1. Field of the Invention
The present invention relates to an air cooling system or a water cooling system, and more particularly to a heat dissipating apparatus applied in a computer motherboard for simultaneously dissipating the heat of each heat-generating electronic component on the motherboard, and a water cooling system having the heat dissipating apparatus.
2. Description of Prior Art
Since the technology and science related industry is developed rapidly and the functions of different heat-generating electronic components on a computer motherboard and its VGA card are enhanced, therefore a considerable amount of heat is produced in their operation. A heat sink or a heat dissipating apparatus corresponding to each of the aforementioned heat-generating electronic components is provided, and particularly, a central processing unit (CPU) generally adopts a water cooling circulation heat dissipating system to maintain a normal operation in an allowable temperature range.
In the past, a plurality of water blocks are installed on each heat-generating electronic component for the convenience of integration, and each water block is connected to a pipeline for the distribution of a coolant liquid and connected to a heat dissipating structure such as a pump and a plurality of fins to form a water cooling circulation system. The pump drives the coolant liquid to flow in each water block for a heat exchange, so as to achieve the heat dissipating effect of a plurality of heat-generating electronic components.
If a heat dissipation system for CPU is installed according to user's requirements in the DIY market and the CPU comes with a better performance, the corresponding heat sink or heat dissipating apparatus will have an increasingly higher demand on the heat dissipation performance. In addition to CPU, a computer motherboard also has other heat-generating electronic components such as Northbridge, Southbridge, MOSFET, and VGA chips. These heat-generating electronic components may bundle an air cooling heat sink or an air cooling heat dissipating apparatus. For single heat sources, the heat sources may be able to share the same set of water cooling heat dissipation system of the aforementioned heat-generating electronic components. For a plurality of heat sources, air cooling and water cooling systems cannot be integrated according to actual user requirements.
In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct experiments and modifications, and finally developed a heat dissipating apparatus and a water cooling system having the heat dissipating apparatus in accordance with the present invention to overcome the shortcomings of the prior art.
Therefore, the present invention is to provide a heat dissipating apparatus and a water cooling system having the same, wherein the optional water cooling system purchased by a user is integrated with a heat dissipating apparatus corresponding to the actual required heat dissipating system of the CPU or a heat sink of other corresponding heat-generating electronic components on the motherboard. The invention not only solves the heat dissipation problem of each heat-generating electronic component on the computer motherboard, but also provides a standalone use to meet the requirements of the DIY market.
The present invention provides a heat dissipating apparatus, comprising a heat conducting base, a heat dissipating structure and a water block, and the heat dissipating structure includes a heat pipe and a plurality of fins. The heat pipe has a first end and a second end, and the first end is connected to the heat conducting base for conducting heat, and the second end is connected in series with each fin. The water block includes a hollow base, and two connectors disposed on and interconnected to two positions of the base are attached onto heated ends of the heat pipe for conducting heat. The two connectors are extended outward from the lateral directions, and connected with a water cooling system. Alternatively, the heat dissipating apparatus can be used as a standalone device without connecting in series with the water cooling system for the air cooling heat dissipation.
The present invention provides a water cooling system connected with the aforementioned heat dissipating apparatus and comprises a water cooling radiator, a water tank and a pump connected in parallel with each other by a plurality of pipelines to constitute a circulation loop.
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. The drawings are provided for reference and illustration only, but not intended for limiting the present invention.
Referring to
The heat conducting base 10 is made of a material with a good thermal conductivity such as copper or aluminum, and attached onto a heat-generating electronic component 30 (as shown in
The heat dissipating structure 12 is connected to the aforementioned heat conducting base 10 for conducting the heat of the heat-generating electronic component 30 absorbed by the heat conducting base 10 to the heat dissipating structure 12 for dissipating the heat. In this embodiment of the invention, the heat dissipating structure 12 includes a heat pipe 12 and a plurality of fins 121 connected in series with the heat pipe 120, wherein the heat pipe 120 has a first end 122 and a second end 123, and the first end 122 is provided for receiving heat and it can be in a flat shape and connected to the heat conducting base 10 for conducting heat to heat up the flat bottom, and the second end 123 is provided for cooling and condensation and can be connected in series with each fin. In this embodiment, the first ends 122 of the two heat pipes 120 are arranged in parallel with each other, so that the second ends 123 are situated horizontally in both lateral directions to constitute a circular arrangement, and the fins 121 can be arranged along the second end 123 with an interval apart from each other into a sector shape.
To retain the aforementioned heat dissipating structure 12, a tray 11 is installed between the heat conducting base 10 and the heat dissipating structure 12. Referring to
The fan 13 can be a centrifugal fan installed at the center of a sector arrangement of the fins 121 for assisting the heat dissipating structure 12 to dissipate heat by an air cooling method, and the actual situation of the required heat dissipation effect determines whether or not it is necessary to install the fan 13.
The water block 14 is provided for users to connect the heat dissipating apparatus 1 in series with a water cooling system 2 (as shown in
If the water cooling system 2 is not connected in series as shown in
Referring to
It is worthy to point out that the heat dissipating apparatus 1 for dissipating heat by the air cooling method only is integrated with the water cooling system 2, and then both apparatus 1 and system 2 can provide the heat dissipation effect for the heat-generating electronic components 30, such that if any one of the two fails or breaks down, the other can still provide the heat dissipation effect for the heat-generating electronic components 30 and maintain a normal operation. The invention can prevent damages or adverse effects if a heat-generating electronic components 30 loses one of its heat dissipating functions.
The present invention is illustrated with reference to the preferred embodiment and not intended to limit the patent scope of the present invention. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.