K. Sato et al., "A Novel planar multilevel interconnection technology utilizing polyimide", IEEE Transaction on Parts, Ayamds and Packaging, vol. PHP-9 (Sep. 1973), pp. 176-180. |
Patent Abstracts of Japan, vol. 13, No. 278 (C-611) 26 Jun. 1989, & JP-A-01 075575 (Honny Chem Ind Co. Ltd.) 22 Mar. 1989. |
Patent Abstracts of Japan, vol. 12, No. 20 (E-575) (2867) 21 Jan. 1988, & JP-A-62 177950 (Hitachi) 01 Aug. 1987. |
IEEE Transactions on Electron Devices, vol. ED-26, No. 1, Jan. 1979, New York US pp. 77-83; A. Christo et al.: "Reliability of hybrid encapsulation based on fluorinated polymeric materials" p. 78, Para. A. |