Patent Application
20230047466
The technical field of this disclosure relates to a heat conduction element, and more particularly to a heat conduction device with an inner loop.
The related-art heat conduction elements such as heat pipes, vapor chambers, etc., that use an internal vacuum chamber to seal a working fluid and cause the working fluid to generate a vapor-liquid phase transition by heating or condensing are widely used for heat dissipation. Since the vapor chamber (also known as uniform temperature plate) has a large area attached to a heat source, the vapor chamber is often used as a heated portion attached to the heat source and combined with the heat pipe, and the heat pipe can erectly communicate with the vapor chamber, so that after the working fluid in the vapor chamber is vaporized and flows into the heat pipe for condensation, the condensed and liquefied working fluid is returned to the vapor chamber to achieve the purpose of circulating the working fluid for heat exchange.
However, the heat pipe itself is a tubular body. Although the end port is connected to a surface of the vapor chamber and communicates with the vapor chamber, that also indicates that the communication between the heat pipe and the vapor chamber is achieved through the end port only. Therefore, the heated and vaporized working fluid and the condensed and liquefied working fluid flow in opposite directions and both have to pass through the end port. At the aforementioned end port, the vaporized working fluid and the condensed and liquefied working fluid conflict with each other and the heat exchange efficiency is affected. Furthermore, if the liquid-state working fluid cannot flow back into the vapor chamber, it is easy to cause dry burning of the heated vapor chamber, so that the original heat conduction and heat exchange performance cannot be maintained anymore.
In view of the aforementioned drawbacks of the related-art heat conduction elements, the discloser of this disclosure based on years of experience in the related industry to conduct extensive research and experiment, and finally provided a feasible solution as disclosed in this disclosure to overcome the drawbacks of the related art.
Therefore, it is a primary objective of this disclosure to provide a heat conduction device with an inner loop which is designed with inner and outer pipes and formed by combining a vapor chamber and a heat pipe, and the inner loop may avoid the conflict of the flowing directions of the vaporized working fluid and the liquid-state working fluid to achieve a smoother circulation of the working fluid for heat exchange.
To achieve the aforementioned and other objectives, this disclosure discloses a heat conduction device with an inner loop, the heat conduction device including: a vapor chamber having a first board and a second board covering each other to form an internal hollow space, and the second board having at least one hole edge formed thereon; and at least one heat pipe, including an outer pipe, and an inner pipe passing the outer pipe, and one end of the outer pipe being closed, and the other end of the outer pipe being open and communicating with the hole edge, and two ends of the inner pipe being open, and one end of the inner pipe communicating with the interior of the vapor chamber through the hole edge and the other end of the inner pipe extended along the axial direction of the outer pipe to form at least one port, and the port being provided for communicating the closed end of the outer pipe with the inner pipe; wherein, the inner pipe is disposed inside the outer pipe to form a gap annularly, and the port communicates with the gap, so that the vapor chamber and the heat pipe have an inner loop that communicates the interior of the vapor chamber with a lower end of the inner pipe, and communicates the port with the interior of the outer pipe through the interior of the inner pipe, and then communicates to the interior of the vapor chamber through the gap.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
With reference to
The vapor chamber 1 has a first board 10 and a second board 11 that cover each other to form an internal hollow space. In an embodiment of the present disclosure, the first board 10 has an accommodating portion 100 concavely formed on the first board 10 and provided for the second board 11 to cover to form the internal hollow space. In addition, the vapor chamber 1 also contains a capillary structure 12, and a plurality of support structure 13 for providing a support between the first board 10 and the second board 11. The capillary structure 12 is formed by woven mesh or powder sintering, and the support structure 13 is formed by powder sintering. If both of the capillary structure 12 and the support structure 13 are formed by powder sintering, the two may be sintered in a one-piece form.
Both of the first and second boards 10, 11 have a degassing part 101, 111 extended out from a side of the first and second boards 10, 11 separately. After the first and second boards 10, 11 cover each other, a degassing port 101a is reserved and provided for a degassing operation after the first and second boards 10, 11 are sealed, and the degassing parts 101, 111 may be sealed and laminated after the degassing operation, or the degassing parts 101, 111 may be cut off or removed depending on the needs.
In
In the present disclosure as shown in
With the aforementioned structure and assembly, the heat conduction device with the inner loop of the present disclosure is accomplished.
In
In addition, the present disclosure further has a groove 200 formed on the inner wall of the outer pipe 20 of the heat pipe 2 and extended along the axial direction, and a capillary ring 22 installed between the outer pipe 20 and the lower end of the inner pipe 21. The capillary ring 22 is formed by powder sintering and combined between the groove 200 in the lower end of the outer pipe 20 and the outer wall of the lower end of the inner pipe 21. In addition to providing a fixed combination of the outer pipe 20 and the inner pipe 21, the capillary ring 22 is mainly used for collecting the liquid-state working fluid that passes through the gap 220 and flows back into the capillary ring 22 and then into the vapor chamber 1. The inner wall of the inner pipe 21 may be a smooth pipe wall, and the outer wall may add a capillary structure (not shown in the figure) such as a groove, if necessary.
In summation of the description above, this disclosure surely achieves the expected objective of use, and overcomes the drawbacks of the related art. While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
