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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/29characterised by the material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package module and manufacturing methods thereof
- Patent number 12,272,612
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component device
- Patent number 12,269,943
- Issue date Apr 8, 2025
- Resonac Corporation
- Yuma Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask encapsulation to prevent degradation during fabrication of hig...
- Patent number 12,266,535
- Issue date Apr 1, 2025
- Lam Researh Corporation
- Kapu Sirish Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having heterogeneous dielectric layers
- Patent number 12,266,581
- Issue date Apr 1, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,261,108
- Issue date Mar 25, 2025
- BITMAIN TECHNOLOGIES INC.
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, cured product of same and method for...
- Patent number 12,258,496
- Issue date Mar 25, 2025
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for curable resins, cured product of said composition,...
- Patent number 12,258,472
- Issue date Mar 25, 2025
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging film and preparation method thereof, and filter chip pack...
- Patent number 12,252,613
- Issue date Mar 18, 2025
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,249,548
- Issue date Mar 11, 2025
- SK Hynix Inc.
- Sang Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sheet
- Patent number 12,247,124
- Issue date Mar 11, 2025
- Lintec Corporation
- Yasutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) semiconductor device having thin substrate
- Patent number 12,243,808
- Issue date Mar 4, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Type III-V semiconductor device with structured passivation
- Patent number 12,230,700
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulant strength enhancer
- Patent number 12,218,018
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Structure with Stress-Release Pattern to Enhance Package Yield
- Publication number 20250118683
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEMT TRANSISTOR
- Publication number 20250118613
- Publication date Apr 10, 2025
- STMicroelectronics International N.V.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...
- Publication number 20250112101
- Publication date Apr 3, 2025
- LINTEC CORPORATION
- Reina KAINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20250112103
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250112129
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105078
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shunsuke SHOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20250098347
- Publication date Mar 20, 2025
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250098201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT WITH POROUS COLORANT FOR ELECTRONIC PACKAGE
- Publication number 20250096056
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Yosephine ANDRIANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096070
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096063
- Publication date Mar 20, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Seiu HIGASHIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...
- Publication number 20250089290
- Publication date Mar 13, 2025
- Soctera, Inc.
- Austin Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...
- Publication number 20250084274
- Publication date Mar 13, 2025
- Daxin Materials Corp.
- Yun-Ching WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20250084216
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250087555
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250087570
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK
- Publication number 20250079345
- Publication date Mar 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ian McCallum-Cook
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package module and manufacturing methods thereof

Metal-bump sidewall protection

Liquid resin composition for sealing and electronic component device

Mask encapsulation to prevent degradation during fabrication of hig...

Electronic substrates having heterogeneous dielectric layers

Hermetic package for high CTE mismatch

Flip chip package unit and associated packaging method

Chip heat dissipating structure, chip structure, circuit board and...

Semiconductor package having an encapulant comprising conductive fi...

Curable silicone composition, cured product of same and method for...

Composition for curable resins, cured product of said composition,...

Packaging film and preparation method thereof, and filter chip pack...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for fabricating the same

Semiconductor package and method manufacturing the same

Semiconductor device and methods of manufacture

Resin sheet

Microelectronic structures including bridges

Chip scale package (CSP) semiconductor device having thin substrate

Semiconductor package

Cured product and production method of same, and resin sheet and re...

Method of manufacturing a package having an adhesion promoter

Package structure with warpage-control element

Type III-V semiconductor device with structured passivation

Methods for registration of circuit dies and electrical interconnects

Semiconductor module and power conversion apparatus

Semiconductor encapsulant strength enhancer

Chip package structure having molding layer

Electronic device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IC Structure with Stress-Release Pattern to Enhance Package Yield

HEMT TRANSISTOR

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

SEMICONDUCTOR DEVICE AND POWER CONVERTER

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

ENCAPSULANT WITH POROUS COLORANT FOR ELECTRONIC PACKAGE

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

SEMICONDUCTOR MODULE

Inductive Heatable Particles in Semiconductor Module

SEMICONDUCTOR DEVICE

CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...

CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

DIE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK