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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/29characterised by the material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Type III-V semiconductor device with structured passivation
- Patent number 12,230,700
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulant strength enhancer
- Patent number 12,218,018
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free semiconductor device assemblies with multiple semico...
- Patent number 12,211,798
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal dissipation in flip-chip semiconductor devices usi...
- Patent number 12,211,763
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zone-controlled rare-earth oxide ALD and CVD coatings
- Patent number 12,209,307
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method of manufacturing the same
- Patent number 12,199,174
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a supporting member and bonded metal layers
- Patent number 12,191,223
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Xiaopeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid compression molding or encapsulant compositions
- Patent number 12,187,843
- Issue date Jan 7, 2025
- Henkel AG & Co. KGaA
- Jay Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including protective layer
- Patent number 12,183,645
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Kazunori Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with dual sealing materials
- Patent number 12,183,647
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- Soichi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, cured product thereof, and method for...
- Patent number 12,173,202
- Issue date Dec 24, 2024
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...
- Publication number 20250062169
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Frederik Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250062138
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20250062170
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Markus Wiesemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250063745
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20250062137
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Markus Wiesemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062302
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION
- Publication number 20250054827
- Publication date Feb 13, 2025
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Wan-Lan CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250054926
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE
- Publication number 20250034319
- Publication date Jan 30, 2025
- Asahi Kasei Kabushiki Kaisha
- Ryosuke OKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND...
- Publication number 20250029955
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250029883
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Shohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
- Publication number 20250029884
- Publication date Jan 23, 2025
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250022710
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Soichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
- Publication number 20250014957
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jingu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICO...
- Publication number 20250015006
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014958
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015014
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250006621
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND
- Publication number 20250006575
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cured product and production method of same, and resin sheet and re...

Method of manufacturing a package having an adhesion promoter

Package structure with warpage-control element

Type III-V semiconductor device with structured passivation

Methods for registration of circuit dies and electrical interconnects

Semiconductor module and power conversion apparatus

Semiconductor encapsulant strength enhancer

Chip package structure having molding layer

Electronic device

Glass carrier having protection structure and manufacturing method...

Semiconductor device and method of manufacturing the same

Substrate-free semiconductor device assemblies with multiple semico...

Enhanced thermal dissipation in flip-chip semiconductor devices usi...

Highly protective wafer edge sidewall protection layer

Zone-controlled rare-earth oxide ALD and CVD coatings

Electronic package including a protection layer

High electron mobility transistor and method of manufacturing the same

Semiconductor module

Semiconductor device with a supporting member and bonded metal layers

Liquid compression molding or encapsulant compositions

Semiconductor device with a dielectric between portions

Thermal conductive film

Electronic component including protective layer

Packaging of a semiconductor device with dual sealing materials

Semiconductor package and method manufacturing the same

Negative photosensitive resin composition, production method for po...

Curable silicone composition, cured product thereof, and method for...

Semiconductor die package with multi-lid structures and method for...

Embedded metal insulator metal structure

Package structure and method of manufacturing the same

Patents Applicationslast 30 patents

APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

SEMICONDUCTOR PACKAGE

STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD

DISPLAY MODULE AND SYSTEM APPLICATIONS

Manufacturing method of a system in package having several layers a...

EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE

SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Method of Manufacturing a Package Having an Electronic Component an...

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

Semiconductor Device and Methods of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY

SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND