The present disclosure relates to a heat collector, and more specifically, to a heat collector used to draw and reuse heat from electrical components.
With advances in electronics technology, modern computer components and other electrical components can operate at high speeds and frequencies, and these electrical components typically generate large amounts of heat. Additionally, such electrical components continue to decrease in size with each succeeding generation released, and it is becoming more and more difficult to effectively dissipate heat from the components using conventional means. Electrical components may frequently operate at increased temperatures, which can lead to degradation or even failure of the components or associated systems.
There are numerous kinds of heat-dissipating devices used to cool electrical components. For example, a typical heat sink device is disclosed in U.S. Pat. No. 4,884,331 issued on Dec. 5, 1989. The heat sink includes a pedestal with dissipating fins thereon. The pedestal is attached to a surface of an electrical component, and transfers heat generated from the electrical component to ambient air.
Another kind of heat-dissipating device is a heat pipe, such as that disclosed in China patent 99117239 issued on Feb. 18, 2004. The heat pipe has high heat conductive efficiency, and dissipates heat fast.
A cooling fan is another kind of heat-dissipating device. The fan is used to speed up circulation of air around electrical components, and thereby increase heat convection. A typical example is found in U.S. Pat. No. 6,745,824 issued on Jun. 8, 2004.
Other related kinds of heat-dissipating devices include heat conductive materials, such as carbon nanotubes. The heat conductive materials have high thermal conductivity, and are typically employed between an electrical component and a heat sink. The heat conductive materials are used to reduce the thermal resistance between the electrical component and the heat sink. A typical example is found in China patent application 02152003, published on Jun. 2, 2004.
All the devices mentioned above only focus on how to dissipate heat from electrical components, without properly considering how the generated heat might be reused in order to save energy and preserve the environment. What is needed, therefore, is a device that can transfer unwanted heat from an electrical component, and can collect that heat for reuse by way of, for example, transforming it to electricity or light.
Many aspects of the present heat collector can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat collector. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Hereinafter, embodiments of the present disclosure will be described. However, the scope of the present disclosure is not to be taken as being limited to the described embodiments.
Referring to
Referring to
A relative concentration distribution of the adiabatic dope 25 is shown in
The matrixes of the heat collectors 10, 20 are made from flexible materials in these embodiments, such as silver paste, silicon rubber, or non-silicon rubber. The adiabatic dope may be a polymer, a ceramic, silicon oxide and/or asbestos. Further or alternatively, the adiabatic means may take the form of a plurality of pores in the heat collectors 10, 20.
Besides being generally rectangular or cylindrical, the shape of the heat collectors 10, 20 may be, for example, prismatic, plate-shaped, generally square, or polyhedral. Each of the heat absorption surfaces 12, 22 is suitable for attachment to a heat generating surface of an electronic component (not shown). The heat collector 10, 20 transfer heat generated from the surface of the electronic component to the heat focus surfaces 11, 21. Because the relative concentration distribution of the adiabatic dope guides the heat flow from non-convergence to convergence, it is easy to collect and reuse the generated heat.
Although only the above embodiments have been described in detail, it will be apparent to those skilled in the art that various modifications are possible without departing from the inventive concepts herein. Therefore the disclosure is not limited to the above-described embodiments, but rather has a scope defined by the appended claims and allowable equivalents thereof.
Number | Date | Country | Kind |
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2004 1 0028189 | Jul 2004 | CN | national |
This patent application is continuation of application Ser. No. 11/175,772, filed on Jul. 6, 2005, now U.S. Pat. No. 7,493,943 entitled “HEAT COLLECTOR”, assigned to the same assignee, disclosure of which is incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
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4884331 | Hinshaw | Dec 1989 | A |
6411508 | Kang et al. | Jun 2002 | B1 |
6424531 | Bhatti et al. | Jul 2002 | B1 |
6735864 | Sato et al. | May 2004 | B2 |
20010051673 | Suzuki et al. | Dec 2001 | A1 |
Number | Date | Country |
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2766967 | Feb 1999 | FR |
2000294888 | Oct 2000 | JP |
Number | Date | Country | |
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20090120614 A1 | May 2009 | US |
Number | Date | Country | |
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Parent | 11175772 | Jul 2005 | US |
Child | 12354105 | US |