Patent Application
20060175046
The present invention relates to a heat dispensing device, and more particularly, to a heat dispensing device for cooling a heat source such as a CPU of a computer.
A central processing unit (CPU) generates a heat due to high speed operation to thus cause high temperature which could damage the CPU so that a heat dispensing device cooperated with a fan is equipped to remove the heat from the CPU. Except for increasing length of a heat dispensing device, to have multiple fins “c” on the surface of a tubular body “a” of a dispensing device is a common way to increase the efficiency for dispensing heat as shown in
The fins “c” are attached with the tubular body “a” by an adhesive “d” or a soldering agent so that the heat of a heat source “b” is dispensed outward by the fins “c”. Using the adhesive “d” or the soldering agent to connect the fins “c” to the tubular body “a” is a main stream for the conventional heat dispensing devices. However, due to the limited heat dispensing effect of the adhesive “d” or the soldering agent, the dispensing device has less efficiency for dispensing heat. Even efforts are made to improve the contents or formula of the adhesive “d” or the soldering agent; the heat cannot completely or satisfactorily be removed from the heat source “b” by the fins “c”.
It is a main objective of the present invention to provide a heat dispensing device which includes integral fins on the body of the dispensing device without using any adhesive or soldering agent so as to increase the area for dispensing heat from a heat source and obtain the optimal efficiency of heat removal.
In order to achieve the objective mentioned above, the heat dispensing device of the present invention includes a tubular body which has a contact end and a dispensing end which includes a plurality of fins so that a heat from the contact end is passed quickly to the dispensing end to obtain a satisfactory efficiency of dispensing heat.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings, which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
Referring to FIGS. 1 to 3, a heat dispensing device of the present invention comprises a tubular body 1 which has a contact end 11 and a dispensing end 12. A plurality of curve fins 2 is integrally connected to the outside of the dispensing end 12.
When the contact end 11 is in contact with a heat source 3 (or die), the high temperature of the heat source 3 is passed through the contact end 11 of the body tubular 1 and conducted to the dispensing end 12.
In practice, the tubular body 1 made of a material with highly heat conductivity, such as silver, is prepared, and a plurality of curve fins 2 is made on the outside surface of the dispensing end 12 of the tubular body 1 with one step of machining, such as by the way of chip formation or molding process. The fins 2 are made to have the same curvature and located at equal distance from each other. When the dispensing end 12 is put on the heat source 3 such as a CPU, the heat of the heat source 3 is transferred and conducted toward the dispending end 12 via the area of the contact end 11 of the tubular body 1. The heat is dispensed out from the fins 2 on the dispensing end 12. Furthermore, due to a certain distance between the dispensing end 12 and the heat source 3, the heat could dispense out from the tubular body 1 so that the temperature of the heat source 3 will not increase.
As shown in
As shown in
Furthermore, although the drawings do not disclose, the tubular body 1 can use a vacuum pipe except having working fluid therein that better heat dissipating is obtained.
Accordingly, the main character of the present invention is that the fins 2 are made directly on the outside of the dispensing end 12 by the way of chip formation, molding process, or any known one-step machining method to increase the area for dispensing heat. The fins 2 need no adhesive or soldering agent which has lower efficiency for conducting heat to attach with the tubular body. The heat dispensing device of the present invention thus has simple structure and is easily manufactured. The heat can be quickly and directly conducted to the dispensing end 12 without any obstructions such as the adhesive or soldering agent, so that the heat dispensing efficiency is improved.
While we have shown and described the embodiments in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
