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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/29characterised by the material

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,957
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Minoru Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having conductive p...
- Patent number 12,159,822
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compounds and packages for encapsulating electronic components
- Patent number 12,152,133
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Andreas Waterloo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,541
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silylated isocyanurate compound, metal corrosion inhibitor, curable...
- Patent number 12,139,634
- Issue date Nov 12, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tomoyuki Mizunashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Curable hot-melt silicone composition, cured material thereof, and...
- Patent number 12,134,697
- Issue date Nov 5, 2024
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,125,756
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmentally protected photonic integrated circuit
- Patent number 12,125,805
- Issue date Oct 22, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer system-level three-dimensional fan-out three-dimensional fan-...
- Patent number 12,119,295
- Issue date Oct 15, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing resin composition
- Patent number 12,116,479
- Issue date Oct 15, 2024
- Sumitomo Bakelite Co., Ltd.
- Jun Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, encapsulant and optical semiconductor...
- Patent number 12,110,412
- Issue date Oct 8, 2024
- DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
- Akito Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,113,029
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Tatsuto Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release film and method of manufacturing release film
- Patent number 12,112,957
- Issue date Oct 8, 2024
- KOBAYASHI & CO., LTD.
- Keisuke Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Publication number 20240421030
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240421235
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE DEVICE
- Publication number 20240413212
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTOR
- Publication number 20240413224
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240413233
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES
- Publication number 20240404903
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Anita Herzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...
- Publication number 20240400728
- Publication date Dec 5, 2024
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395649
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Chulmin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20240395773
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS
- Publication number 20240395934
- Publication date Nov 28, 2024
- The Boeing Company
- Leora Peltz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...
- Publication number 20240387343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die package with multi-lid structures and method for...

Embedded metal insulator metal structure

Package structure and method of manufacturing the same

Semiconductor device

Semiconductor device

Method of manufacturing a semiconductor package having conductive p...

Mold compounds and packages for encapsulating electronic components

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Embedded chip package and manufacturing method thereof

Through wafer trench isolation between transistors in an integrated...

Semiconductor package and manufacturing method thereof

Semiconductor device and method of forming ultra high density embed...

Semiconductor package

Silylated isocyanurate compound, metal corrosion inhibitor, curable...

Curable hot-melt silicone composition, cured material thereof, and...

Microelectronic module

Liquid resin composition for sealing and electronic component appar...

Semiconductor package

Semiconductor device

RF devices with enhanced performance and methods of forming the sam...

Interconnect structures

Environmentally protected photonic integrated circuit

Electronic device packages with internal moisture barriers

Hermetic package for high CTE mismatch

Wafer system-level three-dimensional fan-out three-dimensional fan-...

Sealing resin composition

Package having an electronic component and an encapsulant encapsula...

Curable silicone composition, encapsulant and optical semiconductor...

Semiconductor device and manufacturing method thereof

Release film and method of manufacturing release film

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

GROUP III NITRIDE DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

NANOSHEET TRANSISTOR

ON DIE FLEXURE CONTROL DEVICE AND METHOD

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DIE SHIELDING STRUCTURE

GALLIUM NITRIDE SEMICONDUCTOR DEVICE

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES

POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

REDISTRIBUTION LAYER FEATURES