coating on a surface and, therefore, since Ag is contained in the film, friction coefficient and cutting resistance can be reduced, and a high hardness film excellent in lubricity and welding resistance is acquired. Thus, the drill 10 can be provided as a hard film coated cutting tool excellent in both abrasion resistance and welding resistance.
Although the preferred embodiment of the present invention has been described in detail with reference to the drawings, the present invention is not limited thereto and is implemented with various modifications applied within a range not departing from the spirit thereof.
10: drill (hard film coated cutting tool) 12: cutting edge 14: shank 16: body 18: flutes 20: tool base material 22: hard film (cutting tool hard film) 24: first film layer 26: second film layer 30: sputtering apparatus 32: chamber 34: bias power source 36: controller 38: target 40: power source
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2012/059738 | 4/9/2012 | WO | 00 | 10/1/2014 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2013/153614 | 10/17/2013 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5268216 | Keem | Dec 1993 | A |
5851687 | Ljungberg | Dec 1998 | A |
5948548 | Welty | Sep 1999 | A |
5980988 | Ljungberg | Nov 1999 | A |
6299658 | Moriguchi et al. | Oct 2001 | B1 |
6469278 | Boyce | Oct 2002 | B1 |
6489036 | Sherman | Dec 2002 | B1 |
7799420 | Beck et al. | Sep 2010 | B2 |
20040018393 | Fukui et al. | Jan 2004 | A1 |
20050011748 | Beck et al. | Jan 2005 | A1 |
20060257691 | Trinh et al. | Nov 2006 | A1 |
20070259204 | Isshiki | Nov 2007 | A1 |
20080131219 | Reineck et al. | Jun 2008 | A1 |
20080131677 | Reineck et al. | Jun 2008 | A1 |
20080254282 | Kukino et al. | Oct 2008 | A1 |
20100086370 | Nagano et al. | Apr 2010 | A1 |
20100101866 | Bird | Apr 2010 | A1 |
20100304171 | Tomantschger et al. | Dec 2010 | A1 |
20110117344 | Chen et al. | May 2011 | A1 |
20110135898 | Bohlmark et al. | Jun 2011 | A1 |
20120114960 | Takesawa et al. | May 2012 | A1 |
20120247948 | Shin et al. | Oct 2012 | A1 |
20150072126 | Sakurai et al. | Mar 2015 | A1 |
20150072135 | Sakurai et al. | Mar 2015 | A1 |
Number | Date | Country |
---|---|---|
1107901 | Sep 1995 | CN |
1211284 | Mar 1999 | CN |
1470350 | Jan 2004 | CN |
101027425 | Aug 2007 | CN |
101068759 | Nov 2007 | CN |
101557897 | Oct 2009 | CN |
102091923 | Jun 2011 | CN |
A-6-23601 | Feb 1994 | JP |
H06-23601 | Feb 1994 | JP |
A-10-249609 | Sep 1998 | JP |
A-2003-105565 | Apr 2003 | JP |
2005-500440 | Jan 2005 | JP |
2005-138209 | Jun 2005 | JP |
2005256095 | Sep 2005 | JP |
2008100345 | May 2008 | JP |
A-2010-76082 | Apr 2010 | JP |
2011156645 | Aug 2011 | JP |
2011-240438 | Dec 2011 | JP |
2004035864 | Apr 2004 | WO |
2010150411 | Dec 2010 | WO |
2011002008 | Jan 2011 | WO |
2011062450 | May 2011 | WO |
Entry |
---|
Jun. 26, 2012 International Search Report issued in International Application No. PCT/JP2012/059738. |
Castanho, J.M. et al. “Towards an Improvement of Performance of TiAlN Hard Coatings Using Metal Interlayers”. Mat. Res. Soc. Symp. Proc. vol. 750, pp. 1-5, 2003. |
Aug. 24, 2015 Office Action issued in Chinese Patent Application No. 201280072030.2. |
Wang, X.Q. et al., “Deposition, structure and hardness of Ti—Cu—N hard films prepared by pulse biased arc ion plating,” Elsevier, vol. 86, (2011), pp. 415-421. |
Musil, J., “Hard and superhard nanocomposite coatings,” Elsevier, Surface and Coatings Technology, vol. 125, (2000), pp. 322-330. |
Nov. 12, 2015 Office Action issued in Korean Patent Application No. 10-2014-7028617. |
Nov. 23, 2015 Extended Search Report issued in European Patent Application No. 12873507.3. |
Jan. 12, 2016 Office Action issued in Japanese Patent Application No. 2014-508945. |
Jun. 26, 2012 International Search Report issued in International Patent Application No. PCT/JP2012/059012. |
Feb. 18, 2016 Office Action issued in U.S. Appl. No. 14/389,929. |
Number | Date | Country | |
---|---|---|---|
20150072126 A1 | Mar 2015 | US |