BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat conducting structure, and more particularly to a heat conducting structure having a heat pipe, and a manufacturing method of the heat conducting structure.
2. Description of Related Art
In general, an electronic component generates heat during its operation. As science and technology advance, the functions and performance of electronic products are enhanced, and the heat generated by the electronic products becomes increasingly larger, so that most electronic components need a heat dissipating device for controlling a working temperature to maintain normal operations of electronic components. For example, a heat pipe filled with a working fluid for conducting heat is one of the common heat conducting devices.
With reference to FIG. 1 for a conventional heat sink, the heat conducting structure 1a of the heat sink 10 comprises a heat conducting base 10a and a plurality of heat pipes 20a, wherein the heat conducting base 10a includes a plurality of ditches 11a disposed thereon, and the heat pipes 20a are substantially U-shaped and embedded into the ditches 11a. In addition, a plurality of fins 30a having through holes are sheathed onto the heat pipe 20a, such that the heat conducting base 10a is attached onto a heat-generating electronic component, and the heat sink 1a can dissipate the heat produced by the heat-generating electronic component.
In the aforementioned structure, the heat pipes 20a are embedded into the heat conducting base 10a to facilitate attaching the heat pipes 20a and combining the heat generating electronic component. However, the heat conducting base 20a not just increases the overall weight of the heat sink 1a only, but also extends the heat conduction path and retards the heat dissipation rate. Furthermore, the installation of the heat conducting base 20a also incurs a higher manufacturing cost of the heat sink 1a.
In view of the aforementioned shortcomings of the related art, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally provided a feasible solution in accordance with the present invention to overcome the shortcomings of the related art.
SUMMARY OF THE INVENTION
Therefore, it is a primary objective of the present invention to provide a heat conducting structure with a coplanar heated portion capable of reducing its overall weight and heat conduction path to lower the manufacturing cost of a heat sink and enhance the heat dissipating efficiency of the heat sink.
To achieve the foregoing objective, the present invention provides a heat conducting structure with a coplanar heated portion, comprising a plurality of heat pipes and an adhesive, wherein each heat pipe includes an evaporating section, a contact plane formed at the evaporating section, and an attaching plane formed adjacent to the contact plane, and the heat pipes are arranged adjacent with each other in a row by the contact plane, and the adhesive is coated onto and combined with the contact plane of any two adjacent heat pipes, and a flush and co-planar heated portion is formed at each attaching plane of the heat pipes.
To achieve the foregoing objective, the present invention provides a heat sink with a heat conducting structure, comprising an adhesive, a plurality of heat pipes and a plurality of fins, wherein each heat pipe includes an evaporating section and a condensing section, and a contact plane and an attaching plane adjacent to the contact plane are formed on the evaporating section, and the heat pipes are arranged in parallel with each other and disposed adjacent to the contact plane, and the adhesive is coated and coupled to the contact plane of any two adjacent heat pipes, and each attaching plane of the heat pipes has a flush and co-planar heated portion, and a plurality of fins are arranged parallel to each other in a row and passed through the condensing section of the heat pipes.
Compared with the related art, the present invention has the evaporating section formed and coupled onto the heat pipe and the contact surface coated with the adhesive, such that after the adhesive is combined with the evaporating section of the heat pipe, the heat conducting structure with a flush and co-planar heated portion is formed. Unlike the related art that embeds the heat pipe into the heat sink of the heat conducting base, the heat conduction of the heat sink in accordance with the invention no longer requires any heat conducting base, and thus the invention can reduce the heat conduction path and improve the heat conduction rate. In addition, no heat conducting base is required, and thus the overall weight and manufacturing cost of the heat sink can be reduced significantly to improve the practicability and cost-effectiveness of the present invention.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 shows a conventional heat pipe heat sink;
FIG. 2 is a flow chart of manufacturing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 3 is a schematic view showing a press module of a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 4 is a cross-sectional view of FIG. 3;
FIG. 5 is a schematic view of compressing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 5A is a partial enlarged view of a portion A of FIG. 5;
FIG. 5B is a schematic view of compressing a concave camber compression;
FIG. 6 is a schematic view of compressing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 6A is a partial enlarged view of a portion A of FIG. 6;
FIG. 7 is a schematic view of compressing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 7A is a partial enlarged view of a portion A of FIG. 7;
FIG. 8 is a schematic view of installing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 9 is a schematic view of securing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 10 is a cross-sectional view of securing a heat conducting structure with a coplanar heated portion in accordance with the present invention;
FIG. 11 is a cross-sectional view of a heat conducting structure with a coplanar heated portion in accordance with the present invention; and
FIG. 12 is a perspective view of a heat sink of a heat conducting structure with a coplanar heated portion in accordance with the present invention.
DETAILED DESCRIPTION OF THE INVENTION
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. The drawings are provided for reference and illustration only, but not intended for limiting the present invention.
