Patent Application
20130228310
1. Field of the Invention
The present invention relates to a heat-dissipating base structure and a method for manufacturing the same, and in particular to a heat-dissipating base structure which has a reduced weight and cost and a method for manufacturing the same.
2. Description of Prior Art
With the advancement of technology in the electronic industry, the volume of each chip (such as a central processor) is decreased. However, in order to make each chip to process more data, several times of electronic elements can be mounted in a chip of the same volume than before. When there are more electronic elements in a chip, the amount of heat generated during the operation of the electronic elements gets greater. For example, the heat generated during the operation of a central processor may burn down the whole central processor. Thus, it is an important issue to provide a heat-dissipating device for various chips.
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According to the above, the conventional heat-dissipating base structure has the following problems: (i) larger weight, and (ii) higher cost.
Therefore, the present Inventor and those skilled in this industry aim to solve the problems in prior art.
In order to solve the above problems, an objective of the present invention is to provide a heat-dissipating base structure made of polymeric materials to reduce its weight.
Another objective of the present invention is to provide a method for manufacturing a heat-dissipating base structure which is made of polymeric materials to reduce its weight.
In order to achieve the above objective, the present invention is to provide a heat-dissipating base structure, including a base and at least one heat pipe. The base is made of polymeric materials. One side of the base is provided with at least one trough. The trough has an open side and a closed side. The heat pipe is fixed in the trough. One side of the heat pipe is in flush with the open side.
The present invention further provides a method for manufacturing a heat-dissipating base structure, including steps of:
providing a base and at least one heat pipe, the base having at least one trough and made of polymeric materials; and
disposing the heat pipe in the trough, and applying a force to make the heat pipe to be in flush with one side surface of the base.
According to the heat-dissipating base of the present invention and the method for manufacturing the same, the base is made of polymeric materials, so that the weight and the production cost of the heat-dissipating base structure can be reduced greatly.
The above objectives and structural and functional features of the present invention will be described in more detail with reference to preferred embodiment thereof shown in the accompanying drawings
One side of the base 20 is provided with at least one trough 201. The trough 201 has an open side 2011 and a closed side 2012. The heat pipe 21 is fixedly provided in the trough 201 in such a manner that one side of the heat pipe 21 is in flush with the open side 2011.
The heat pipe 21 and the base are in a tight fit by a machining process. The heat pipe 21 is in flush with the open side 2011. The machining process may be achieved by a punching process.
With the combination of the base 20 made of polymeric materials and the heat pipe 21, the weight of the heat-dissipating base structure 2 can be decreased greatly. Further, the problem that the conventional heat-dissipating base structure made of metallic materials has a larger cost can be solved.
Since the heat pipe 21 is bonded to the base 20 made of polymeric materials, the weight of the heat-dissipating base structure 2 can be decreased greatly, and the cost thereof can be also reduced.
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Step S1: providing a base and at least one heat pipe, the base having at least one trough and made of polymeric materials.
In the step S1, a base 20 and at least heat pipe 21 are provided. The base 20 is provided with at least one trough 201 and made of polymeric materials. The polymeric materials may be any one of plastics, rubbers or plastic compounds.
Step S2: disposing the heat pipe in the trough, and applying a force to make the heat pipe to be in flush with one side surface of the base.
In the step S2, the heat pipe 21 is disposed in the trough 201. A force is applied to the heat pipe 21, so that the heat pipe 21 is in flush with one side surface of the base 20. The heat pipe 21 and the base 20 are in a tight fit by a machining process such as a punching process.
By the method of present invention, the base 20 made of polymeric materials can be tightly combined with the heat pipe 21. Not only the weight of the heat-dissipating structure 2 can be decreased greatly, but also the cost of heat-dissipating base structure 2 of the present invention is cheaper than that of the conventional heat-dissipating base structure made of metallic materials.
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According to the above, the present invention has the following advantageous features: (I) smaller weight; and (II) lower cost.
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof.
Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
