characterised by the material

Industry

CPC
H01L23/29

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/29characterised by the material

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge encapsulation for high voltage devices
- Patent number 12,315,770
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Timothy Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,315,806
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages with wavelength-specific light filters
- Patent number 12,317,638
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 12,300,548
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 12,300,647
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
- Patent number 12,300,677
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing same
- Patent number 12,300,628
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,288,727
- Issue date Apr 29, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated sol-gel silica and method for producing same
- Patent number 12,286,541
- Issue date Apr 29, 2025
- Tokuyama Corporation
- Hiromasa Fujioka
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,289,901
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective laser annealing method
- Patent number 12,278,275
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module and manufacturing methods thereof
- Patent number 12,272,612
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component device
- Patent number 12,269,943
- Issue date Apr 8, 2025
- Resonac Corporation
- Yuma Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask encapsulation to prevent degradation during fabrication of hig...
- Patent number 12,266,535
- Issue date Apr 1, 2025
- Lam Researh Corporation
- Kapu Sirish Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having heterogeneous dielectric layers
- Patent number 12,266,581
- Issue date Apr 1, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,261,108
- Issue date Mar 25, 2025
- BITMAIN TECHNOLOGIES INC.
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, cured product of same and method for...
- Patent number 12,258,496
- Issue date Mar 25, 2025
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for curable resins, cured product of said composition,...
- Patent number 12,258,472
- Issue date Mar 25, 2025
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYESTER RESIN, RESIN COMPOSITION, CURED PRODUCT THEREOF, AND USE...
- Publication number 20250163228
- Publication date May 22, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...
- Publication number 20250167058
- Publication date May 22, 2025
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169123
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Seong Seok Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT WITH ORGANIC CONSTITUENT AND INORGANIC CONSTITUENT HAVI...
- Publication number 20250157869
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Patrick SCHRÖDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...
- Publication number 20250155489
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Akio MATSUSHITA
- G01 - MEASURING TESTING
Information Patent Application
3D-IC FOR RF APPLICATIONS
- Publication number 20250157988
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250157868
- Publication date May 15, 2025
- United Microelectronics Corp.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging module and manufacturing method therefor
- Publication number 20250157903
- Publication date May 15, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS
- Publication number 20250149507
- Publication date May 8, 2025
- SK HYNIX INC.
- Jae Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140729
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...
- Publication number 20250142924
- Publication date May 1, 2025
- NXP USA, Inc.
- Bernhard Grote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20250140769
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yunyi Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...
- Publication number 20250142918
- Publication date May 1, 2025
- Wolfspeed, Inc.
- Saptha Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FIXING PROTECTIVE MEMBER
- Publication number 20250140622
- Publication date May 1, 2025
- Disco Corporation
- Noboru TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...
- Publication number 20250140623
- Publication date May 1, 2025
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Zhiqiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER
- Publication number 20250140673
- Publication date May 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140629
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Shingo HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Flexible Encapsulant Ove...
- Publication number 20250132211
- Publication date Apr 24, 2025
- JCET STATS ChipPAC Korea Limited
- YeoJun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132215
- Publication date Apr 24, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Jiebin ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing semiconductor device with composite passivatio...

Edge encapsulation for high voltage devices

Semiconductor module

Electronic device and manufacturing method thereof

Sensor packages with wavelength-specific light filters

Moat coverage with dielectric film for device passivation and singu...

Electronic component module

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor device package including stress buffering layer

Module and method for manufacturing same

Die interconnect substrate, an electrical device and a method for f...

Package structure and method for forming same

Method of manufacturing a package having an adhesion promoter

Surface-treated sol-gel silica and method for producing same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Reinforcing resin composition, electronic component, method for man...

Selective laser annealing method

Semiconductor package module and manufacturing methods thereof

Metal-bump sidewall protection

Liquid resin composition for sealing and electronic component device

Mask encapsulation to prevent degradation during fabrication of hig...

Electronic substrates having heterogeneous dielectric layers

Hermetic package for high CTE mismatch

Flip chip package unit and associated packaging method

Chip heat dissipating structure, chip structure, circuit board and...

Semiconductor package having an encapulant comprising conductive fi...

Curable silicone composition, cured product of same and method for...

Composition for curable resins, cured product of said composition,...

Semiconductor manufacturing apparatus and method of manufacturing s...

Patents Applicationslast 30 patents

POLYESTER RESIN, RESIN COMPOSITION, CURED PRODUCT THEREOF, AND USE...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ENCAPSULANT WITH ORGANIC CONSTITUENT AND INORGANIC CONSTITUENT HAVI...

SEMICONDUCTOR PACKAGE

METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...

3D-IC FOR RF APPLICATIONS

SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

Packaging module and manufacturing method therefor

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT

SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...

PACKAGES WITH ISOLATED DIES

METHOD OF FIXING PROTECTIVE MEMBER

HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...

PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Flexible Encapsulant Ove...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...