With reference to FIGS. 2 to 8 for flow charts and schematic views of manufacturing a heat conducting structure with a coplanar heated portion in accordance with the present invention, a plurality of heat pipes 10, a first mold 20 and a second mold 30 are provided first (Step 100). The heat pipe 10 is U-shaped and includes an evaporating section 11 and two condensing sections 12, and the first mold 20 includes a first platform 21 and a first compression rod 22, wherein the first platform 21 of the first mold 20 can have different concave cambers 211, 211a, or a plurality of first molds 20 are used, and the different concave cambers 211, 211a are formed on the first molds 20 respectively (as show in FIGS. 5A and 5B), and the first compression rod 22 can have a concave camber 221. The second mold 30 includes a second platform 31 and a second compression rod 32, and surfaces of the second platform 31 and the second compression rod 32 are provided with planar surfaces 311, 321.
With reference to FIGS. 3 to 5 and 5A, the heat pipe 10 is placed onto the first platform 21, and the first mold 20 is used for performing a progressive compression to the evaporating section 11 of the heat pipe 10 (Step 200) to progressively form the required camber on the evaporating section 11. In this preferred embodiment, the first mold 20 includes two sets of corresponding concave cambers, such that after the first mold 20 is compressed, the first compression rod 22 and the concave cambers 221, 211 of the first platform 21 perform a compression procedure to the evaporating section 11 of the heat pipe 10 to form adjacent cambers 111˜114 on the evaporating section 11, and then other concave cambers 221a, 211a are used for performing the compression procedure to the cambers 111˜114. If the first compression rod 22 has not compressed the evaporating section 11 of the heat pipe 10, then the evaporating section 11 only has the cambers 111˜113 formed thereon.
With reference to FIGS. 6, 6A, 7 and 7A, the heat pipe 10 compressed progressively by the first mold 20 is placed onto the second platform 31 in the second mold 30, and the second mold 30 is used for compressing the cambers 111˜114 of the evaporating section 11 of the heat pipe 10 (Step 300), wherein a contact surface of the second platform 31 of the second mold 30 and the evaporating section 11 is a planar surface 311, and a contact surface of the second compression rod 32 and the evaporating section 11 of the heat pipe 10 is also a planar surface 321. In this preferred embodiment, the second mold 30 includes two sets of opposite planar surfaces, such that after the second mold 30 is compressed, the planar surfaces 321, 311 of the second compression rod 32 and the second platform 31 can be used for compressing the evaporating section 11 of the heat pipe 10, and the cambers 111˜114 form two sets of planes perpendicular to each other, and the compressed evaporating section 11′ having a rectangular cross-section includes two contact planes 112′, 114′ and two attaching planes 111′, 113′ perpendicular to the two contact planes 112′, 114′. If the second mold 30 just compresses the cambers 111˜113, the evaporating section 11′ of the heat pipe 10 has a cross-section substantially in the shape of D.
After the evaporating section 11 of the heat pipe 10 is compressed by the first mold 20 and the second mold 30, the required shape is achieved after the following connection. The remaining heat pipes 10 go through the same process as described above to produce a heat conducting structure with a predetermined quantity of connected heat pipes 10.
With reference to FIGS. 8 to 11 for schematic views of connecting an evaporating section of a heat pipe in accordance with the present invention, an adhesive 50 is coated onto the contact planes 112′, 114′ of any two adjacent heat pipes 10 according to the required quantity of heat pipes 10 (Step 400), wherein the adhesive 50 is a heat conducting adhesive.
Each contact plane 112′, 114′ of the heat pipes 10 is put into a tool 40 having a plurality of through holes 400, and the evaporating section 11′ of the heat pipe 10 is disposed on a base 401 of the tool 40, and the contact planes 112′, 114′ are preliminarily coupled by the adhesive 50, and then a press board 41 and a clamp board 42 having a compression plane 411 and a clamping plane 421 are provided for compressing and positioning the evaporating section 11′ of the heat pipe 10 (Step 500), and then a C-shaped clamp 43 is used for fixing the press board 41. After the adhesive 50 is solidified to combine the evaporating section 11′ of the heat pipe 10, the heat pipes 10 can be removed from the tool 40.
With reference to FIG. 11 for a partial cross-sectional view of a heat conducting structure with a coplanar heated portion in accordance with the present invention, after the tool 40 is positioned, the evaporating sections 11′ of the heat pipes 10 are arranged adjacent to each other in a row by the contact surfaces 112′, 114′, and the attaching plane 113′ of the evaporating section 11′ of the heat pipes 10 is flush to form a co-planar heated portion 1130 for attaching a heat generating electronic component (not shown in the figure). In addition, an attaching plane 113′ of the evaporating section 11′ of the heat pipes 10 is also flush and co-planar to form a holding section 1110 provided for clamping a fixing element (not shown in the figure) to be fixed onto the heat generating electronic component.
With reference to FIG. 12 for a heat sink of a heat conducting structure with a coplanar heated portion, the condensing section 12 of the heat pipes 10 is installed separately and has a circular cross-section, and a plurality of fins 60 are passed and disposed onto the condensing sections 12 to form a heat sink 1.
The present invention is illustrated with reference to the preferred embodiment and not intended to limit the patent scope of the present invention. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Patent Application
20130098584
